DE69531641D1 - Eingekapseltes Härtungsmittel für hitzehärtbare Harzzusammensetzungen - Google Patents

Eingekapseltes Härtungsmittel für hitzehärtbare Harzzusammensetzungen

Info

Publication number
DE69531641D1
DE69531641D1 DE69531641T DE69531641T DE69531641D1 DE 69531641 D1 DE69531641 D1 DE 69531641D1 DE 69531641 T DE69531641 T DE 69531641T DE 69531641 T DE69531641 T DE 69531641T DE 69531641 D1 DE69531641 D1 DE 69531641D1
Authority
DE
Germany
Prior art keywords
curing agent
thermosetting resin
resin compositions
encapsulated curing
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69531641T
Other languages
English (en)
Other versions
DE69531641T2 (de
Inventor
Ryuji Sawaoka
Shinji Kouchi
Toshio Muraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Application granted granted Critical
Publication of DE69531641D1 publication Critical patent/DE69531641D1/de
Publication of DE69531641T2 publication Critical patent/DE69531641T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/24Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/10Encapsulated ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00Characterised by the use of unspecified polymers
    • C08J2300/22Thermoplastic resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00Characterised by the use of unspecified polymers
    • C08J2300/24Thermosetting resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/936Encapsulated chemical agent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Micro-Organisms Or Cultivation Processes Thereof (AREA)
DE69531641T 1994-03-15 1995-03-15 Eingekapseltes Härtungsmittel für hitzehärtbare Harzzusammensetzungen Expired - Fee Related DE69531641T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4367994 1994-03-15
JP4367994 1994-03-15

Publications (2)

Publication Number Publication Date
DE69531641D1 true DE69531641D1 (de) 2003-10-09
DE69531641T2 DE69531641T2 (de) 2004-07-01

Family

ID=12670531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69531641T Expired - Fee Related DE69531641T2 (de) 1994-03-15 1995-03-15 Eingekapseltes Härtungsmittel für hitzehärtbare Harzzusammensetzungen

Country Status (6)

Country Link
US (2) US5589523A (de)
EP (1) EP0672707B1 (de)
KR (1) KR950032394A (de)
CN (3) CN1083850C (de)
DE (1) DE69531641T2 (de)
TW (1) TW305860B (de)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800923A (en) * 1995-08-29 1998-09-01 E. I. Du Pont De Nemours And Company Acid composition comprising a coated polyvalent carboxylic acid solid particle and a powder coating comprising the same
CN1213074C (zh) * 1995-12-06 2005-08-03 旭化成株式会社 用于自由基固化型化合物的涂敷的粒状固化剂及使用该固化剂的锚定螺栓固定用组合物
KR100430626B1 (ko) * 1997-01-20 2004-07-30 주식회사 코오롱 열융착 에폭시 필름 및 그의 제조방법
WO1999046320A1 (fr) 1998-03-13 1999-09-16 Matsumoto Yushi-Seiyaku Co., Ltd. Microcapsules thermo-expansibles et leur procede d'utilisation
US6447915B1 (en) * 1999-03-11 2002-09-10 Sumitomo Bakelite Company Limited Interlaminar insulating adhesive for multilayer printed circuit board
DE19935532A1 (de) * 1999-07-30 2001-02-08 Guido Enderle Verfahren zur Aktivierung mikroverkapselter Komponenten und Werk- oder Wirkstoff mit zumindest einer mikroverkapselten Komponente
WO2001046290A1 (en) * 1999-12-20 2001-06-28 3M Innovative Properties Company Ambient-temperature-stable, one-part curable epoxy adhesive
JP3485513B2 (ja) * 2000-01-19 2004-01-13 沖電気工業株式会社 半導体装置の製造方法
JP2002069157A (ja) * 2000-08-24 2002-03-08 Nitto Denko Corp 半導体封止用樹脂組成物、およびそれを用いた半導体装置、半導体ウエハ、ならびに半導体装置の実装構造
ITMI20010236A1 (it) * 2001-02-07 2002-08-07 Giuseppe Cappi Procedimento per la realizzazione di manufatti termo e fonoisolanti per l'edilizia e per l'industria impianto per la realizzazione di questo
US20030082385A1 (en) * 2001-07-13 2003-05-01 Toray Composites (America), Inc. Quick cure carbon fiber reinforced epoxy resin
DE10139790A1 (de) * 2001-08-14 2003-03-06 Henkel Kgaa Mikrokapseln, Verfahren zu deren Herstellung und deren Verwendung
DE10231706B4 (de) * 2002-07-13 2006-10-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrokomposite und Verfahren zu deren Herstellung sowie deren Verwendung
ES2387333T3 (es) 2002-07-18 2012-09-20 Mitsubishi Rayon Co., Ltd. Preimpregnado, material intermedio para moldeado de FRP, y procedimientos de producción para el mismo, y procedimientos de producción para material compuesto reforzado con fibras
US20040052997A1 (en) * 2002-09-17 2004-03-18 Ietsugu Santo Composite pressure container or tubular body and composite intermediate
DE60320134T3 (de) * 2002-11-28 2015-12-24 Mitsubishi Rayon Co., Ltd. Herstellungsverfahren für faserverstärktes verbundmaterial
US7045562B2 (en) * 2003-10-16 2006-05-16 International Business Machines Corporation Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls
US7001091B1 (en) 2003-10-31 2006-02-21 Knight Andrew F Ink pen for dispensing ink having time-dependent characteristics
EP1784302B1 (de) * 2004-09-01 2016-07-06 Encapsys, Llc Verkapselte aushärtungssysteme
US20060292375A1 (en) * 2005-06-28 2006-12-28 Martin Cary J Resin compositions with high thermoplatic loading
KR100961417B1 (ko) 2005-09-29 2010-06-09 아사히 가세이 케미칼즈 가부시키가이샤 고-안정성 마이크로캡슐화 에폭시 수지용 경화제 및 에폭시수지 조성물
CN100423935C (zh) * 2005-12-26 2008-10-08 四川省宜宾五粮液集团有限公司 表面带有装饰标材的模塑制品及其制造方法
CN101379108B (zh) * 2006-02-03 2011-11-30 旭化成电子材料株式会社 微胶囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单液型环氧树脂组合物、及其加工品
AU2007244335B2 (en) * 2006-04-25 2010-08-12 The Yokohama Rubber Co., Ltd. Epoxy resin composition for fiber-reinforced composite material
DE502006003010D1 (de) * 2006-05-04 2009-04-16 Sgl Carbon Ag Hochtemperaturbeständiger Verbundwerkstoff
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
KR100787381B1 (ko) * 2006-11-16 2007-12-24 한국과학기술연구원 미세 캡슐-도전성 입자 복합체, 이의 제조 방법 및 이를이용한 이방 도전성 접착 필름
WO2009038971A1 (en) * 2007-09-18 2009-03-26 3M Innovative Properties Company Erosion resistant impregnating resin systems and composites
CN101619319B (zh) * 2009-03-13 2011-06-15 创世纪转基因技术有限公司 人工改造合成的抗草甘膦基因与应用
WO2011126702A2 (en) * 2010-03-30 2011-10-13 Henkel Corporation Encapsulated curing agents
CN103038285B (zh) * 2010-07-29 2015-11-25 三井化学株式会社 组合物、由该组合物组成的显示设备端面密封剂用组合物、显示设备及其制造方法
US9067395B2 (en) 2010-08-20 2015-06-30 3M Innovative Properties Company Low temperature curable epoxy tape and method of making same
US8439511B2 (en) * 2010-12-22 2013-05-14 Vanguard Space Technologies, Inc. Mirror and a method of manufacturing thereof
US9303171B2 (en) 2011-03-18 2016-04-05 Tesla Nanocoatings, Inc. Self-healing polymer compositions
EP2691433A1 (de) 2011-03-31 2014-02-05 OCV Intellectual Capital, LLC Eingekapseltes härtungsmittel
CN102423673A (zh) * 2011-07-28 2012-04-25 西北工业大学 一种在中温下引发热固性环氧树脂固化的潜伏性微胶囊固化剂及其胶黏剂的制备方法
US9953739B2 (en) 2011-08-31 2018-04-24 Tesla Nanocoatings, Inc. Composition for corrosion prevention
CA2858168A1 (en) 2011-12-08 2013-06-13 Ocv Intellectual Capital, Llc Fiber reinforced resin molding compound and manufacturing method for fiber reinforced resin molded article therefrom
CN102559015B (zh) * 2011-12-16 2014-09-10 展辰涂料集团股份有限公司 一种防水藻涂料组合物及其制备方法
US10570296B2 (en) 2012-03-19 2020-02-25 Tesla Nanocoatings, Inc. Self-healing polymer compositions
US9328266B2 (en) * 2012-07-09 2016-05-03 Gm Global Technology Operations, Llc Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC
AU2015209285B2 (en) 2014-01-23 2018-11-29 Neptune Research, Llc Unidirectional fiber composite system for structural repairs and reinforcement
CN103966248A (zh) * 2014-04-10 2014-08-06 杭州市疾病预防控制中心 一种基于同源重组的细菌基因点突变分子克隆技术
US10662302B2 (en) 2014-09-23 2020-05-26 The Boeing Company Polymer nanoparticles for improved distortion capability in composites
US10072126B2 (en) 2014-09-23 2018-09-11 The Boeing Company Soluble nanoparticles for composite performance enhancement
US10808123B2 (en) 2014-09-23 2020-10-20 The Boeing Company Nanoparticles for improving the dimensional stability of resins
US9862828B2 (en) 2014-09-23 2018-01-09 The Boeing Company Polymer nanoparticle additions for resin modification
US9587076B2 (en) * 2014-09-23 2017-03-07 The Boeing Company Polymer nanoparticles for controlling resin reaction rates
US9845556B2 (en) 2014-09-23 2017-12-19 The Boeing Company Printing patterns onto composite laminates
US10160840B2 (en) 2014-09-23 2018-12-25 The Boeing Company Polymer nanoparticles for controlling permeability and fiber volume fraction in composites
US10472472B2 (en) 2014-09-23 2019-11-12 The Boeing Company Placement of modifier material in resin-rich pockets to mitigate microcracking in a composite structure
EP3217793B1 (de) 2014-11-11 2020-09-09 Council of Scientific & Industrial Research Waserlösliches amin enthaltende mikrokapselzusammensetzung und herstellungsverfahren
AU2016209391A1 (en) 2015-01-22 2017-07-20 Neptune Research, Llc Composite reinforcement systems and methods of manufacturing the same
US10309692B2 (en) 2015-11-11 2019-06-04 International Business Machines Corporation Self-heating thermal interface material
CN106893256B (zh) * 2015-12-18 2019-05-17 比亚迪股份有限公司 一种预浸料用环氧树脂组合物及其制备方法和预浸料
EP3263628A1 (de) 2016-06-27 2018-01-03 Hexcel Composites Limited Partikelförmige härtungskomponenten
US10011055B2 (en) * 2016-08-01 2018-07-03 The Boeing Company Force responsive pre-impregnated composite methods, systems and apparatuses
US10278284B2 (en) 2016-08-25 2019-04-30 International Business Machines Corporation Laminate materials with embedded heat-generating multi-compartment microcapsules
US10501595B2 (en) 2016-10-25 2019-12-10 The Boeing Company Insertion of catalyst into dry carbon fibers prior to resin impregnation
AU2017228707B2 (en) * 2016-10-25 2021-08-26 The Boeing Company Insertion of catalyst into dry carbon fibers prior to resin impregnation
CN106739629B (zh) * 2016-11-09 2018-11-09 武汉华工图像技术开发有限公司 一种激光全息防伪膜
CN108929520A (zh) * 2017-12-14 2018-12-04 中航复合材料有限责任公司 一种快速固化自粘性预浸料及其制备方法
JP6806234B2 (ja) 2018-01-16 2021-01-06 三菱ケミカル株式会社 プリプレグおよび繊維強化複合材料
CN108976389A (zh) * 2018-07-24 2018-12-11 中国航空工业集团公司基础技术研究院 一种用于环氧树脂的微胶囊快速固化剂及其制备方法
CN109880605B (zh) * 2019-03-27 2020-04-14 中国石油化工股份有限公司 一种注气防窜用固化剂缓释胶囊和防窜剂及其制备方法
CN110229333B (zh) * 2019-06-25 2022-02-15 湘潭大学 一种聚酰亚胺的合成方法
CN110791053A (zh) * 2019-11-15 2020-02-14 西安龙德科技发展有限公司 含微胶囊固化剂的环氧树脂组合物及其预浸料和复合材料
CN111303383B (zh) * 2020-02-19 2021-11-09 东华大学 一种潜伏性多聚胺环氧树脂固化剂微胶囊及其制备和应用
CN111218472B (zh) * 2020-03-09 2020-11-03 西南大学 一种提高棉花产量的融合基因、植物表达载体、转化体及应用
CN112443053B (zh) * 2020-11-05 2022-03-18 上海新之杰新型建材有限公司 一种隔热型钢结构建筑外墙板
CN112940254A (zh) * 2021-02-03 2021-06-11 广东华智芯电子科技有限公司 一种用于微胶囊型固化剂的聚酰亚胺外壳及其制备方法
CN113480199B (zh) * 2021-08-02 2022-11-01 四川文理学院 一种增强型玄武岩纤维浸润剂及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA716638A (en) * 1965-08-24 J. Meier Dale Curing agents for polyepoxides and method for their preparation
GB1265489A (de) * 1968-07-17 1972-03-01
JPS5431468B2 (de) * 1972-01-17 1979-10-06
US4536524A (en) * 1981-04-21 1985-08-20 Capsulated Systems, Inc. Microencapsulated epoxy adhesive system
US4760106A (en) * 1983-05-20 1988-07-26 Amoco Corporation Impact resistant matrix resins for advanced composites
US4503161A (en) * 1984-03-23 1985-03-05 Minnesota Mining And Manufacturing Company Latent Lewis acid catalyst encapsulated within polymerized cycloaliphatic epoxide and polyhydric alcohol
US4808639A (en) * 1986-07-16 1989-02-28 Production Previews, Inc. Liquid curable adhesive composition comprising a polyester resin and a microencapsulated peroxide curing agent
US5225278A (en) * 1987-08-26 1993-07-06 Rohm And Haas Company Process for microencapsulation
JPH01242616A (ja) * 1988-03-23 1989-09-27 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH03220246A (ja) * 1989-03-16 1991-09-27 Nitto Denko Corp マイクロカプセル型アミン系硬化剤
JPH02292325A (ja) * 1989-05-02 1990-12-03 Nitto Denko Corp マイクロカプセル型アミン系硬化剤を用いたエポキシ樹脂組成物
DE69027295T2 (de) * 1990-01-19 1997-01-23 Minnesota Mining & Mfg Wärmehärtbare Zusammensetzung
JPH03292378A (ja) * 1990-04-10 1991-12-24 Nitto Denko Corp マイクロカプセル、それを用いた接着剤組成物及びその硬化方法
JP2948942B2 (ja) * 1990-10-30 1999-09-13 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴムスポンジ形成性組成物
US5371152A (en) * 1990-12-28 1994-12-06 Toho Rayon Co., Ltd. Resin composition and process for producing the composition
JPH04332404A (ja) * 1991-05-07 1992-11-19 Nec Corp 異方性導電材料及びこれを用いた集積回路素子の接続方法
JP2600536B2 (ja) * 1991-10-02 1997-04-16 日立化成工業株式会社 接着剤組成物の製造方法
US5357008A (en) * 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
JPH0632931A (ja) * 1992-07-17 1994-02-08 Mitsubishi Rayon Co Ltd 熱硬化性発泡材料
GB9515941D0 (en) * 1995-08-03 1995-10-04 Zeneca Ltd DNA constructs
FR2736926B1 (fr) * 1995-07-19 1997-08-22 Rhone Poulenc Agrochimie 5-enol pyruvylshikimate-3-phosphate synthase mutee, gene codant pour cette proteine et plantes transformees contenant ce gene

Also Published As

Publication number Publication date
EP0672707B1 (de) 2003-09-03
TW305860B (de) 1997-05-21
DE69531641T2 (de) 2004-07-01
KR950032394A (ko) 1995-12-20
US5589523A (en) 1996-12-31
CN1314243A (zh) 2001-09-26
CN1321184C (zh) 2007-06-13
EP0672707A2 (de) 1995-09-20
CN1083850C (zh) 2002-05-01
US5726222A (en) 1998-03-10
EP0672707A3 (de) 1996-07-03
CN1112142A (zh) 1995-11-22
CN1680556A (zh) 2005-10-12

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