DE69738578D1 - Photohärtbare Harzzusammensetzung - Google Patents

Photohärtbare Harzzusammensetzung

Info

Publication number
DE69738578D1
DE69738578D1 DE69738578T DE69738578T DE69738578D1 DE 69738578 D1 DE69738578 D1 DE 69738578D1 DE 69738578 T DE69738578 T DE 69738578T DE 69738578 T DE69738578 T DE 69738578T DE 69738578 D1 DE69738578 D1 DE 69738578D1
Authority
DE
Germany
Prior art keywords
resin composition
photohardenable resin
photohardenable
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69738578T
Other languages
English (en)
Other versions
DE69738578T2 (de
Inventor
Tetsuya Yamamura
Tsuyoshi Watanabe
Takashi Ukachi
Akira Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Japan Fine Coatings Co Ltd
DSM IP Assets BV
Original Assignee
JSR Corp
Japan Fine Coatings Co Ltd
DSM IP Assets BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp, Japan Fine Coatings Co Ltd, DSM IP Assets BV filed Critical JSR Corp
Application granted granted Critical
Publication of DE69738578D1 publication Critical patent/DE69738578D1/de
Publication of DE69738578T2 publication Critical patent/DE69738578T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
DE69738578T 1996-10-14 1997-10-17 Photohärtbare Harzzusammensetzung Expired - Lifetime DE69738578T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP27086896A JP3786480B2 (ja) 1996-10-14 1996-10-14 光硬化性樹脂組成物
US08/953,633 US6127085A (en) 1996-10-14 1997-10-17 Photo-curable resin composition
EP97203240A EP0837366B1 (de) 1996-10-14 1997-10-17 Photohärtbare Harzzusammensetzung

Publications (2)

Publication Number Publication Date
DE69738578D1 true DE69738578D1 (de) 2008-04-30
DE69738578T2 DE69738578T2 (de) 2009-04-23

Family

ID=26549422

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69738578T Expired - Lifetime DE69738578T2 (de) 1996-10-14 1997-10-17 Photohärtbare Harzzusammensetzung

Country Status (4)

Country Link
US (1) US6127085A (de)
EP (1) EP0837366B1 (de)
JP (1) JP3786480B2 (de)
DE (1) DE69738578T2 (de)

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EP0831127B1 (de) * 1995-05-12 2003-09-03 Asahi Denka Kogyo Kabushiki Kaisha Stereolithographisches verfahren und kunststoffharz dazu
JP3765896B2 (ja) 1996-12-13 2006-04-12 Ｊｓｒ株式会社 光学的立体造形用光硬化性樹脂組成物
EP0938026B1 (de) * 1998-02-18 2009-05-27 DSM IP Assets B.V. Fotohärtbare flüssige Harzzusammensetzung
US6379866B2 (en) * 2000-03-31 2002-04-30 Dsm Desotech Inc Solid imaging compositions for preparing polypropylene-like articles
US6287748B1 (en) 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6762002B2 (en) 1998-07-10 2004-07-13 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
US20060154175A9 (en) * 1998-07-10 2006-07-13 Lawton John A Solid imaging compositions for preparing polypropylene-like articles
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Ｊｓｒ株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
EP1138739B1 (de) * 1999-08-12 2006-10-11 Mitsui Chemicals, Inc. Lichthärtbare harzzusammensetzung für dichtungsmaterialien und verfahren zum dichten
WO2001095030A2 (en) * 2000-06-09 2001-12-13 Dsm N.V. Resin composition and three-dimensional object
WO2002052045A1 (en) * 2000-12-26 2002-07-04 Aviva Biosciences Active and biocompatible platforms prepared by polymerization of surface coating films
US6989225B2 (en) * 2002-07-18 2006-01-24 3D Systems, Inc. Stereolithographic resins with high temperature and high impact resistance
US20040077745A1 (en) * 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
US20040137368A1 (en) * 2003-01-13 2004-07-15 3D Systems, Inc. Stereolithographic resins containing selected oxetane compounds
JP2005053936A (ja) * 2003-06-13 2005-03-03 Jsr Corp 光硬化性液状樹脂組成物
US20050046915A1 (en) * 2003-08-22 2005-03-03 Fuji Photo Film Co., Ltd. Hologram recording material composition, hologram recording material and hologram recording method
EP1510862A3 (de) * 2003-08-25 2006-08-09 Fuji Photo Film Co., Ltd. Verfahren zur Aufzeichnung von Hologrammen und Auzeichnungsmaterial für Hologramme
US7232850B2 (en) 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
KR101138169B1 (ko) 2003-11-06 2012-04-25 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 고 투명도 및 개선된 기계적 특성을 갖는 경화물을 제조하기 위한 광경화성 조성물
US20050165127A1 (en) * 2003-12-31 2005-07-28 Dsm Desotech, Inc. Solid imaging compositions for preparing polyethylene-like articles
DE102004008365A1 (de) * 2004-02-20 2005-09-08 Altana Electrical Insulation Gmbh Verfahren zur Herstellung von beschichteten elektrischen Drähten
JP4926505B2 (ja) * 2006-03-13 2012-05-09 株式会社ダイセル 光学的立体造形用樹脂組成物
JP2007284626A (ja) * 2006-04-19 2007-11-01 Daicel Value Coating Ltd 活性エネルギー線硬化性樹脂組成物および当該組成物が塗布されたフィルム
US20080103226A1 (en) * 2006-10-31 2008-05-01 Dsm Ip Assets B.V. Photo-curable resin composition
JP5901070B2 (ja) * 2012-10-26 2016-04-06 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5967824B2 (ja) 2012-10-26 2016-08-10 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5939964B2 (ja) * 2012-11-22 2016-06-29 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
CN105164210B (zh) * 2013-06-19 2019-09-27 惠普发展公司，有限责任合伙企业 用于三维(3d)打印的组合物
EP2842980B1 (de) 2013-08-09 2021-05-05 DSM IP Assets B.V. Niedrigviskose flüssige strahlungshärtbare harzzusammensetzungen für zahnregulierungsform zur herstellung von zusatzstoffen
JP6628089B2 (ja) * 2015-12-14 2020-01-08 Dic株式会社 硬化性組成物及び接着剤
KR102427130B1 (ko) * 2016-03-14 2022-08-01 코베스트로 (네덜란드) 비.브이. 개선된 인성 및 고온 내성을 갖는 부가 제조용 방사선 경화성 조성물
CN107793556A (zh) * 2016-08-29 2018-03-13 Jsr株式会社 硬化性组合物、硬化物、发光装置及其制造方法

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JPS4917040A (de) * 1972-06-10 1974-02-15
AU497960B2 (en) * 1974-04-11 1979-01-25 Minnesota Mining And Manufacturing Company Photopolymerizable compositions
GB1516512A (en) * 1974-05-02 1978-07-05 Gen Electric Chalcogenium salts
GB1516352A (en) * 1974-05-02 1978-07-05 Gen Electric Halonium salts
GB1512981A (en) * 1974-05-02 1978-06-01 Gen Electric Curable epoxide compositions
US4256828A (en) * 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4139655A (en) * 1978-05-09 1979-02-13 W. R. Grace & Co. Photocurable epoxy compositions containing thiopyrylium salts
US4197174A (en) * 1979-03-14 1980-04-08 American Can Company Method for producing bis-[4-(diphenylsulfonio) phenyl] sulfide bis-MX6
JPS568428A (en) * 1979-06-19 1981-01-28 Ciba Geigy Ag Photopolymerizing and thermopolymerizing composition
JPH0245641B2 (ja) * 1980-03-07 1990-10-11 Ciba Geigy Hikarijugoseisoseibutsuoyobisonojugoho
US4387216A (en) * 1981-05-06 1983-06-07 Ciba-Geigy Corporation Heat-polymerizable compositions comprising epoxide resins, aromatic sulfoxonium salts, and organic oxidants
US4818776A (en) * 1983-02-07 1989-04-04 Union Carbide Corporation Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials having primary hydroxyl content
JPS60247515A (ja) * 1984-05-23 1985-12-07 Oosakafu 光学的造形法
US4575330A (en) * 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
JPS62101408A (ja) * 1985-10-29 1987-05-11 Osaka Pref Gov 光学的造形法
CA1312040C (en) * 1985-12-19 1992-12-29 Joseph Victor Koleske Conformal coatings cured with actinic radiation
JPS6337034A (ja) * 1986-07-28 1988-02-17 Mitsubishi Electric Corp 半導体装置の分離供給装置
JPS63176337A (ja) * 1987-01-14 1988-07-20 Kirin Brewery Co Ltd 液体含浸粒状泡硝子
JPS63229381A (ja) * 1987-03-18 1988-09-26 Hitachi Ltd 半導体制御素子内の分担電流計測法
JP2525216B2 (ja) * 1988-01-27 1996-08-14 ディーエスエム・エヌヴィ 光学的立体造形用樹脂組成物
US5434196A (en) * 1988-02-19 1995-07-18 Asahi Denka Kogyo K.K. Resin composition for optical molding
JPH0826121B2 (ja) * 1988-02-19 1996-03-13 旭電化工業株式会社 光学的造形用樹脂組成物
JP2590215B2 (ja) * 1988-07-15 1997-03-12 旭電化工業株式会社 光学的造形用樹脂組成物
JPH07103218B2 (ja) * 1988-09-13 1995-11-08 旭電化工業株式会社 光学的造形用樹脂組成物
JPH02208305A (ja) * 1989-02-07 1990-08-17 Mitsui Eng & Shipbuild Co Ltd 光硬化性組成物
DE59010008D1 (de) * 1989-10-27 1996-02-08 Ciba Geigy Ag Photoempfindliches Gemisch
JP2873126B2 (ja) * 1991-04-17 1999-03-24 日本ペイント株式会社 体積ホログラム記録用感光性組成物
TW269017B (de) * 1992-12-21 1996-01-21 Ciba Geigy Ag
JP2687082B2 (ja) * 1993-07-15 1997-12-08 帝人製機株式会社 光学的立体造形用樹脂組成物
DE59409479D1 (de) * 1993-08-09 2000-09-21 Ciba Sc Holding Ag Neue urethangruppenhaltige (Meth)Acrylate
DE4344125A1 (de) * 1993-12-23 1995-06-29 Basf Lacke & Farben Strahlenhärtbare Schutzlackierung, insbesondere für metallisierte Oberflächen
JP3543020B2 (ja) * 1994-12-14 2004-07-14 旭電化工業株式会社 インベストメント鋳造法の消失原型作成用光学的立体造形用樹脂組成物およびインベストメント鋳造法
JPH08277321A (ja) * 1995-04-05 1996-10-22 Daicel Chem Ind Ltd 光硬化性樹脂組成物
US5707780A (en) * 1995-06-07 1998-01-13 E. I. Du Pont De Nemours And Company Photohardenable epoxy composition
JP3465452B2 (ja) * 1995-11-20 2003-11-10 東洋インキ製造株式会社 紫外線硬化型樹脂組成物およびこれを含む被覆剤
JPH09151237A (ja) * 1995-11-30 1997-06-10 Daicel Chem Ind Ltd 活性エネルギー線硬化性樹脂組成物およびその用途
JP3626275B2 (ja) * 1996-04-09 2005-03-02 Ｊｓｒ株式会社 光硬化性樹脂組成物
AU2653497A (en) * 1996-05-09 1997-11-26 Dsm N.V. Photosensitive resin composition for rapid prototyping and process for the manufacture of 3-dimensional objects

Also Published As

Publication number Publication date
DE69738578T2 (de) 2009-04-23
JP3786480B2 (ja) 2006-06-14
EP0837366A1 (de) 1998-04-22
EP0837366B1 (de) 2008-03-19
JPH10115920A (ja) 1998-05-06
US6127085A (en) 2000-10-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition