JP5072070B2 - 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 - Google Patents
光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 Download PDFInfo
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- JP5072070B2 JP5072070B2 JP2007058845A JP2007058845A JP5072070B2 JP 5072070 B2 JP5072070 B2 JP 5072070B2 JP 2007058845 A JP2007058845 A JP 2007058845A JP 2007058845 A JP2007058845 A JP 2007058845A JP 5072070 B2 JP5072070 B2 JP 5072070B2
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- 239000003822 epoxy resin Substances 0.000 title claims description 70
- 229920000647 polyepoxide Polymers 0.000 title claims description 70
- 239000000203 mixture Substances 0.000 title claims description 51
- 230000003287 optical effect Effects 0.000 title claims description 43
- 239000004065 semiconductor Substances 0.000 title claims description 43
- 238000007789 sealing Methods 0.000 title claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 36
- 239000006082 mold release agent Substances 0.000 claims description 13
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 10
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 12
- 238000002834 transmittance Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
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- 239000003607 modifier Substances 0.000 description 5
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
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- 239000000945 filler Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000003018 phosphorus compounds Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- RFWFOJDAIRDAPK-VKHMYHEASA-N (3s)-3-aminooxane-2,6-dione Chemical compound N[C@H]1CCC(=O)OC1=O RFWFOJDAIRDAPK-VKHMYHEASA-N 0.000 description 1
- PMUPSYZVABJEKC-UHFFFAOYSA-N 1-methylcyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)CCCCC1C(O)=O PMUPSYZVABJEKC-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DPUYDFJBHDYVQM-UHFFFAOYSA-N CC(C)CC1CCCC1 Chemical compound CC(C)CC1CCCC1 DPUYDFJBHDYVQM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 amine compounds Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- FPVGTPBMTFTMRT-NSKUCRDLSA-L fast yellow Chemical compound [Na+].[Na+].C1=C(S([O-])(=O)=O)C(N)=CC=C1\N=N\C1=CC=C(S([O-])(=O)=O)C=C1 FPVGTPBMTFTMRT-NSKUCRDLSA-L 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
(A)トリグリシジルイソシアヌレート。
(B)硬化剤。
(C)シランカップリング剤。
(D)下記の構造式(2)で表される構造単位および構造式(3)で表される構造単位を有する分子構造を備えた離型剤であって、上記構造式(3)で表される構造単位の占める割合が、離型剤を構成する分子構造全体の25〜95重量%に設定されてなる離型剤。
トリグリシジルイソシアヌレート(エポキシ当量100)
ヘキサヒドロ無水フタル酸
テトラ−n−ブチルホスホニウム−o,o−ジエチルホスホロジチオエート
エチレングリコール
γ−メルカプトプロピルトリメトキシシラン
下記の表1〜表2に示す各成分を同表に示す割合で配合し、ミキシングロールで溶融混練(80〜130℃)を行い、熟成した後、室温で冷却して粉砕することにより目的とする粉末状のエポキシ樹脂組成物を作製した。
上記各エポキシ樹脂組成物を用い、トランスファー成形(成形条件:150℃×4分間)し、さらに、150℃×3時間の条件でアフターキュアすることにより、光透過率測定用の試料(厚み1mmの硬化物)を作製した。この試料を、石英セル中の流動パラフィンに浸漬し、試料表面の光散乱を抑制した状態で、室温(25℃)にて波長400nmにおける光透過率を分光光度計(島津製作所社製、UV3101)を用いて測定した。
上記各エポキシ樹脂組成物を用い、トランスファー成形(成形条件:150℃×4分間)し、さらに、150℃×3時間の条件でアフターキュアすることにより、図1に示すように、リードフレームと同じ材質の金属フレーム板(材質:42アロイ合金素体の表面全面に厚み0.2μmの銀メッキ層を形成したもの)1の左端表面に、円錐台形状の樹脂硬化体2が設けられた接着力測定サンプルを成形した(接着部の面積は0.25cm2)。
上記各エポキシ樹脂組成物を用いて光半導体素子(SiNフォトダイオード:1.8mm×2.3mm×厚み0.25mm)をトランスファー成形(150℃×4分間成形、150℃×3時間後硬化)でモールドすることにより表面実装型光半導体装置を得た。この表面実装型光半導体装置は、図2に示すように、8ピンのスモールアウトラインパッケージ(SOP−8:4.9mm×3.9mm×厚み1.5mm)3で、リードフレーム4として、42アロイ合金素体の表面全面に銀メッキ層(厚み0.5μm)を形成したものを用いた。
また、上記光半導体装置20個について、レッドインク試験を行い、そのインクの浸入したパッケージ数をカウントした。すなわち、上記レッドインク試験方法は、光半導体装置をレッドインク液に浸漬し、5分間、真空引きした後、光半導体装置を洗浄し、顕微鏡にてレッドインクが浸入したパッケージ数をカウントした。
Claims (3)
- 下記の(A)〜(D)成分を含有してなる光半導体素子封止用エポキシ樹脂組成物であって、エポキシ樹脂成分が下記(A)成分のみからなり、上記(D)成分の含有割合が、エポキシ樹脂組成物全体の0.1〜2.5重量%の範囲に設定されていることを特徴とする光半導体素子封止用エポキシ樹脂組成物。
(A)トリグリシジルイソシアヌレート。
(B)硬化剤。
(C)シランカップリング剤。
(D)下記の構造式(2)で表される構造単位および構造式(3)で表される構造単位を有する分子構造を備えた離型剤であって、上記構造式(3)で表される構造単位の占める割合が、離型剤を構成する分子構造全体の25〜95重量%に設定されてなる離型剤。
- 請求項1または2記載の光半導体素子封止用エポキシ樹脂組成物を用いて光半導体素子を樹脂封止してなる光半導体装置。
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JP5621236B2 (ja) * | 2009-10-05 | 2014-11-12 | 日立化成株式会社 | ウレタン樹脂組成物、硬化体及び硬化体を用いた光半導体装置 |
JP5792375B2 (ja) * | 2011-05-19 | 2015-10-14 | 晶能光電(江西)有限公司Lattice Power(Jiangxi)Corporation | 窒化ガリウムベースフィルムチップの生産方法および製造方法 |
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JP2703617B2 (ja) * | 1989-03-27 | 1998-01-26 | 日東電工株式会社 | 光半導体装置およびそれに用いる光半導体封止用エポキシ樹脂組成物 |
JPH09208805A (ja) * | 1994-11-09 | 1997-08-12 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物 |
JP3392012B2 (ja) * | 1997-07-28 | 2003-03-31 | 松下電工株式会社 | 半導体素子封止用エポキシ樹脂組成物及び半導体装置 |
JP3851441B2 (ja) * | 1998-04-23 | 2006-11-29 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物及び光半導体装置 |
JP2001261933A (ja) * | 2000-03-15 | 2001-09-26 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物および光半導体装置 |
JP3728441B2 (ja) * | 2002-06-20 | 2005-12-21 | 住友ベークライト株式会社 | 透明複合体組成物 |
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