DE69618437D1 - Verfahren und Vorrichtung zum Polieren von Werkstücken - Google Patents
Verfahren und Vorrichtung zum Polieren von WerkstückenInfo
- Publication number
- DE69618437D1 DE69618437D1 DE69618437T DE69618437T DE69618437D1 DE 69618437 D1 DE69618437 D1 DE 69618437D1 DE 69618437 T DE69618437 T DE 69618437T DE 69618437 T DE69618437 T DE 69618437T DE 69618437 D1 DE69618437 D1 DE 69618437D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing workpieces
- workpieces
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5405596 | 1996-02-16 | ||
JP17173596 | 1996-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69618437D1 true DE69618437D1 (de) | 2002-02-14 |
DE69618437T2 DE69618437T2 (de) | 2002-08-29 |
Family
ID=26394800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69618437T Expired - Lifetime DE69618437T2 (de) | 1996-02-16 | 1996-10-09 | Verfahren und Vorrichtung zum Polieren von Werkstücken |
Country Status (4)
Country | Link |
---|---|
US (2) | US5916412A (de) |
EP (2) | EP1151824A1 (de) |
KR (1) | KR100485002B1 (de) |
DE (1) | DE69618437T2 (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6024630A (en) | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
JP3724869B2 (ja) * | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | ポリッシング装置および方法 |
US6139428A (en) * | 1996-12-17 | 2000-10-31 | Vsli Technology, Inc. | Conditioning ring for use in a chemical mechanical polishing machine |
JPH10230455A (ja) * | 1997-02-17 | 1998-09-02 | Nec Corp | 研磨装置 |
KR100538540B1 (ko) | 1997-04-08 | 2006-06-16 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
US6196904B1 (en) | 1998-03-25 | 2001-03-06 | Ebara Corporation | Polishing apparatus |
US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
US6106379A (en) * | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
US6251215B1 (en) | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
US5993293A (en) * | 1998-06-17 | 1999-11-30 | Speedram Corporation | Method and apparatus for improved semiconductor wafer polishing |
US6102779A (en) * | 1998-06-17 | 2000-08-15 | Speedfam-Ipec, Inc. | Method and apparatus for improved semiconductor wafer polishing |
US6386957B1 (en) * | 1998-10-30 | 2002-05-14 | Shin-Etsu Handotai Co., Ltd. | Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus |
US6220930B1 (en) * | 1998-11-03 | 2001-04-24 | United Microelectronics Corp. | Wafer polishing head |
US6283828B1 (en) * | 1998-11-09 | 2001-09-04 | Tokyo Seimitsu Co., Ltd. | Wafer polishing apparatus |
US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
JP2001121411A (ja) | 1999-10-29 | 2001-05-08 | Applied Materials Inc | ウェハー研磨装置 |
US6517422B2 (en) * | 2000-03-07 | 2003-02-11 | Toshiba Ceramics Co., Ltd. | Polishing apparatus and method thereof |
JP2001298006A (ja) | 2000-04-17 | 2001-10-26 | Ebara Corp | 研磨装置 |
US6602114B1 (en) | 2000-05-19 | 2003-08-05 | Applied Materials Inc. | Multilayer retaining ring for chemical mechanical polishing |
US7255637B2 (en) | 2000-09-08 | 2007-08-14 | Applied Materials, Inc. | Carrier head vibration damping |
US7497767B2 (en) * | 2000-09-08 | 2009-03-03 | Applied Materials, Inc. | Vibration damping during chemical mechanical polishing |
US6676497B1 (en) | 2000-09-08 | 2004-01-13 | Applied Materials Inc. | Vibration damping in a chemical mechanical polishing system |
US6848980B2 (en) | 2001-10-10 | 2005-02-01 | Applied Materials, Inc. | Vibration damping in a carrier head |
US6447368B1 (en) | 2000-11-20 | 2002-09-10 | Speedfam-Ipec Corporation | Carriers with concentric balloons supporting a diaphragm |
US6468131B1 (en) | 2000-11-28 | 2002-10-22 | Speedfam-Ipec Corporation | Method to mathematically characterize a multizone carrier |
US6582277B2 (en) | 2001-05-01 | 2003-06-24 | Speedfam-Ipec Corporation | Method for controlling a process in a multi-zonal apparatus |
KR100939096B1 (ko) * | 2001-05-29 | 2010-01-28 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템 |
US8512580B2 (en) * | 2001-09-21 | 2013-08-20 | Lg Display Co., Ltd. | Method of fabricating thin liquid crystal display device |
US6835125B1 (en) | 2001-12-27 | 2004-12-28 | Applied Materials Inc. | Retainer with a wear surface for chemical mechanical polishing |
US6890249B1 (en) | 2001-12-27 | 2005-05-10 | Applied Materials, Inc. | Carrier head with edge load retaining ring |
US6872130B1 (en) | 2001-12-28 | 2005-03-29 | Applied Materials Inc. | Carrier head with non-contact retainer |
US6461965B1 (en) * | 2002-01-31 | 2002-10-08 | Texas Instruments Incorporated | Method for effecting a finishing operation on a semiconductor workpiece |
US6739958B2 (en) | 2002-03-19 | 2004-05-25 | Applied Materials Inc. | Carrier head with a vibration reduction feature for a chemical mechanical polishing system |
US6790123B2 (en) | 2002-05-16 | 2004-09-14 | Speedfam-Ipec Corporation | Method for processing a work piece in a multi-zonal processing apparatus |
DE10222956B4 (de) * | 2002-05-24 | 2009-01-29 | FIP Forschungsinstitut für Produktionstechnik GmbH Braunschweig | Feinschleifmaschine |
TWM255104U (en) | 2003-02-05 | 2005-01-11 | Applied Materials Inc | Retaining ring with flange for chemical mechanical polishing |
JP3739752B2 (ja) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | ランダム周期変速可能な小片移載装置 |
US6974371B2 (en) | 2003-04-30 | 2005-12-13 | Applied Materials, Inc. | Two part retaining ring |
JP2005034959A (ja) * | 2003-07-16 | 2005-02-10 | Ebara Corp | 研磨装置及びリテーナリング |
US7654888B2 (en) * | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
US7727055B2 (en) * | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
WO2013039608A2 (en) * | 2011-09-12 | 2013-03-21 | Applied Materials, Inc. | Carrier head with composite plastic portions |
US10857649B2 (en) * | 2011-09-22 | 2020-12-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for performing a polishing process in semiconductor fabrication |
CN105290957A (zh) * | 2015-10-12 | 2016-02-03 | 京东方光科技有限公司 | 一种夹具、研磨方法及研磨设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5911423B2 (ja) * | 1974-04-10 | 1984-03-15 | 株式会社日立製作所 | ラツピング装置 |
JPS5727659A (en) * | 1980-07-18 | 1982-02-15 | Supiide Fuamu Kk | Lapping machine |
WO1989007508A1 (en) * | 1988-02-17 | 1989-08-24 | Gruzinsky Politekhnichesky Institut Imeni V.I.Leni | Method and cassette for abrasive machining of the surface of parts |
US4954142A (en) * | 1989-03-07 | 1990-09-04 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
US5205082A (en) * | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
US5635083A (en) * | 1993-08-06 | 1997-06-03 | Intel Corporation | Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5681215A (en) * | 1995-10-27 | 1997-10-28 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
US5795215A (en) | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
JP3072962B2 (ja) * | 1995-11-30 | 2000-08-07 | ロデール・ニッタ株式会社 | 研磨のための被加工物の保持具及びその製法 |
US5707492A (en) * | 1995-12-18 | 1998-01-13 | Motorola, Inc. | Metallized pad polishing process |
JPH09225819A (ja) * | 1996-02-21 | 1997-09-02 | Shin Etsu Handotai Co Ltd | 被加工物の保持機構 |
-
1996
- 1996-10-08 KR KR1019960044549A patent/KR100485002B1/ko not_active IP Right Cessation
- 1996-10-09 EP EP01115108A patent/EP1151824A1/de not_active Withdrawn
- 1996-10-09 DE DE69618437T patent/DE69618437T2/de not_active Expired - Lifetime
- 1996-10-09 EP EP96116166A patent/EP0790100B1/de not_active Expired - Lifetime
- 1996-10-09 US US08/728,069 patent/US5916412A/en not_active Expired - Lifetime
-
1999
- 1999-04-09 US US09/288,768 patent/US6350346B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1151824A1 (de) | 2001-11-07 |
US5916412A (en) | 1999-06-29 |
EP0790100B1 (de) | 2002-01-09 |
US6350346B1 (en) | 2002-02-26 |
KR100485002B1 (ko) | 2005-08-29 |
KR980005771A (ko) | 1998-03-30 |
EP0790100A1 (de) | 1997-08-20 |
DE69618437T2 (de) | 2002-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |