DE69414476T2 - Verfahren zum Verpacken elektronischer Schaltkreiskomponenten und verpackte Schaltkreisanordnung - Google Patents
Verfahren zum Verpacken elektronischer Schaltkreiskomponenten und verpackte SchaltkreisanordnungInfo
- Publication number
- DE69414476T2 DE69414476T2 DE69414476T DE69414476T DE69414476T2 DE 69414476 T2 DE69414476 T2 DE 69414476T2 DE 69414476 T DE69414476 T DE 69414476T DE 69414476 T DE69414476 T DE 69414476T DE 69414476 T2 DE69414476 T2 DE 69414476T2
- Authority
- DE
- Germany
- Prior art keywords
- resin body
- electronic component
- holding
- encapsulated electronic
- encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000004806 packaging method and process Methods 0.000 title description 7
- 230000008569 process Effects 0.000 title description 4
- 229920005989 resin Polymers 0.000 claims description 95
- 239000011347 resin Substances 0.000 claims description 95
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 3
- 238000005266 casting Methods 0.000 description 20
- 238000007689 inspection Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 11
- 238000004080 punching Methods 0.000 description 6
- 239000002699 waste material Substances 0.000 description 4
- 230000004044 response Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05189227A JP3126854B2 (ja) | 1993-06-30 | 1993-06-30 | 実装回路の実装方法および実装回路 |
| JP5189228A JPH0722543A (ja) | 1993-06-30 | 1993-06-30 | 電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69414476D1 DE69414476D1 (de) | 1998-12-17 |
| DE69414476T2 true DE69414476T2 (de) | 1999-05-12 |
Family
ID=26505364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69414476T Expired - Fee Related DE69414476T2 (de) | 1993-06-30 | 1994-06-29 | Verfahren zum Verpacken elektronischer Schaltkreiskomponenten und verpackte Schaltkreisanordnung |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US5670429A (enExample) |
| EP (1) | EP0632496B1 (enExample) |
| DE (1) | DE69414476T2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3749585B2 (ja) * | 1997-01-17 | 2006-03-01 | 松下電器産業株式会社 | 部品のテーピング方法と装置 |
| US6198172B1 (en) * | 1997-02-20 | 2001-03-06 | Micron Technology, Inc. | Semiconductor chip package |
| US6081338A (en) * | 1998-03-26 | 2000-06-27 | Siemens Aktiengesellschaft | Method and apparatus for optically checking an electrical component at an equipping head |
| US6018194A (en) * | 1999-06-07 | 2000-01-25 | Lucent Technologies Inc. | Transistor clamping fixture |
| JP2006202804A (ja) * | 2005-01-18 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 電子部品実装システムおよび電子部品搭載装置ならびに電子部品実装方法 |
| CN103100218B (zh) * | 2011-11-11 | 2015-09-23 | 京乐产业.株式会社 | 游戏机 |
| US9214276B2 (en) | 2012-01-16 | 2015-12-15 | Hamilton Sundstrand Corporation | Capacitor |
| CN104504589A (zh) * | 2015-01-04 | 2015-04-08 | 北京金和软件股份有限公司 | 一种从移动应用的电商中分享销售收益的方法 |
| US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
| US10141215B2 (en) | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
| US10471545B2 (en) | 2016-11-23 | 2019-11-12 | Rohinni, LLC | Top-side laser for direct transfer of semiconductor devices |
| US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
| US10062588B2 (en) | 2017-01-18 | 2018-08-28 | Rohinni, LLC | Flexible support substrate for transfer of semiconductor devices |
| US10410905B1 (en) | 2018-05-12 | 2019-09-10 | Rohinni, LLC | Method and apparatus for direct transfer of multiple semiconductor devices |
| US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
| CN109775347A (zh) * | 2019-01-22 | 2019-05-21 | 浙江开拓汽车电器有限公司 | 电机转子测试自动联接机构 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54124680A (en) * | 1978-03-20 | 1979-09-27 | Nec Corp | Semiconductor device |
| JPS55127026A (en) * | 1979-03-24 | 1980-10-01 | Mitsubishi Electric Corp | Sealing unit for semiconductor device |
| JPS5613738A (en) * | 1979-07-13 | 1981-02-10 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| NL8201593A (nl) * | 1982-04-16 | 1983-11-16 | Philips Nv | Inrichting voor het overbrengen van een elektrisch of elektronisch onderdeel naar een montagepaneel. |
| JPS60111445A (ja) * | 1983-11-22 | 1985-06-17 | Nec Corp | 半導体装置 |
| JPS60211961A (ja) * | 1984-04-06 | 1985-10-24 | Hitachi Ltd | 半導体装置 |
| JPS60245155A (ja) * | 1984-05-18 | 1985-12-04 | Mitsubishi Electric Corp | プラスチツクｉｃパツケ−ジ |
| JPS6135911A (ja) * | 1984-07-30 | 1986-02-20 | Nec Home Electronics Ltd | 透明又は半透明なプラスチツク成形品の仕上げ方法及びその装置 |
| JPS6252952A (ja) * | 1985-08-30 | 1987-03-07 | Nec Corp | 半導体装置用フラツトパツケ−ジ |
| JPS63153844A (ja) * | 1986-12-17 | 1988-06-27 | Mitsubishi Electric Corp | Ｉｃパツケ−ジ |
| JPS63237422A (ja) * | 1987-03-25 | 1988-10-03 | Seiko Keiyo Kogyo Kk | レジンモ−ルド半導体の製造方法 |
| JPS63269551A (ja) * | 1987-04-27 | 1988-11-07 | Nec Corp | 半導体装置封止用パツケ−ジ |
| JPS6428132A (en) * | 1987-07-23 | 1989-01-30 | Fujitsu Ltd | Wafer chuck |
| JPS6437041A (en) * | 1987-07-31 | 1989-02-07 | Nec Corp | Semiconductor device |
| KR0133681B1 (ko) * | 1987-10-12 | 1998-04-23 | 후쿠다 켄조오 | 웨이퍼 캐리어 반송용 처크 |
| JPH01212453A (ja) * | 1988-02-19 | 1989-08-25 | Hitachi Ltd | 半導体装置 |
| US4954308A (en) * | 1988-03-04 | 1990-09-04 | Citizen Watch Co., Ltd. | Resin encapsulating method |
| JPH0274055A (ja) * | 1988-09-09 | 1990-03-14 | Nec Kyushu Ltd | Ｉｃパッケージ |
| JPH0287654A (ja) * | 1988-09-26 | 1990-03-28 | Nec Corp | 表面実装型半導体装置 |
| JPH02128452A (ja) * | 1988-11-08 | 1990-05-16 | Seiko Epson Corp | 半導体装置用パッケージ |
| JP2885414B2 (ja) * | 1989-03-13 | 1999-04-26 | 株式会社日立製作所 | 半導体装置、その実装方法および電子装置 |
| JP2670517B2 (ja) * | 1989-03-30 | 1997-10-29 | 山一電機株式会社 | Ｉｃキャリア搭載形ソケットにおける接触機構 |
| JPH0641154B2 (ja) * | 1989-07-17 | 1994-06-01 | 日本パレテック株式会社 | スプルー切除装置 |
| JPH03105952A (ja) * | 1989-09-19 | 1991-05-02 | Nec Kyushu Ltd | 表面実装型半導体装置 |
| JPH03147353A (ja) * | 1989-11-02 | 1991-06-24 | New Japan Radio Co Ltd | 表面実装型半導体パッケージ |
| US5051813A (en) * | 1989-12-19 | 1991-09-24 | Lsi Logic Corporation | Plastic-packaged semiconductor device having lead support and alignment structure |
| JPH03215964A (ja) * | 1990-01-20 | 1991-09-20 | Mitsubishi Electric Corp | 半導体パッケージ及びその装着基板 |
| DE4039828A1 (de) * | 1990-12-13 | 1992-06-17 | Standard Elektrik Lorenz Ag | Vorrichtung zum halten eines traegers einer substratunterlage einer fluessigphasen- oder gasphasenepitaxieanlage |
| US5254500A (en) * | 1991-02-05 | 1993-10-19 | Advanced Micro Devices, Inc. | Method for making an integrally molded semiconductor device heat sink |
| DE69222084T2 (de) * | 1991-05-17 | 1998-01-22 | Fujitsu Ltd | Oberflächenmontierbare Halbleiterpackung |
| JPH04360561A (ja) * | 1991-06-07 | 1992-12-14 | Mitsubishi Electric Corp | 半導体パッケージおよび半導体パッケージの形成方法 |
| US5226226A (en) * | 1991-07-29 | 1993-07-13 | Fierkens Richard H J | Tube-shaped package for a semiconductor device and method therefor |
| JP3003300B2 (ja) * | 1991-08-06 | 2000-01-24 | 日本電気株式会社 | 半導体パッケージの搬送方法及び回転防止機能付半導体パッケージ |
| JP2740434B2 (ja) * | 1992-11-11 | 1998-04-15 | 大日精化工業株式会社 | エポキシ系樹脂微粒子及びその製造方法 |
| US5369056A (en) * | 1993-03-29 | 1994-11-29 | Staktek Corporation | Warp-resistent ultra-thin integrated circuit package fabrication method |
| JPH0775183B2 (ja) * | 1993-03-30 | 1995-08-09 | 山一電機株式会社 | Ｉｃソケット |
-
1994
- 1994-06-16 US US08/260,047 patent/US5670429A/en not_active Expired - Fee Related
- 1994-06-29 EP EP94110096A patent/EP0632496B1/en not_active Expired - Lifetime
- 1994-06-29 DE DE69414476T patent/DE69414476T2/de not_active Expired - Fee Related
-
1996
- 1996-08-08 US US08/693,522 patent/US5760481A/en not_active Expired - Fee Related
- 1996-09-04 US US08/707,666 patent/US5739054A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69414476D1 (de) | 1998-12-17 |
| US5760481A (en) | 1998-06-02 |
| US5739054A (en) | 1998-04-14 |
| US5670429A (en) | 1997-09-23 |
| EP0632496B1 (en) | 1998-11-11 |
| EP0632496A2 (en) | 1995-01-04 |
| EP0632496A3 (enExample) | 1995-01-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |