DE69531191D1 - Epoxidharzzusammensetzung für die versiegelung von halbleiteranordnungen - Google Patents
Epoxidharzzusammensetzung für die versiegelung von halbleiteranordnungenInfo
- Publication number
- DE69531191D1 DE69531191D1 DE69531191T DE69531191T DE69531191D1 DE 69531191 D1 DE69531191 D1 DE 69531191D1 DE 69531191 T DE69531191 T DE 69531191T DE 69531191 T DE69531191 T DE 69531191T DE 69531191 D1 DE69531191 D1 DE 69531191D1
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- epoxy resin
- sealing semiconductor
- semiconductor arrangements
- arrangements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27521394 | 1994-11-09 | ||
JP27521394 | 1994-11-09 | ||
JP20595695A JPH09208805A (ja) | 1994-11-09 | 1995-08-11 | 光半導体素子封止用エポキシ樹脂組成物 |
JP20595695 | 1995-08-11 | ||
PCT/JP1995/002262 WO1996015191A1 (en) | 1994-11-09 | 1995-11-07 | Epoxy resin composition for sealing photosemiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69531191D1 true DE69531191D1 (de) | 2003-08-07 |
DE69531191T2 DE69531191T2 (de) | 2004-04-15 |
Family
ID=26515360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1995631191 Expired - Fee Related DE69531191T2 (de) | 1994-11-09 | 1995-11-07 | Epoxidharzzusammensetzung für die versiegelung von halbleiteranordnungen |
Country Status (8)
Country | Link |
---|---|
US (1) | US6001483A (de) |
EP (1) | EP0738759B1 (de) |
JP (1) | JPH09208805A (de) |
KR (1) | KR100343308B1 (de) |
CN (1) | CN1082067C (de) |
DE (1) | DE69531191T2 (de) |
TW (1) | TW288186B (de) |
WO (1) | WO1996015191A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59709220D1 (de) * | 1996-10-30 | 2003-03-06 | Vantico Ag | Härtbare Epoxidharzzusammensetzungen |
JP3392012B2 (ja) * | 1997-07-28 | 2003-03-31 | 松下電工株式会社 | 半導体素子封止用エポキシ樹脂組成物及び半導体装置 |
JP3900144B2 (ja) * | 1998-02-17 | 2007-04-04 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
JP3851441B2 (ja) * | 1998-04-23 | 2006-11-29 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物及び光半導体装置 |
JP3392068B2 (ja) * | 1999-01-26 | 2003-03-31 | 松下電工株式会社 | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
JP3617386B2 (ja) * | 1999-09-27 | 2005-02-02 | 松下電工株式会社 | 光半導体用エポキシ樹脂組成物及び光半導体装置 |
JP3430150B2 (ja) | 2000-12-18 | 2003-07-28 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物の製造方法 |
JP2002201288A (ja) * | 2001-01-09 | 2002-07-19 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物の製造方法 |
SG115811A1 (en) * | 2004-03-31 | 2005-10-28 | Nitto Denko Corp | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
JP4890872B2 (ja) * | 2006-01-30 | 2012-03-07 | ルネサスエレクトロニクス株式会社 | 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置 |
DE102006030038A1 (de) * | 2006-06-29 | 2008-01-03 | Qimonda Ag | Versiegelungsschicht zum Versiegeln gegenüber einer Umgebung |
JP2008031229A (ja) * | 2006-07-26 | 2008-02-14 | Matsushita Electric Works Ltd | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
JP5072070B2 (ja) * | 2007-03-08 | 2012-11-14 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
KR100898337B1 (ko) * | 2007-12-26 | 2009-05-20 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
JP5367274B2 (ja) * | 2008-02-14 | 2013-12-11 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
JP5410085B2 (ja) * | 2008-12-17 | 2014-02-05 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
DE102009007392A1 (de) * | 2009-01-29 | 2010-08-05 | Siemens Aktiengesellschaft | Tränkharzsystem für Isolierstoffe in Schaltanlagen |
DE102009008464A1 (de) * | 2009-02-10 | 2010-08-12 | Siemens Aktiengesellschaft | Gießharzsystem für Isolierstoffe in Schaltanlagen |
KR101332430B1 (ko) | 2009-12-31 | 2013-11-22 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 패키지 |
JP5699443B2 (ja) * | 2010-04-09 | 2015-04-08 | 日立化成株式会社 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
JP6524840B2 (ja) * | 2015-07-30 | 2019-06-05 | 新日本理化株式会社 | エポキシ樹脂組成物及びエポキシ硬化物 |
JP6989044B1 (ja) | 2021-03-31 | 2022-01-05 | 住友ベークライト株式会社 | 封止構造体の製造方法およびタブレット |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2106320A1 (en) * | 1971-02-10 | 1972-08-24 | Lechler Chemie Gmbh, 7000 Stuttgart | Epoxy resin paints - consisting of aq dispersions of epoxy resins and hardeners with mixed emulsifiers |
JPS4994786A (de) * | 1972-11-24 | 1974-09-09 | ||
JPS5219597B2 (de) * | 1973-07-20 | 1977-05-28 | ||
US4210572A (en) * | 1978-08-29 | 1980-07-01 | Nl Industries, Inc. | Coupling agents for thermosetting composites |
JPS5884820A (ja) * | 1981-11-13 | 1983-05-21 | Mitsubishi Chem Ind Ltd | エポキシ樹脂組成物 |
DE3207612C2 (de) * | 1982-03-03 | 1986-04-03 | Akzo Gmbh, 5600 Wuppertal | Polyätherderivate und deren Verwendung als Emulgatoren |
DD240554A1 (de) * | 1985-08-29 | 1986-11-05 | Leuna Werke Veb | Optische transparente verkappungsmasse mit hoher temperaturschockbestaendigkeit |
US4628080A (en) * | 1985-09-30 | 1986-12-09 | Shell Oil Company | Cure rate control in epoxy resin compositions |
JPS62283616A (ja) * | 1986-05-31 | 1987-12-09 | Tokyo Electric Co Ltd | コイル巻枠 |
JP2746905B2 (ja) * | 1988-03-28 | 1998-05-06 | 日東電工株式会社 | 光半導体封止用エポキシ樹脂組成物 |
JP2703632B2 (ja) * | 1989-09-06 | 1998-01-26 | 日東電工株式会社 | 光半導体装置およびそれに用いる光半導体封止用エポキシ樹脂組成物 |
JP2796187B2 (ja) * | 1990-10-01 | 1998-09-10 | 日東電工株式会社 | 光半導体装置 |
JPH06200127A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
JPH06228281A (ja) * | 1993-02-03 | 1994-08-16 | Hitachi Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
KR960007637A (ko) * | 1994-08-15 | 1996-03-22 | 알베르투스 빌헬무스·요아네스 쩨스트라텐 | 에폭시 수지 시스템 |
-
1995
- 1995-08-11 JP JP20595695A patent/JPH09208805A/ja active Pending
- 1995-11-07 DE DE1995631191 patent/DE69531191T2/de not_active Expired - Fee Related
- 1995-11-07 KR KR1019960703694A patent/KR100343308B1/ko not_active IP Right Cessation
- 1995-11-07 EP EP95936104A patent/EP0738759B1/de not_active Expired - Lifetime
- 1995-11-07 US US08/669,317 patent/US6001483A/en not_active Expired - Lifetime
- 1995-11-07 CN CN95191178A patent/CN1082067C/zh not_active Expired - Fee Related
- 1995-11-07 WO PCT/JP1995/002262 patent/WO1996015191A1/ja active IP Right Grant
- 1995-11-28 TW TW84112645A patent/TW288186B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6001483A (en) | 1999-12-14 |
KR970700232A (ko) | 1997-01-08 |
DE69531191T2 (de) | 2004-04-15 |
WO1996015191A1 (en) | 1996-05-23 |
JPH09208805A (ja) | 1997-08-12 |
EP0738759B1 (de) | 2003-07-02 |
CN1082067C (zh) | 2002-04-03 |
CN1138343A (zh) | 1996-12-18 |
KR100343308B1 (ko) | 2002-11-23 |
EP0738759A4 (de) | 1998-09-09 |
TW288186B (de) | 1996-10-11 |
EP0738759A1 (de) | 1996-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |