DE69719847D1 - Verfahren und Vorrichtung zum Polieren von Werkstücken - Google Patents

Verfahren und Vorrichtung zum Polieren von Werkstücken

Info

Publication number
DE69719847D1
DE69719847D1 DE69719847T DE69719847T DE69719847D1 DE 69719847 D1 DE69719847 D1 DE 69719847D1 DE 69719847 T DE69719847 T DE 69719847T DE 69719847 T DE69719847 T DE 69719847T DE 69719847 D1 DE69719847 D1 DE 69719847D1
Authority
DE
Germany
Prior art keywords
polishing workpieces
workpieces
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69719847T
Other languages
English (en)
Other versions
DE69719847T2 (de
Inventor
Noburu Shimizu
Norio Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69719847D1 publication Critical patent/DE69719847D1/de
Publication of DE69719847T2 publication Critical patent/DE69719847T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
DE69719847T 1996-05-16 1997-05-16 Verfahren und Vorrichtung zum Polieren von Werkstücken Expired - Lifetime DE69719847T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14677696 1996-05-16
JP14677696 1996-05-16

Publications (2)

Publication Number Publication Date
DE69719847D1 true DE69719847D1 (de) 2003-04-24
DE69719847T2 DE69719847T2 (de) 2004-02-05

Family

ID=15415286

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69719847T Expired - Lifetime DE69719847T2 (de) 1996-05-16 1997-05-16 Verfahren und Vorrichtung zum Polieren von Werkstücken

Country Status (3)

Country Link
US (1) US5989107A (de)
EP (2) EP0807492B1 (de)
DE (1) DE69719847T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3560051B2 (ja) * 1996-11-15 2004-09-02 株式会社荏原製作所 基板の研磨方法及び装置
JPH11156704A (ja) * 1997-11-21 1999-06-15 Ebara Corp 基板の研磨装置
US6595831B1 (en) 1996-05-16 2003-07-22 Ebara Corporation Method for polishing workpieces using fixed abrasives
JP2000315665A (ja) 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
US6413156B1 (en) * 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
US6116994A (en) * 1997-04-11 2000-09-12 Ebara Corporation Polishing apparatus
TW375556B (en) 1997-07-02 1999-12-01 Matsushita Electric Ind Co Ltd Method of polishing the wafer and finishing the polishing pad
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
KR100524054B1 (ko) 1997-11-21 2005-10-26 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치와 이에 사용되는 대상물 홀더 및 폴리싱 방법 및 웨이퍼제조방법
SG119138A1 (en) * 1998-04-28 2006-02-28 Ebara Corp Abrading plate and polishing method using the same
US6184139B1 (en) * 1998-09-17 2001-02-06 Speedfam-Ipec Corporation Oscillating orbital polisher and method
KR20010040249A (ko) * 1998-10-28 2001-05-15 가나이 쓰도무 연마장치 및 그 장치를 사용한 반도체제조방법
JP3979750B2 (ja) * 1998-11-06 2007-09-19 株式会社荏原製作所 基板の研磨装置
US6309279B1 (en) 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
SG97860A1 (en) * 1999-03-05 2003-08-20 Ebara Corp Polishing apparatus
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6358128B1 (en) * 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6555466B1 (en) 1999-03-29 2003-04-29 Speedfam Corporation Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers
KR20010039590A (ko) * 1999-04-29 2001-05-15 마에다 시게루 작업대상물을 폴리싱하는 방법 및 장치
JP3797822B2 (ja) * 1999-06-30 2006-07-19 株式会社荏原製作所 ポリッシング装置
JP2001038615A (ja) * 1999-07-26 2001-02-13 Ebara Corp ポリッシング装置
EP1077108B1 (de) 1999-08-18 2006-12-20 Ebara Corporation Verfahren und Einrichtung zum Polieren
US6712678B1 (en) * 1999-12-07 2004-03-30 Ebara Corporation Polishing-product discharging device and polishing device
JP2002043474A (ja) * 2000-07-21 2002-02-08 Nakamura Seisakusho Kk 電子部品用パッケージの形成方法
US6887136B2 (en) * 2001-05-09 2005-05-03 Applied Materials, Inc. Apparatus and methods for multi-step chemical mechanical polishing
US6641462B2 (en) * 2001-06-27 2003-11-04 Speedfam-Ipec Corporation Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
DE102006031098A1 (de) * 2006-07-05 2008-01-10 GM Global Technology Operations, Inc., Detroit Fahrzeugseitige Vorrichtung zur Montage von Befestigungs- oder Unterbringungselementen
JP5526895B2 (ja) * 2009-04-01 2014-06-18 信越化学工業株式会社 大型合成石英ガラス基板の製造方法
CN103223638B (zh) * 2013-04-28 2016-04-13 上海华力微电子有限公司 化学机械研磨设备

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE197634C (de) *
US3659386A (en) * 1968-03-22 1972-05-02 Ibm A method for providing a finished surface on workpieces
US3638933A (en) * 1970-08-10 1972-02-01 Yosemite Lab Precision x-y positioning table
JPS55134414A (en) * 1979-04-06 1980-10-20 Hitachi Ltd Precise moving unit
CH668574A5 (de) * 1985-05-23 1989-01-13 Exnii Metallorezh Stankov Nc-vertikalschleifmaschine.
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
KR0129662B1 (ko) * 1987-10-30 1998-04-07 고다까 토시오 이동 테이블 장치
US5083401A (en) * 1988-08-08 1992-01-28 Mitsubishi Denki Kabushiki Kaisha Method of polishing
JPH02208931A (ja) * 1989-02-08 1990-08-20 Hitachi Cable Ltd 化合物半導体基板の研磨方法
US5228177A (en) * 1990-03-03 1993-07-20 Herzog Maschinenfabrik Gmbh & Co. Sample preparation system for iron and steel samples
US5184433A (en) * 1990-03-16 1993-02-09 Aster Corporation Fiber optic polisher
JPH0469147A (ja) * 1990-07-11 1992-03-04 Mabuchi Shoten:Kk 相対等速度研磨方法
EP0517594B1 (de) * 1991-06-06 1995-12-13 Commissariat A L'energie Atomique Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf
JP3233664B2 (ja) * 1991-09-13 2001-11-26 土肥 俊郎 デバイス付きウェーハのプラナリゼーションポリッシング方法及びその装置
US5232875A (en) * 1992-10-15 1993-08-03 Micron Technology, Inc. Method and apparatus for improving planarity of chemical-mechanical planarization operations
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
JPH07285069A (ja) * 1994-04-18 1995-10-31 Shin Etsu Handotai Co Ltd 枚葉式研磨におけるウェーハのテーパ自動除去研磨方法と装置
US5571373A (en) * 1994-05-18 1996-11-05 Memc Electronic Materials, Inc. Method of rough polishing semiconductor wafers to reduce surface roughness
US5503589A (en) * 1994-06-17 1996-04-02 Wikle; Kenneth C. Apparatus and method for contour grinding gas turbine blades
US5551986A (en) * 1995-02-15 1996-09-03 Taxas Instruments Incorporated Mechanical scrubbing for particle removal
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing

Also Published As

Publication number Publication date
DE69719847T2 (de) 2004-02-05
US5989107A (en) 1999-11-23
EP1281476A3 (de) 2003-08-13
EP0807492B1 (de) 2003-03-19
EP0807492A2 (de) 1997-11-19
EP1281476A2 (de) 2003-02-05
EP0807492A3 (de) 1998-11-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition