DE69425786D1 - Photoresistzusammensetzung - Google Patents

Photoresistzusammensetzung

Info

Publication number
DE69425786D1
DE69425786D1 DE69425786T DE69425786T DE69425786D1 DE 69425786 D1 DE69425786 D1 DE 69425786D1 DE 69425786 T DE69425786 T DE 69425786T DE 69425786 T DE69425786 T DE 69425786T DE 69425786 D1 DE69425786 D1 DE 69425786D1
Authority
DE
Germany
Prior art keywords
photoresist composition
photoresist
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69425786T
Other languages
English (en)
Other versions
DE69425786T2 (de
Inventor
Yuko Nakano
Naoki Takeyama
Yuji Ueda
Takehiro Kusumoto
Hiromi Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of DE69425786D1 publication Critical patent/DE69425786D1/de
Application granted granted Critical
Publication of DE69425786T2 publication Critical patent/DE69425786T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/124—Carbonyl compound containing
    • Y10S430/125—Carbonyl in heterocyclic compound
DE69425786T 1993-06-02 1994-06-01 Photoresistzusammensetzung Expired - Fee Related DE69425786T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13198693 1993-06-02
JP3366094 1994-03-03

Publications (2)

Publication Number Publication Date
DE69425786D1 true DE69425786D1 (de) 2000-10-12
DE69425786T2 DE69425786T2 (de) 2001-01-25

Family

ID=26372394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69425786T Expired - Fee Related DE69425786T2 (de) 1993-06-02 1994-06-01 Photoresistzusammensetzung

Country Status (6)

Country Link
US (1) US5585218A (de)
EP (1) EP0632327B1 (de)
KR (1) KR100354680B1 (de)
CA (1) CA2124667A1 (de)
DE (1) DE69425786T2 (de)
TW (1) TW288112B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0732626B1 (de) * 1995-03-16 2004-03-03 Shipley Company LLC Strahlungsempfindliche Zusammensetzung, die ein Polymer mit Schutzgruppen enthält
US5731386A (en) * 1995-05-09 1998-03-24 Shipley Company, L.L.C. Polymer for positive acid catalyzed resists
DE69621701T2 (de) * 1995-05-09 2003-02-13 Shipley Co Säurekatalysierte Positiv-Photoresists
US5700624A (en) * 1995-05-09 1997-12-23 Shipley Company, L.L.C. Positive acid catalyzed resists having an alkali soluble resin with acid labile groups and inert blocking groups
JPH0934112A (ja) * 1995-05-12 1997-02-07 Sumitomo Chem Co Ltd フォトレジスト組成物
JPH0962005A (ja) * 1995-06-14 1997-03-07 Fuji Photo Film Co Ltd ネガ型感光性組成物
JP3506817B2 (ja) * 1995-07-26 2004-03-15 クラリアント インターナショナル リミテッド 放射線感応性組成物
US5932391A (en) * 1995-08-18 1999-08-03 Kabushiki Kaisha Toshiba Resist for alkali development
TW487827B (en) * 1995-10-27 2002-05-21 Sumitomo Chemical Co Process for production succinimide derivative and use thereof
JPH09166871A (ja) * 1995-12-15 1997-06-24 Sumitomo Chem Co Ltd フォトレジスト組成物
US5962180A (en) * 1996-03-01 1999-10-05 Jsr Corporation Radiation sensitive composition
EP0803775B1 (de) * 1996-04-25 2002-08-07 Fuji Photo Film Co., Ltd. Positiv-arbeitende lichtempfindliche Zusammensetzung
JP3645365B2 (ja) * 1996-08-15 2005-05-11 富士写真フイルム株式会社 遠紫外線露光用感光性樹脂組成物
JPH1069082A (ja) * 1996-08-26 1998-03-10 Sumitomo Chem Co Ltd ネガ型レジスト組成物
US6114082A (en) * 1996-09-16 2000-09-05 International Business Machines Corporation Frequency doubling hybrid photoresist having negative and positive tone components and method of preparing the same
US6190829B1 (en) 1996-09-16 2001-02-20 International Business Machines Corporation Low “K” factor hybrid photoresist
JP3679206B2 (ja) * 1996-09-20 2005-08-03 東京応化工業株式会社 ポジ型レジスト組成物、それを用いた多層レジスト材料及びレジストパターン形成方法
US6103447A (en) * 1998-02-25 2000-08-15 International Business Machines Corp. Approach to formulating irradiation sensitive positive resists
KR100672221B1 (ko) * 1999-04-30 2007-01-23 스미또모 가가꾸 가부시키가이샤 네거티브형 내식막 조성물
JP4366766B2 (ja) * 1999-04-30 2009-11-18 住友化学株式会社 Ｏ−置換ビニルフェノール単位を有する重合体及びそれのレジストへの使用
JP3294233B2 (ja) 1999-06-04 2002-06-24 群栄化学工業株式会社 フェノール樹脂
JP3348040B2 (ja) 1999-06-04 2002-11-20 群栄化学工業株式会社 ノボラック型フェノール樹脂
JP4439915B2 (ja) 2001-11-30 2010-03-24 和光純薬工業株式会社 ビスイミド化合物、これを用いた酸発生剤並びにレジスト組成物及び該組成物を用いたパターン形成方法
WO2003056391A1 (fr) * 2001-12-27 2003-07-10 Zeon Corporation Composition de resine radiosensible et procede de formation de motifs
EP1686424A3 (de) * 2005-01-27 2009-11-04 JSR Corporation Strahlungsempfindliche Harzzusammensetzung
JP4724465B2 (ja) * 2005-05-23 2011-07-13 富士フイルム株式会社 感光性組成物及び該感光性組成物を用いたパターン形成方法
JP5703197B2 (ja) 2011-01-18 2015-04-15 富士フイルム株式会社 化学増幅型レジスト組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、レジストパターン形成方法、及び、フォトマスク、並びに、高分子化合物
JP5919122B2 (ja) 2012-07-27 2016-05-18 富士フイルム株式会社 樹脂組成物及びそれを用いたパターン形成方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189323A (en) * 1977-04-25 1980-02-19 Hoechst Aktiengesellschaft Radiation-sensitive copying composition
JPS55118030A (en) * 1979-03-06 1980-09-10 Fuji Photo Film Co Ltd Photopolymerizable composition
EP0058638B1 (de) * 1981-02-13 1985-08-28 Ciba-Geigy Ag Härtbare Zusammensetzung auf Basis eines säurehärtbaren Harzes und Verfahren zu dessen Härtung
GB2120263B (en) * 1982-05-17 1985-07-31 Ciba Geigy Ag A process for curing acid-curable abrasive compositions
DE3325022A1 (de) * 1983-07-11 1985-01-24 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung negativer kopien mittels eines materials auf basis von 1,2-chinondiaziden
DE3584316D1 (de) * 1984-06-01 1991-11-14 Rohm & Haas Lichtempfindliche beschichtungszusammensetzung, aus diesem hergestellte thermisch stabile beschichtungen und verfahren zur herstellung von thermisch stabilen polymerbildern.
JPS62227143A (ja) * 1986-03-28 1987-10-06 Toshiba Corp 感光性組成物
JPS62266537A (ja) * 1986-05-14 1987-11-19 Fuji Photo Film Co Ltd マイクロカプセル及びそれを使用した感光性記録材料
JPH0693117B2 (ja) * 1986-08-08 1994-11-16 富士写真フイルム株式会社 感光性組成物
JPH01293339A (ja) * 1988-05-23 1989-11-27 Tosoh Corp フォトレジスト組成物
JP2618688B2 (ja) * 1988-06-22 1997-06-11 日本ゼオン株式会社 レジスト組成物
JPH0229751A (ja) * 1988-07-20 1990-01-31 Nippon Zeon Co Ltd レジスト組成物
JPH0229752A (ja) * 1988-07-20 1990-01-31 Nippon Zeon Co Ltd レジスト組成物
DE69027799T2 (de) * 1989-03-14 1997-01-23 Ibm Chemisch amplifizierter Photolack
US5128232A (en) * 1989-05-22 1992-07-07 Shiply Company Inc. Photoresist composition with copolymer binder having a major proportion of phenolic units and a minor proportion of non-aromatic cyclic alcoholic units
CA2019693A1 (en) * 1989-07-07 1991-01-07 Karen Ann Graziano Acid-hardening photoresists of improved sensitivity
JP2660352B2 (ja) * 1989-09-20 1997-10-08 日本ゼオン株式会社 レジスト組成物
JP2847413B2 (ja) * 1990-01-30 1999-01-20 和光純薬工業株式会社 レジスト材料
JP2970879B2 (ja) * 1990-01-30 1999-11-02 和光純薬工業株式会社 化学増幅型レジスト材料
JP2861253B2 (ja) * 1990-05-15 1999-02-24 ソニー株式会社 感光性樹脂組成物
JP2583651B2 (ja) * 1990-09-28 1997-02-19 東京応化工業株式会社 ネガ型感放射線レジスト組成物
US5273856A (en) * 1990-10-31 1993-12-28 International Business Machines Corporation Positive working photoresist composition containing mid or near UV radiation sensitive quinone diazide and sulfonic acid ester of imide or oxime which does not absorb mid or near UV radiation
TW207009B (de) * 1991-01-31 1993-06-01 Sumitomo Chemical Co
JPH04291261A (ja) * 1991-03-19 1992-10-15 Nippon Zeon Co Ltd レジスト組成物
DE4112972A1 (de) * 1991-04-20 1992-10-22 Hoechst Ag Negativ arbeitendes strahlungsempfindliches gemisch und damit hergestelltes strahlungsempfindliches aufzeichnungsmaterial
US5403695A (en) * 1991-04-30 1995-04-04 Kabushiki Kaisha Toshiba Resist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groups
US5292614A (en) * 1991-08-02 1994-03-08 Mitsubishi Kasei Corporation Negative photosensitive composition and method for forming a resist pattern
US5286600A (en) * 1991-08-27 1994-02-15 Mitsubishi Kasei Corporation Negative photosensitive composition and method for forming a resist pattern by means thereof
JP2655384B2 (ja) * 1991-11-08 1997-09-17 富士写真フイルム株式会社 ポジ型レジスト組成物
JPH05181277A (ja) * 1991-11-11 1993-07-23 Mitsubishi Kasei Corp ネガ型感光性組成物
US5296332A (en) * 1991-11-22 1994-03-22 International Business Machines Corporation Crosslinkable aqueous developable photoresist compositions and method for use thereof

Also Published As

Publication number Publication date
KR100354680B1 (ko) 2003-03-19
CA2124667A1 (en) 1994-12-03
TW288112B (de) 1996-10-11
US5585218A (en) 1996-12-17
DE69425786T2 (de) 2001-01-25
EP0632327B1 (de) 2000-09-06
EP0632327A1 (de) 1995-01-04
KR950001415A (ko) 1995-01-03

Similar Documents

Publication Publication Date Title
DE69322946D1 (de) Photolackzusammensetzung
DE69301999D1 (de) Photoresist Zusammensetzung
DE69425786T2 (de) Photoresistzusammensetzung
DE69525883T2 (de) Positiv-photoresistzusammensetzung
DE69423670D1 (de) Siloxy-aluminoxan-Zusammensetzungen
DE69327741T2 (de) Photopolymerisierbare Zusammensetzung
DE69302650D1 (de) Lichtempfindliche Zusammensetzung
DE69129955D1 (de) Photolackzusammensetzung
KR970002471A (ko) 포지티브형 포토레지스트조성물
DE69515163D1 (de) Fotolackzusammensetzungen
FI941663A (fi) Trikriittisen pisteen omaava koostumus
DE69400062T2 (de) Photopolymerisierbare Zusammensetzung
DE69605381T2 (de) Fotoresistzusammensetzung
DE69123873T2 (de) Photoresistzusammensetzung
DE69320397D1 (de) Photopolymerisierbare Zusammensetzung
DE69423858T2 (de) Positiv-arbeitende Fotolackzusammensetzung
DE69322346D1 (de) Fotoresist-Zusammensetzungen
DE69332687D1 (de) Photopolymerisierbare zusammensetzung
DE69322989D1 (de) Lichtempfindliche Zusammensetzung
DE69423504T2 (de) Photopolymerisierbare zusammensetzung
DE69124865D1 (de) Photolackzusammensetzung
DE69413312D1 (de) Positiv-arbeitende Fotolackzusammensetzung
KR950703340A (ko) 항엠알에스에이 조성물
DE69321979T2 (de) Positive Photoresistzusammensetzung
DE69120858T2 (de) Photoresistzusammensetzung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee