DE69326598D1 - Lichtempfindliche harzzusammensetzung - Google Patents

Lichtempfindliche harzzusammensetzung

Info

Publication number
DE69326598D1
DE69326598D1 DE69326598T DE69326598T DE69326598D1 DE 69326598 D1 DE69326598 D1 DE 69326598D1 DE 69326598 T DE69326598 T DE 69326598T DE 69326598 T DE69326598 T DE 69326598T DE 69326598 D1 DE69326598 D1 DE 69326598D1
Authority
DE
Germany
Prior art keywords
resin composition
light sensitive
sensitive resin
light
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69326598T
Other languages
English (en)
Other versions
DE69326598T2 (de
Inventor
Kouichi Katou
Eiji Watanabe
Kouichi Kunimune
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JNC Corp
Original Assignee
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Corp filed Critical Chisso Corp
Publication of DE69326598D1 publication Critical patent/DE69326598D1/de
Application granted granted Critical
Publication of DE69326598T2 publication Critical patent/DE69326598T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8141—Unsaturated isocyanates or isothiocyanates masked
    • C08G18/815—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen
    • C08G18/8158—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen
    • C08G18/8175—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen with esters of acrylic or alkylacrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
    • C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/107—Polyamide or polyurethane

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DE69326598T 1992-06-25 1993-06-24 Lichtempfindliche harzzusammensetzung Expired - Fee Related DE69326598T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19015592A JP3211108B2 (ja) 1992-06-25 1992-06-25 感光性樹脂組成物
PCT/JP1993/000853 WO1994000800A1 (en) 1992-06-25 1993-06-24 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
DE69326598D1 true DE69326598D1 (de) 1999-11-04
DE69326598T2 DE69326598T2 (de) 2000-02-03

Family

ID=16253341

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69326598T Expired - Fee Related DE69326598T2 (de) 1992-06-25 1993-06-24 Lichtempfindliche harzzusammensetzung

Country Status (7)

Country Link
US (1) US5589319A (de)
EP (1) EP0601203B1 (de)
JP (1) JP3211108B2 (de)
KR (1) KR100291376B1 (de)
DE (1) DE69326598T2 (de)
SG (1) SG46999A1 (de)
WO (1) WO1994000800A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0867754A (ja) * 1994-06-24 1996-03-12 Toray Ind Inc 硬化性組成物
TW424172B (en) 1995-04-19 2001-03-01 Hitachi Chemical Co Ltd Photosensitive resin composition and photosensitive element using the same
US5925498A (en) * 1997-06-16 1999-07-20 Kodak Polychrome Graphics Llc Photosensitive polymer composition and element containing photosensitive polyamide and mixture of acrylates
JPH1152572A (ja) * 1997-08-08 1999-02-26 Fujitsu Ltd 感光性樹脂組成物及びそれを用いたパターン形成方法
US6515355B1 (en) * 1998-09-02 2003-02-04 Micron Technology, Inc. Passivation layer for packaged integrated circuits
US6242935B1 (en) 1999-01-21 2001-06-05 Micron Technology, Inc. Interconnect for testing semiconductor components and method of fabrication
US6242932B1 (en) 1999-02-19 2001-06-05 Micron Technology, Inc. Interposer for semiconductor components having contact balls
US6819127B1 (en) 1999-02-19 2004-11-16 Micron Technology, Inc. Method for testing semiconductor components using interposer
JP4770011B2 (ja) * 1999-09-28 2011-09-07 住友ベークライト株式会社 絶縁材用樹脂組成物及びこれを用いた絶縁材
JP4590690B2 (ja) * 2000-06-22 2010-12-01 住友ベークライト株式会社 絶縁材用樹脂組成物及びこれを用いた絶縁材
JP4981215B2 (ja) * 2001-03-19 2012-07-18 株式会社カネカ 感光性樹脂組成物およびそれを用いた感光性ドライフィルムレジスト
US6784275B2 (en) 2001-06-28 2004-08-31 Dainippon Ink And Chemicals, Inc. Active energy ray-curable polyimide resin composition
CN1324402C (zh) 2001-10-30 2007-07-04 钟渊化学工业株式会社 感光性树脂组合物、使用该组合物的感光性薄膜及层压体
JP4222120B2 (ja) * 2002-10-07 2009-02-12 Ｊｓｒ株式会社 光導波路形成用感光性樹脂組成物および光導波路
JP4372065B2 (ja) * 2004-09-09 2009-11-25 信越化学工業株式会社 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜
US7604836B2 (en) 2006-12-13 2009-10-20 Hitachi Global Storage Technologies Netherlands B.V. Release layer and resist material for master tool and stamper tool
CN105503755B (zh) * 2016-01-10 2018-10-30 江苏博砚电子科技有限公司 一种彩色光阻用赛克基丙烯酸酯树脂及其制备方法
WO2018154688A1 (ja) * 2017-02-23 2018-08-30 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、硬化物、パターン硬化物、硬化物の製造方法、層間絶縁膜、表面保護膜及び電子部品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952822B2 (ja) * 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS5541422A (en) * 1978-09-18 1980-03-24 Fujitsu Ltd Encipherment treatment system
JPS5545746A (en) * 1978-09-29 1980-03-31 Hitachi Ltd Reactive polymer composition
JPS58120636A (ja) * 1982-01-04 1983-07-18 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− 放射感受性ポリイミド前駆体組成物およびその製造方法
US4416973A (en) * 1982-01-04 1983-11-22 E. I. Du Pont De Nemours & Co. Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound
US4430418A (en) * 1982-09-30 1984-02-07 E. I. Du Pont De Nemours And Company Radiation-sensitive polyimide precursor composition derived from a diaryl fluoronated diamine compound
JPS5915449A (ja) * 1982-07-16 1984-01-26 Nitto Electric Ind Co Ltd 感光性樹脂組成物
JPS606729A (ja) * 1983-06-24 1985-01-14 Ube Ind Ltd 有機溶媒に可溶性の感光性ポリイミド
US4515887A (en) * 1983-08-29 1985-05-07 General Electric Company Photopatternable dielectric compositions, method for making and use
US4692272A (en) * 1984-10-15 1987-09-08 Stauffer Chemical Company Thermally stable adhesive comprising soluble polyimide resin and epoxy resin
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
JPS63226639A (ja) * 1986-10-08 1988-09-21 Hitachi Chem Co Ltd 感光性樹脂組成物
JPS63183439A (ja) * 1987-01-26 1988-07-28 Hitachi Chem Co Ltd 画像の製造方法
JPS63206740A (ja) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc 感光性重合体組成物
US4927431A (en) * 1988-09-08 1990-05-22 Minnesota Mining And Manufacturing Company Binder for coated abrasives
JPH02144539A (ja) * 1988-11-28 1990-06-04 Sumitomo Bakelite Co Ltd 感光性樹脂組成物
JPH02154260A (ja) * 1988-12-07 1990-06-13 Hitachi Chem Co Ltd 感光性樹脂組成物およびこれを用いた感光性エレメント
JPH0391752A (ja) * 1989-09-04 1991-04-17 Sumitomo Bakelite Co Ltd 感光性樹脂組成物
JPH03160058A (ja) * 1989-11-17 1991-07-10 Mitsubishi Rayon Co Ltd 架橋硬化型樹脂組成物
JP2980359B2 (ja) * 1990-04-16 1999-11-22 富士通株式会社 感光性耐熱樹脂組成物とそれを用いたパターン形成方法
US5236472A (en) * 1991-02-22 1993-08-17 Minnesota Mining And Manufacturing Company Abrasive product having a binder comprising an aminoplast binder
JP2890213B2 (ja) * 1991-02-25 1999-05-10 チッソ株式会社 感光性重合体組成物及びパターンの形成方法

Also Published As

Publication number Publication date
EP0601203A4 (de) 1995-06-07
EP0601203B1 (de) 1999-09-29
WO1994000800A1 (en) 1994-01-06
US5589319A (en) 1996-12-31
DE69326598T2 (de) 2000-02-03
JPH0611830A (ja) 1994-01-21
JP3211108B2 (ja) 2001-09-25
EP0601203A1 (de) 1994-06-15
KR100291376B1 (ko) 2001-09-17
SG46999A1 (en) 1998-03-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee