ID16180A - Komposisi resin fotosensitif - Google Patents

Komposisi resin fotosensitif

Info

Publication number
ID16180A
ID16180A IDP963703A ID963703A ID16180A ID 16180 A ID16180 A ID 16180A ID P963703 A IDP963703 A ID P963703A ID 963703 A ID963703 A ID 963703A ID 16180 A ID16180 A ID 16180A
Authority
ID
Indonesia
Prior art keywords
resin composition
photosensitive resin
photosensitive
composition
resin
Prior art date
Application number
IDP963703A
Other languages
English (en)
Inventor
Hwang Jae Young
Lee Ii Byeong
Park Kie Jin
Original Assignee
Kolon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19442390&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ID16180(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kolon Inc filed Critical Kolon Inc
Publication of ID16180A publication Critical patent/ID16180A/id

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/109—Polyester
IDP963703A 1995-12-21 1996-12-12 Komposisi resin fotosensitif ID16180A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950053460A KR0150344B1 (ko) 1995-12-21 1995-12-21 감광성 수지 조성물

Publications (1)

Publication Number Publication Date
ID16180A true ID16180A (id) 1997-09-11

Family

ID=19442390

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP963703A ID16180A (id) 1995-12-21 1996-12-12 Komposisi resin fotosensitif

Country Status (8)

Country Link
US (1) US5935761A (id)
JP (1) JP2963772B2 (id)
KR (1) KR0150344B1 (id)
CN (1) CN1089907C (id)
BR (1) BR9612253A (id)
GB (1) GB2323367B (id)
ID (1) ID16180A (id)
WO (1) WO1997023809A1 (id)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789687B1 (ko) * 2000-08-18 2008-01-02 데이진 가부시키가이샤 드라이 필름 레지스트의 지지체로서의 폴리에스테르 필름
KR100578991B1 (ko) * 2001-03-29 2006-05-12 히다치 가세고교 가부시끼가이샤 회로형성용 감광성 필름 및 프린트배선판의 제조방법
TWI296738B (id) * 2001-03-29 2008-05-11 Hitachi Chemical Co Ltd
FR2868849B1 (fr) * 2004-04-09 2006-07-07 Thales Sa Filtre d'eclairage pour vision nocturne
KR100932581B1 (ko) * 2005-05-23 2009-12-17 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
ES2333442T3 (es) * 2005-08-26 2010-02-22 Agfa Graphics N.V. Precursor de placa de impresion fotopolimerico.
CN102662306B (zh) * 2006-04-18 2015-11-25 日立化成株式会社 感光性元件、抗蚀图案形成方法及印刷电路板的制造方法
CN103497325B (zh) * 2013-08-20 2015-07-22 京东方科技集团股份有限公司 一种聚醚类化合物、其制备方法及光刻胶组合物
CN105714277B (zh) * 2014-12-03 2019-08-30 珠海方正科技多层电路板有限公司 干膜、电器元件的镀金属方法和电路板的线路制作方法
KR102042617B1 (ko) 2017-02-09 2019-11-08 동우 화인켐 주식회사 점착제 조성물 및 이로부터 형성되는 점착 패턴

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5863760A (ja) * 1981-10-09 1983-04-15 Nippon Paint Co Ltd 光硬化性被覆組成物
JPS61228007A (ja) * 1985-04-01 1986-10-11 Fuji Photo Film Co Ltd 光重合性組成物
JPH01159637A (ja) * 1987-12-16 1989-06-22 Daicel Chem Ind Ltd 感光性硬化組成物
US4885229A (en) * 1987-12-22 1989-12-05 501 Daicel Chemical Industries Ltd. Photopolymerizable compositions
JP3329877B2 (ja) * 1993-03-02 2002-09-30 互応化学工業株式会社 プリント回路基板製造用レジストインク組成物、それを用いたレジスト膜及びプリント回路基板
JPH07146550A (ja) * 1993-11-25 1995-06-06 Fuji Photo Film Co Ltd 感光性樹脂組成物および画像形成方法

Also Published As

Publication number Publication date
BR9612253A (pt) 1999-07-13
US5935761A (en) 1999-08-10
KR0150344B1 (ko) 1998-10-01
KR970048906A (ko) 1997-07-29
JPH11501417A (ja) 1999-02-02
GB2323367B (en) 1999-10-27
CN1205784A (zh) 1999-01-20
CN1089907C (zh) 2002-08-28
JP2963772B2 (ja) 1999-10-18
GB9812927D0 (en) 1998-08-12
GB2323367A (en) 1998-09-23
WO1997023809A1 (en) 1997-07-03

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