DE69408709T2 - Photoempfindliche Harzzusammensetzung - Google Patents

Photoempfindliche Harzzusammensetzung

Info

Publication number
DE69408709T2
DE69408709T2 DE69408709T DE69408709T DE69408709T2 DE 69408709 T2 DE69408709 T2 DE 69408709T2 DE 69408709 T DE69408709 T DE 69408709T DE 69408709 T DE69408709 T DE 69408709T DE 69408709 T2 DE69408709 T2 DE 69408709T2
Authority
DE
Germany
Prior art keywords
resin composition
photosensitive resin
photosensitive
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69408709T
Other languages
English (en)
Other versions
DE69408709D1 (de
Inventor
Hideo Hagiwara
Makoto Kaji
Yasunori Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of DE69408709D1 publication Critical patent/DE69408709D1/de
Application granted granted Critical
Publication of DE69408709T2 publication Critical patent/DE69408709T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
DE69408709T 1993-04-28 1994-03-28 Photoempfindliche Harzzusammensetzung Expired - Fee Related DE69408709T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10248293 1993-04-28

Publications (2)

Publication Number Publication Date
DE69408709D1 DE69408709D1 (de) 1998-04-09
DE69408709T2 true DE69408709T2 (de) 1998-10-01

Family

ID=14328677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69408709T Expired - Fee Related DE69408709T2 (de) 1993-04-28 1994-03-28 Photoempfindliche Harzzusammensetzung

Country Status (4)

Country Link
US (1) US6197475B1 (de)
EP (1) EP0622682B1 (de)
KR (1) KR100246113B1 (de)
DE (1) DE69408709T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930522B (zh) * 2004-03-12 2013-06-12 东丽株式会社 正型感光性树脂组合物、使用该组合物的浮雕图形以及固体成象元件
EP1637927A1 (de) 2004-09-02 2006-03-22 Fuji Photo Film Co., Ltd. Positiv arbeitende Resistzusammensetzung und Verfahren zur Herstellung von Mustern unter Verwendung dieser Zusammensetzung
JP4580841B2 (ja) 2005-08-16 2010-11-17 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
JP4905786B2 (ja) 2007-02-14 2012-03-28 富士フイルム株式会社 レジスト組成物及びそれを用いたパターン形成方法
US7592118B2 (en) 2007-03-27 2009-09-22 Fujifilm Corporation Positive resist composition and pattern forming method using the same
US8182975B2 (en) 2007-03-28 2012-05-22 Fujifilm Corporation Positive resist composition and pattern forming method using the same
JP5039622B2 (ja) 2007-03-30 2012-10-03 富士フイルム株式会社 ポジ型レジスト組成物及びこれを用いたパターン形成方法
JP4982228B2 (ja) 2007-03-30 2012-07-25 富士フイルム株式会社 ポジ型レジスト組成物及びこれを用いたパターン形成方法
JP4547448B2 (ja) 2007-08-10 2010-09-22 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
JP4911469B2 (ja) 2007-09-28 2012-04-04 富士フイルム株式会社 レジスト組成物及びこれを用いたパターン形成方法
JP5397017B2 (ja) * 2009-05-25 2014-01-22 株式会社リコー ポリアミド酸及びポリイミド
TWI600966B (zh) 2014-02-21 2017-10-01 東京威力科創股份有限公司 光敏化學增幅型光阻材料及使用該光阻材料之圖案形成方法、半導體器件、光微影用光罩，以及奈米壓印用模板
JP6774814B2 (ja) 2015-08-20 2020-10-28 国立大学法人大阪大学 化学増幅型レジスト材料及びパターン形成方法
JP6512994B2 (ja) 2015-08-20 2019-05-15 国立大学法人大阪大学 化学増幅型レジスト材料
JP6809843B2 (ja) 2015-08-20 2021-01-06 国立大学法人大阪大学 パターン形成方法
JP6507958B2 (ja) 2015-09-10 2019-05-08 Jsr株式会社 化学増幅型レジスト材料及びレジストパターン形成方法
JP2017054116A (ja) 2015-09-10 2017-03-16 Jsr株式会社 レジストパターン形成方法
US9989849B2 (en) 2015-11-09 2018-06-05 Jsr Corporation Chemically amplified resist material and resist pattern-forming method
US10018911B2 (en) 2015-11-09 2018-07-10 Jsr Corporation Chemically amplified resist material and resist pattern-forming method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4515887A (en) * 1983-08-29 1985-05-07 General Electric Company Photopatternable dielectric compositions, method for making and use
JPH03136054A (ja) * 1989-10-23 1991-06-10 Sony Corp ネガ型フォトレジスト組成物
US5650261A (en) * 1989-10-27 1997-07-22 Rohm And Haas Company Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system
DE69030643T2 (de) * 1989-11-30 1997-09-25 Sumitomo Bakelite Co Lichtempfindliche Harzzusammensetzung und ihre Verwendung zur Herstellung eines Halbleiterapparats
US5114826A (en) * 1989-12-28 1992-05-19 Ibm Corporation Photosensitive polyimide compositions
EP0502400B1 (de) * 1991-03-05 1997-09-17 Nitto Denko Corporation Hitzebeständige, positiv arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat, und Verfahren zur Herstellung eines hitzebeständigen positiven Musters
US5206117A (en) * 1991-08-14 1993-04-27 Labadie Jeffrey W Photosensitive polyamic alkyl ester composition and process for its use
DE69324942T2 (de) * 1992-02-14 1999-10-07 Shipley Co Strahlungsempfindliche Zusammensetzungen und Verfahren

Also Published As

Publication number Publication date
DE69408709D1 (de) 1998-04-09
EP0622682A1 (de) 1994-11-02
EP0622682B1 (de) 1998-03-04
US6197475B1 (en) 2001-03-06
KR100246113B1 (ko) 2000-06-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee