DE69612930D1 - Verfahren und Vorrichtung für die Reinigung von Werkstücken - Google Patents

Verfahren und Vorrichtung für die Reinigung von Werkstücken

Info

Publication number
DE69612930D1
DE69612930D1 DE69612930T DE69612930T DE69612930D1 DE 69612930 D1 DE69612930 D1 DE 69612930D1 DE 69612930 T DE69612930 T DE 69612930T DE 69612930 T DE69612930 T DE 69612930T DE 69612930 D1 DE69612930 D1 DE 69612930D1
Authority
DE
Germany
Prior art keywords
cleaning workpieces
workpieces
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69612930T
Other languages
English (en)
Other versions
DE69612930T2 (de
Inventor
Tashiro Maekawa
Satomi Hamada
Koji Ono
Atsushi Shigeta
Masako Kodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Publication of DE69612930D1 publication Critical patent/DE69612930D1/de
Application granted granted Critical
Publication of DE69612930T2 publication Critical patent/DE69612930T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools, brushes, or analogous members
    • B08B1/32—
    • B08B1/50—
    • B08B1/52—
    • B08B1/54—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
DE69612930T 1995-09-20 1996-09-19 Verfahren und Vorrichtung für die Reinigung von Werkstücken Expired - Lifetime DE69612930T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26639595A JP3447869B2 (ja) 1995-09-20 1995-09-20 洗浄方法及び装置

Publications (2)

Publication Number Publication Date
DE69612930D1 true DE69612930D1 (de) 2001-06-28
DE69612930T2 DE69612930T2 (de) 2002-03-28

Family

ID=17430343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69612930T Expired - Lifetime DE69612930T2 (de) 1995-09-20 1996-09-19 Verfahren und Vorrichtung für die Reinigung von Werkstücken

Country Status (5)

Country Link
US (1) US5860181A (de)
EP (1) EP0764478B1 (de)
JP (1) JP3447869B2 (de)
KR (1) KR100412542B1 (de)
DE (1) DE69612930T2 (de)

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JP3540524B2 (ja) * 1996-10-28 2004-07-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US6079073A (en) * 1997-04-01 2000-06-27 Ebara Corporation Washing installation including plural washers
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
JP3641349B2 (ja) * 1997-05-19 2005-04-20 株式会社荏原製作所 洗浄装置
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6059888A (en) * 1997-11-14 2000-05-09 Creative Design Corporation Wafer cleaning system
US5954888A (en) * 1998-02-09 1999-09-21 Speedfam Corporation Post-CMP wet-HF cleaning station
US6308361B1 (en) 1998-07-28 2001-10-30 Ebara Corporation Cleaning apparatus
US6156659A (en) * 1998-11-19 2000-12-05 Chartered Semiconductor Manufacturing Ltd. Linear CMP tool design with closed loop slurry distribution
US6248009B1 (en) 1999-02-18 2001-06-19 Ebara Corporation Apparatus for cleaning substrate
US6120350A (en) * 1999-03-31 2000-09-19 Memc Electronic Materials, Inc. Process for reconditioning polishing pads
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6827816B1 (en) * 1999-12-16 2004-12-07 Applied Materials, Inc. In situ module for particle removal from solid-state surfaces
US6427566B1 (en) * 2000-03-31 2002-08-06 Lam Research Corporation Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
WO2001084621A1 (en) * 2000-04-27 2001-11-08 Ebara Corporation Rotation holding device and semiconductor substrate processing device
US6418584B1 (en) 2000-05-24 2002-07-16 Speedfam-Ipec Corporation Apparatus and process for cleaning a work piece
CN1395515A (zh) * 2000-11-22 2003-02-05 应用材料公司 从固态表面除去粒子的原地模块
US6461441B1 (en) * 2001-05-09 2002-10-08 Speedfam-Ipec Corporation Method of removing debris from cleaning pads in work piece cleaning equipment
US6530103B2 (en) * 2001-06-21 2003-03-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for eliminating wafer breakage during wafer transfer by a vacuum pad
JP4588929B2 (ja) * 2001-06-29 2010-12-01 芝浦メカトロニクス株式会社 基板の洗浄ツール及び基板の処理装置
KR20020041364A (ko) * 2002-04-03 2002-06-01 (주)영원테크 액정유리기판의 이물질 제거 및 세정장치
JP4432448B2 (ja) * 2002-10-25 2010-03-17 セイコーエプソン株式会社 スクラブ洗浄方法、スクラブ洗浄装置
US6916233B2 (en) * 2002-11-28 2005-07-12 Tsc Corporation Polishing and cleaning compound device
US6733596B1 (en) * 2002-12-23 2004-05-11 Lam Research Corporation Substrate cleaning brush preparation sequence, method, and system
US20050026455A1 (en) * 2003-05-30 2005-02-03 Satomi Hamada Substrate processing apparatus and substrate processing method
US20050048768A1 (en) * 2003-08-26 2005-03-03 Hiroaki Inoue Apparatus and method for forming interconnects
JP2005144298A (ja) * 2003-11-13 2005-06-09 Seiko Epson Corp 表面洗浄改質方法及び表面洗浄改質装置
US20070034232A1 (en) * 2004-04-12 2007-02-15 Daniel Diotte Compact disc buffer system
TW200603089A (en) * 2004-07-14 2006-01-16 Lite On It Corp Load roller device attached with cleaning means
WO2006035624A1 (en) * 2004-09-28 2006-04-06 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
US20070251035A1 (en) * 2006-05-01 2007-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Cleaning device
US9202725B2 (en) * 2006-07-24 2015-12-01 Planar Semiconductor, Inc. Holding and rotary driving mechanism for flat objects
KR100809594B1 (ko) * 2006-09-12 2008-03-04 세메스 주식회사 척킹부재 및 이를 포함하는 스핀헤드
US9130002B2 (en) * 2010-05-07 2015-09-08 Lam Research Ag Device for holding wafer shaped articles
DE102011078617A1 (de) * 2011-07-04 2013-01-10 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Vorrichtung und Verfahren zur Reinigung von Ab- und Anlagerungen an einer Endplatte eines Sensorkörpers
CN103028560A (zh) * 2011-10-10 2013-04-10 光达光电设备科技（嘉兴）有限公司 喷淋头清洗装置
JP6113960B2 (ja) 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
JP5973208B2 (ja) * 2012-03-30 2016-08-23 Hoya株式会社 基板の製造方法、マスクブランクの製造方法、転写用マスクの製造方法、および反射型マスクの製造方法
US9754622B2 (en) 2014-03-07 2017-09-05 Venmill Industries Incorporated Methods for optimizing friction between a pad and a disc in an optical disc restoration device
US9620166B2 (en) 2012-05-18 2017-04-11 Venmill Industries Methods for restoring optical discs
JP6297308B2 (ja) * 2012-12-06 2018-03-20 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
KR102203498B1 (ko) 2013-01-31 2021-01-15 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 평탄화후 기판 클리닝을 위한 방법 및 장치
US9211568B2 (en) * 2013-03-12 2015-12-15 Taiwan Semiconductor Manufacturing Company Limited Clean function for semiconductor wafer scrubber
JP6145334B2 (ja) 2013-06-28 2017-06-07 株式会社荏原製作所 基板処理装置
US10229842B2 (en) * 2013-07-26 2019-03-12 Applied Materials, Inc. Double sided buff module for post CMP cleaning
CN105722641B (zh) * 2013-10-25 2019-05-28 应用材料公司 用于化学机械平坦化后的基板抛光预清洁的系统、方法和装置
KR20150075357A (ko) 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
JP6412385B2 (ja) * 2014-09-25 2018-10-24 株式会社荏原製作所 コンディショニング部、バフ処理モジュール、基板処理装置、及び、ドレスリンス方法
US9700988B2 (en) 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
JP6348028B2 (ja) * 2014-09-11 2018-06-27 株式会社荏原製作所 基板処理装置
SG10201508119XA (en) 2014-10-03 2016-05-30 Ebara Corp Substrate processing apparatus and processing method
SG10201601095UA (en) 2015-02-18 2016-09-29 Ebara Corp Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus
JP6183720B2 (ja) * 2015-04-10 2017-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN106040627A (zh) * 2015-04-17 2016-10-26 光全球半导体有限公司 晶片清洁方法和用于该方法中的晶片清洁装置
CN106272075B (zh) * 2015-05-22 2019-05-31 中芯国际集成电路制造(上海)有限公司 研磨垫修整装置及研磨垫修整方法
JP6659332B2 (ja) 2015-12-07 2020-03-04 株式会社荏原製作所 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
CN106944381A (zh) * 2016-01-06 2017-07-14 中芯国际集成电路制造(上海)有限公司 晶圆清洗装置及其清洗方法
JP6641197B2 (ja) 2016-03-10 2020-02-05 株式会社荏原製作所 基板の研磨装置および研磨方法
CN108885985B (zh) * 2016-03-22 2023-07-07 东京毅力科创株式会社 基片清洗装置
JP6672207B2 (ja) * 2016-07-14 2020-03-25 株式会社荏原製作所 基板の表面を研磨する装置および方法
JP6751634B2 (ja) 2016-09-21 2020-09-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6750582B2 (ja) * 2017-08-23 2020-09-02 株式会社Sumco チャックテーブルの洗浄装置および該洗浄装置を備える研削装置
JP7137941B2 (ja) * 2018-03-15 2022-09-15 株式会社荏原製作所 基板洗浄装置、及び基板洗浄方法
CN109092746A (zh) * 2018-08-17 2018-12-28 天马（安徽）国药科技股份有限公司 一种中药材粉碎机全方位清洗装置
DE102018128269A1 (de) * 2018-11-12 2020-05-14 Monti-Werkzeuge Gmbh Verfahren zur Bearbeitung einer Oberfläche eines Werkstückes
WO2020112852A1 (en) * 2018-11-29 2020-06-04 Board Of Regents, The University Of Texas System Devices, systems and methods for cleaning of elongated instrument surface
CN109482538A (zh) * 2018-12-10 2019-03-19 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶圆洗刷装置
JP7161418B2 (ja) 2019-01-30 2022-10-26 株式会社荏原製作所 基板洗浄装置、基板処理装置、洗浄部材のセルフクリーニング方法
KR102644399B1 (ko) * 2019-06-05 2024-03-08 주식회사 케이씨텍 기판 처리 장치
JP7328094B2 (ja) * 2019-09-13 2023-08-16 株式会社ディスコ 洗浄装置
CN112493953A (zh) * 2019-09-13 2021-03-16 宁波德润堂智能科技有限公司 带甩干桶的清洁工具
US11013399B1 (en) * 2020-01-27 2021-05-25 Board Of Regents, The University Of Texas System Wiper assembly for imaging element cleaning apparatus
JP2022190831A (ja) 2021-06-15 2022-12-27 株式会社荏原製作所 基板洗浄装置、基板処理装置、ブレークイン装置、基板に付着する微粒子数の推定方法、基板洗浄部材の汚染度合い判定方法およびブレークイン処理の判定方法

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Also Published As

Publication number Publication date
EP0764478B1 (de) 2001-05-23
KR970018173A (ko) 1997-04-30
JP3447869B2 (ja) 2003-09-16
EP0764478A1 (de) 1997-03-26
JPH0992633A (ja) 1997-04-04
KR100412542B1 (ko) 2004-05-31
US5860181A (en) 1999-01-19
DE69612930T2 (de) 2002-03-28

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