DE69324942T2 - Strahlungsempfindliche Zusammensetzungen und Verfahren - Google Patents

Strahlungsempfindliche Zusammensetzungen und Verfahren

Info

Publication number
DE69324942T2
DE69324942T2 DE69324942T DE69324942T DE69324942T2 DE 69324942 T2 DE69324942 T2 DE 69324942T2 DE 69324942 T DE69324942 T DE 69324942T DE 69324942 T DE69324942 T DE 69324942T DE 69324942 T2 DE69324942 T2 DE 69324942T2
Authority
DE
Germany
Prior art keywords
methods
radiation sensitive
sensitive compositions
compositions
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69324942T
Other languages
English (en)
Other versions
DE69324942D1 (de
Inventor
Daniel Y Pai
Stephen S Rodriguez Rodriguez
Kevin Cheetham
Gary Calabrese
Roger F Sinta Roger F Sinta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Application granted granted Critical
Publication of DE69324942D1 publication Critical patent/DE69324942D1/de
Publication of DE69324942T2 publication Critical patent/DE69324942T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
DE69324942T 1992-02-14 1993-02-03 Strahlungsempfindliche Zusammensetzungen und Verfahren Expired - Fee Related DE69324942T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83678992A 1992-02-14 1992-02-14

Publications (2)

Publication Number Publication Date
DE69324942D1 DE69324942D1 (de) 1999-06-24
DE69324942T2 true DE69324942T2 (de) 1999-10-07

Family

ID=25272739

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69324942T Expired - Fee Related DE69324942T2 (de) 1992-02-14 1993-02-03 Strahlungsempfindliche Zusammensetzungen und Verfahren

Country Status (4)

Country Link
US (1) US5627010A (de)
EP (1) EP0555749B1 (de)
JP (1) JPH0641493A (de)
DE (1) DE69324942T2 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69408709T2 (de) 1993-04-28 1998-10-01 Hitachi Chemical Co Ltd Photoempfindliche Harzzusammensetzung
JP3499032B2 (ja) * 1995-02-02 2004-02-23 ダウ コーニング アジア株式会社 放射線硬化性組成物、その硬化方法及びパターン形成方法
DE69631709T2 (de) * 1995-03-16 2005-02-10 Shipley Co., L.L.C., Marlborough Strahlungsempfindliche Zusammensetzung, die ein Polymer mit Schutzgruppen enthält
JP3628098B2 (ja) * 1996-03-29 2005-03-09 ダウ コーニング アジア株式会社 放射線硬化性組成物およびこれを用いた硬化物パターンの製造方法
JPH09268228A (ja) * 1996-04-01 1997-10-14 Dow Corning Asia Ltd 紫外線硬化性組成物およびこれを用いた硬化物パターンの形成方法
JPH1041633A (ja) 1996-07-25 1998-02-13 Hitachi Ltd 多層配線板とそれに用いる感光性樹脂組成物
TW546540B (en) 1997-04-30 2003-08-11 Wako Pure Chem Ind Ltd An agent for reducing the substrate dependence of resist and a resist composition
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
GB9727186D0 (en) * 1997-12-24 1998-02-25 Du Pont Uk Photoactive materials applicable to imaging systems
US6103447A (en) * 1998-02-25 2000-08-15 International Business Machines Corp. Approach to formulating irradiation sensitive positive resists
JP3125748B2 (ja) * 1998-05-27 2001-01-22 富士ゼロックス株式会社 画像記録方法
JP3739227B2 (ja) * 1999-03-04 2006-01-25 信越化学工業株式会社 フォトレジスト材料およびパターン形成方法
US6323287B1 (en) * 1999-03-12 2001-11-27 Arch Specialty Chemicals, Inc. Hydroxy-amino thermally cured undercoat for 193 NM lithography
US6338934B1 (en) 1999-08-26 2002-01-15 International Business Machines Corporation Hybrid resist based on photo acid/photo base blending
AUPQ700100A0 (en) * 2000-04-18 2000-05-11 Orbital Engine Company (Australia) Proprietary Limited Engine speed control for internal combustion engines
BR0111020B1 (pt) * 2000-05-26 2011-02-22 composição de revestimento fotoativável, processo para produção de uma camada de revestimento, e, uso de uma composição de revestimento.
AU8015701A (en) * 2000-08-29 2002-03-13 Jsr Corp Composition having refractive index sensitively changeable by radiation and method for forming refractive index pattern
KR100789583B1 (ko) * 2000-12-11 2007-12-28 제이에스알 가부시끼가이샤 감방사선성 굴절율 변화성 조성물 및 굴절율 변화법
KR100566792B1 (ko) * 2000-12-27 2006-04-03 히다치 가세고교 가부시끼가이샤 광염기발생제 및 이것을 이용한 경화성 조성물 및 경화방법
EP1369459A4 (de) 2001-02-19 2008-05-21 Jsr Corp Strahlungsempfindliche zusammensetzung mit brechungsindexverteilung
CA2408217A1 (en) 2001-03-13 2002-11-12 Jsr Corporation Radiation sensitive refractive index changing composition and use thereof
JP2003043682A (ja) * 2001-08-01 2003-02-13 Jsr Corp 感放射線性誘電率変化性組成物、誘電率変化法
JP2003185820A (ja) * 2001-12-21 2003-07-03 Jsr Corp 感放射線性屈折率変化性組成物および屈折率変化法
TWI273352B (en) * 2002-01-24 2007-02-11 Jsr Corp Radiation sensitive composition for forming an insulating film, insulating film and display device
JPWO2004025342A1 (ja) * 2002-09-11 2006-01-12 富士通株式会社 デバイス製造方法
JP4217886B2 (ja) * 2003-06-25 2009-02-04 Ｊｓｒ株式会社 感放射線性屈折率変化性組成物、パターン形成法および光学材料
US7524606B2 (en) * 2005-04-11 2009-04-28 Az Electronic Materials Usa Corp. Nanocomposite photoresist composition for imaging thick films
US7247419B2 (en) * 2005-04-11 2007-07-24 Az Electronic Materials Usa Corp. Nanocomposite photosensitive composition and use thereof
US20060257785A1 (en) * 2005-05-13 2006-11-16 Johnson Donald W Method of forming a photoresist element
US7635552B2 (en) * 2006-07-25 2009-12-22 Endicott Interconnect Technologies, Inc. Photoresist composition with antibacterial agent
US20100009290A1 (en) * 2006-12-03 2010-01-14 Central Glass Co., Ltd. Photosensitive Polybenzoxazines and Methods of Making the Same
WO2008069813A1 (en) * 2006-12-04 2008-06-12 Central Glass Co., Ltd. Photosensitive polyimides and methods of making the same
US20090186293A1 (en) * 2008-01-23 2009-07-23 Bryan Thomas Fannin Dry film protoresist for a micro-fluid ejection head and method therefor
US8686059B2 (en) 2009-06-17 2014-04-01 Three Bond Co., Ltd. Base and radical generator, composition using same and method for curing same
US8216767B2 (en) 2009-09-08 2012-07-10 Taiwan Semiconductor Manufacturing Company, Ltd. Patterning process and chemical amplified photoresist with a photodegradable base
US8956806B2 (en) * 2009-09-18 2015-02-17 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and patterning process
US8512939B2 (en) 2009-09-25 2013-08-20 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist stripping technique
JP5898985B2 (ja) 2011-05-11 2016-04-06 東京応化工業株式会社 レジストパターン形成方法
US8968990B2 (en) 2011-09-15 2015-03-03 Tokyo Ohka Kogyo Co., Ltd. Method of forming resist pattern
KR101936435B1 (ko) 2011-09-22 2019-01-08 도오꾜오까고오교 가부시끼가이샤 레지스트 조성물, 레지스트 패턴 형성 방법
TWI575319B (zh) 2011-09-22 2017-03-21 東京應化工業股份有限公司 光阻組成物及光阻圖型之形成方法
JP5816505B2 (ja) * 2011-09-27 2015-11-18 東京応化工業株式会社 レジストパターン形成方法
JP5933364B2 (ja) 2011-11-09 2016-06-08 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
EP2792694A4 (de) 2011-12-16 2015-07-15 Three Bond Fine Chemical Co Ltd Härtbare harzzusammensetzung
JP5820719B2 (ja) 2011-12-21 2015-11-24 東京応化工業株式会社 レジストパターン形成方法
JP5898962B2 (ja) 2012-01-11 2016-04-06 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
KR102050619B1 (ko) * 2012-05-17 2019-11-29 다이요 잉키 세이조 가부시키가이샤 액상 현상형의 말레이미드 조성물, 프린트 배선판
JP6105858B2 (ja) * 2012-05-17 2017-03-29 太陽インキ製造株式会社 パターン形成方法、アルカリ現像型の熱硬化性樹脂組成物、及びプリント配線板
WO2013172432A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
WO2013172433A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
JP6265374B2 (ja) * 2012-11-15 2018-01-24 学校法人東京理科大学 塩基増殖剤及び当該塩基増殖剤を含有する塩基反応性樹脂組成物
JP6605821B2 (ja) * 2014-03-14 2019-11-13 株式会社Ａｄｅｋａ 感光性樹脂組成物
JP6363861B2 (ja) * 2014-03-31 2018-07-25 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化被膜を有するプリント配線板
US10197913B2 (en) 2014-10-01 2019-02-05 Tokyo University Of Science Foundation Photosensitive resin composition and cured product thereof
US10662274B2 (en) 2016-12-02 2020-05-26 Georgia Tech Research Corporation Self-immolative polymers, articles thereof, and methods of making and using same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3297440A (en) * 1963-05-02 1967-01-10 Gevaert Photo Prod Nv Photopolymerization of ethylenically unsaturated organic compositions and the formation of a relief image
US4035189A (en) * 1972-02-25 1977-07-12 Hitachi Chemical Company, Ltd. Image forming curable resin compositions
JPS515935B2 (de) * 1972-04-17 1976-02-24
GB1431175A (en) * 1972-06-30 1976-04-07 Agfa Gevaert Photographic material and process in which photosensitive amine progenitors are used
AU3870478A (en) * 1977-08-09 1980-02-14 Somar Mfg High energy radiation cruable resist material
FR2495343B1 (fr) * 1980-12-02 1987-02-20 Regma Materiaux diazotypes thermodeveloppables contenant un precurseur d'activateur liberant lors du chauffage une base forte. procede de diazotypie mettant en oeuvre ces materiaux
JPS61223020A (ja) * 1985-03-29 1986-10-03 Toshiba Corp 光硬化性エポキシ樹脂系組成物
JPS62131255A (ja) * 1985-12-03 1987-06-13 Fuji Photo Film Co Ltd 画像形成方法
CH678897A5 (de) * 1986-05-10 1991-11-15 Ciba Geigy Ag
US4950581A (en) * 1987-07-06 1990-08-21 Fuji Photo Film Co., Ltd. Photopolymerizable composition
JPH0268A (ja) * 1987-11-13 1990-01-05 Toshiba Corp ソルダ−レジスト組成物
DE3815050A1 (de) * 1988-05-04 1989-11-16 Basf Ag Neues polyphenol und daraus hergestellte duromere
EP0413087A1 (de) * 1989-07-20 1991-02-20 International Business Machines Corporation Lichtempfindliche Zusammensetzung und ihre Verwendung
US5650261A (en) * 1989-10-27 1997-07-22 Rohm And Haas Company Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system

Also Published As

Publication number Publication date
US5627010A (en) 1997-05-06
DE69324942D1 (de) 1999-06-24
EP0555749B1 (de) 1999-05-19
JPH0641493A (ja) 1994-02-15
EP0555749A1 (de) 1993-08-18

Similar Documents

Publication Publication Date Title
DE69324942T2 (de) Strahlungsempfindliche Zusammensetzungen und Verfahren
DE69326184D1 (de) Strahlungsempfindliche Zusammensetzungen
DE69333697D1 (de) Härtbare Zusammensetzungen und Verwendung derselben
DE69232670T2 (de) Tropfendetektor und Verfahren
DE69211276D1 (de) Verfahren und Schleifvorrichtung
DE69212502D1 (de) Klebstoffzusammensetzung und verfahren
DE69125711D1 (de) Hochreflektive biogitter und verfahren
DE69318944D1 (de) Lagebestimmungssystem und Verfahren
DE69318424T2 (de) Schutzfilm für gegenstände und verfahren
DE68928033D1 (de) Stereosynthesizer und entsprechendes verfahren
DE69331967D1 (de) Gefässstent und zugehörige einführungsvorrichtung
DE69408761D1 (de) Strahlungsempfindliche Zusammensetzung
DE69303368T2 (de) Indikatorband und verfahren
DE69300270D1 (de) Strahlungshärtbare Zusammensetzungen und Verwendungsmethode.
DE69230954D1 (de) Modulare Schnittstelle und Verfahren hierfür
MX174001B (es) Composiciones cementicias y metodo
ITMI920408A1 (it) Derivati benzopiranici e benzotiopiranici
DE69506999T2 (de) Strahlungsempfindliche Zusammensetzung
DE59309790D1 (de) Strahlungsempfindliches Gemisch
DE69430006T2 (de) Verbindungen und verfahren
DE69231642D1 (de) Anzeigesystem und Verfahren
DE502382T1 (de) Lichtempfindliche zusammensetzung und verfahren.
DE69327604D1 (de) Ausgabegerät und Verfahren
DE69213992D1 (de) Elektrofotografisches Verfahren und Gerät
ITMI921571A1 (it) Azaciclo e azabiciclo alchiliden idrossilamine

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee