DE69618437T2 - Verfahren und Vorrichtung zum Polieren von Werkstücken - Google Patents

Verfahren und Vorrichtung zum Polieren von Werkstücken

Info

Publication number
DE69618437T2
DE69618437T2 DE69618437T DE69618437T DE69618437T2 DE 69618437 T2 DE69618437 T2 DE 69618437T2 DE 69618437 T DE69618437 T DE 69618437T DE 69618437 T DE69618437 T DE 69618437T DE 69618437 T2 DE69618437 T2 DE 69618437T2
Authority
DE
Germany
Prior art keywords
polishing workpieces
workpieces
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69618437T
Other languages
English (en)
Other versions
DE69618437D1 (de
Inventor
Masamichi Nakashiba
Norio Kimura
Isamu Watanabe
Yoko Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69618437D1 publication Critical patent/DE69618437D1/de
Publication of DE69618437T2 publication Critical patent/DE69618437T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
DE69618437T 1996-02-16 1996-10-09 Verfahren und Vorrichtung zum Polieren von Werkstücken Expired - Lifetime DE69618437T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5405596 1996-02-16
JP17173596 1996-06-11

Publications (2)

Publication Number Publication Date
DE69618437D1 DE69618437D1 (de) 2002-02-14
DE69618437T2 true DE69618437T2 (de) 2002-08-29

Family

ID=26394800

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69618437T Expired - Lifetime DE69618437T2 (de) 1996-02-16 1996-10-09 Verfahren und Vorrichtung zum Polieren von Werkstücken

Country Status (4)

Country Link
US (2) US5916412A (de)
EP (2) EP0790100B1 (de)
KR (1) KR100485002B1 (de)
DE (1) DE69618437T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10222956A1 (de) * 2002-05-24 2003-12-11 Fip Forschungsinstitut Fuer Pr Feinschleifmaschine

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6024630A (en) 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法
US6139428A (en) * 1996-12-17 2000-10-31 Vsli Technology, Inc. Conditioning ring for use in a chemical mechanical polishing machine
JPH10230455A (ja) * 1997-02-17 1998-09-02 Nec Corp 研磨装置
US6077385A (en) * 1997-04-08 2000-06-20 Ebara Corporation Polishing apparatus
US6196904B1 (en) 1998-03-25 2001-03-06 Ebara Corporation Polishing apparatus
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6436228B1 (en) 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6251215B1 (en) 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6102779A (en) * 1998-06-17 2000-08-15 Speedfam-Ipec, Inc. Method and apparatus for improved semiconductor wafer polishing
US5993293A (en) * 1998-06-17 1999-11-30 Speedram Corporation Method and apparatus for improved semiconductor wafer polishing
WO2000025981A1 (fr) * 1998-10-30 2000-05-11 Shin-Etsu Handotai Co., Ltd. Plan non poli de maintien/travail et son procede de fabrication ; technique et dispositif de polissage
US6220930B1 (en) * 1998-11-03 2001-04-24 United Microelectronics Corp. Wafer polishing head
US6283828B1 (en) 1998-11-09 2001-09-04 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
JP2001121411A (ja) 1999-10-29 2001-05-08 Applied Materials Inc ウェハー研磨装置
US6517422B2 (en) * 2000-03-07 2003-02-11 Toshiba Ceramics Co., Ltd. Polishing apparatus and method thereof
JP2001298006A (ja) 2000-04-17 2001-10-26 Ebara Corp 研磨装置
US6602114B1 (en) 2000-05-19 2003-08-05 Applied Materials Inc. Multilayer retaining ring for chemical mechanical polishing
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US6848980B2 (en) 2001-10-10 2005-02-01 Applied Materials, Inc. Vibration damping in a carrier head
US7255637B2 (en) 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US6676497B1 (en) 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US6447368B1 (en) 2000-11-20 2002-09-10 Speedfam-Ipec Corporation Carriers with concentric balloons supporting a diaphragm
US6468131B1 (en) 2000-11-28 2002-10-22 Speedfam-Ipec Corporation Method to mathematically characterize a multizone carrier
US6582277B2 (en) 2001-05-01 2003-06-24 Speedfam-Ipec Corporation Method for controlling a process in a multi-zonal apparatus
US7217175B2 (en) * 2001-05-29 2007-05-15 Ebara Corporation Polishing apparatus and polishing method
US8512580B2 (en) * 2001-09-21 2013-08-20 Lg Display Co., Ltd. Method of fabricating thin liquid crystal display device
US6835125B1 (en) 2001-12-27 2004-12-28 Applied Materials Inc. Retainer with a wear surface for chemical mechanical polishing
US6890249B1 (en) 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US6461965B1 (en) * 2002-01-31 2002-10-08 Texas Instruments Incorporated Method for effecting a finishing operation on a semiconductor workpiece
US6739958B2 (en) 2002-03-19 2004-05-25 Applied Materials Inc. Carrier head with a vibration reduction feature for a chemical mechanical polishing system
US6790123B2 (en) 2002-05-16 2004-09-14 Speedfam-Ipec Corporation Method for processing a work piece in a multi-zonal processing apparatus
TWM255104U (en) 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
US6974371B2 (en) 2003-04-30 2005-12-13 Applied Materials, Inc. Two part retaining ring
JP2005034959A (ja) * 2003-07-16 2005-02-10 Ebara Corp 研磨装置及びリテーナリング
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US10052739B2 (en) * 2011-09-12 2018-08-21 Applied Materials, Inc. Carrier head with composite plastic portions
US10857649B2 (en) * 2011-09-22 2020-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for performing a polishing process in semiconductor fabrication
CN105290957A (zh) * 2015-10-12 2016-02-03 京东方光科技有限公司 一种夹具、研磨方法及研磨设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911423B2 (ja) * 1974-04-10 1984-03-15 株式会社日立製作所 ラツピング装置
JPS5727659A (en) * 1980-07-18 1982-02-15 Supiide Fuamu Kk Lapping machine
WO1989007508A1 (en) 1988-02-17 1989-08-24 Gruzinsky Politekhnichesky Institut Imeni V.I.Leni Method and cassette for abrasive machining of the surface of parts
US4954142A (en) * 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5795215A (en) 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
JP3072962B2 (ja) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 研磨のための被加工物の保持具及びその製法
US5707492A (en) * 1995-12-18 1998-01-13 Motorola, Inc. Metallized pad polishing process
JPH09225819A (ja) * 1996-02-21 1997-09-02 Shin Etsu Handotai Co Ltd 被加工物の保持機構

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10222956A1 (de) * 2002-05-24 2003-12-11 Fip Forschungsinstitut Fuer Pr Feinschleifmaschine
DE10222956B4 (de) * 2002-05-24 2009-01-29 FIP Forschungsinstitut für Produktionstechnik GmbH Braunschweig Feinschleifmaschine

Also Published As

Publication number Publication date
US5916412A (en) 1999-06-29
KR980005771A (ko) 1998-03-30
EP0790100A1 (de) 1997-08-20
KR100485002B1 (ko) 2005-08-29
EP0790100B1 (de) 2002-01-09
DE69618437D1 (de) 2002-02-14
EP1151824A1 (de) 2001-11-07
US6350346B1 (en) 2002-02-26

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