DE69130777T2 - Herstellungsverfahren für Mikrolinsen - Google Patents

Herstellungsverfahren für Mikrolinsen

Info

Publication number
DE69130777T2
DE69130777T2 DE69130777T DE69130777T DE69130777T2 DE 69130777 T2 DE69130777 T2 DE 69130777T2 DE 69130777 T DE69130777 T DE 69130777T DE 69130777 T DE69130777 T DE 69130777T DE 69130777 T2 DE69130777 T2 DE 69130777T2
Authority
DE
Germany
Prior art keywords
microlenses
manufacturing process
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69130777T
Other languages
English (en)
Other versions
DE69130777D1 (de
Inventor
Shun-Ichi Naka
Kiyotoshi Misawa
Jun-Ichi Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2025788A external-priority patent/JPH03230567A/ja
Priority claimed from JP2082064A external-priority patent/JPH03280574A/ja
Priority claimed from JP2149630A external-priority patent/JP2518955B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69130777D1 publication Critical patent/DE69130777D1/de
Publication of DE69130777T2 publication Critical patent/DE69130777T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14868—CCD or CID colour imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69130777T 1990-02-05 1991-02-05 Herstellungsverfahren für Mikrolinsen Expired - Lifetime DE69130777T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2025788A JPH03230567A (ja) 1990-02-05 1990-02-05 固体撮像装置
JP2082064A JPH03280574A (ja) 1990-03-29 1990-03-29 固体撮像装置
JP2149630A JP2518955B2 (ja) 1990-06-07 1990-06-07 固体撮像素子のマイクロレンズ形成方法

Publications (2)

Publication Number Publication Date
DE69130777D1 DE69130777D1 (de) 1999-02-25
DE69130777T2 true DE69130777T2 (de) 1999-07-01

Family

ID=27285161

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69130399T Expired - Lifetime DE69130399T2 (de) 1990-02-05 1991-02-05 Festkörperbildaufnahmeelement mit Mikrolinsen
DE69130777T Expired - Lifetime DE69130777T2 (de) 1990-02-05 1991-02-05 Herstellungsverfahren für Mikrolinsen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69130399T Expired - Lifetime DE69130399T2 (de) 1990-02-05 1991-02-05 Festkörperbildaufnahmeelement mit Mikrolinsen

Country Status (3)

Country Link
US (1) US5239412A (de)
EP (2) EP0441594B1 (de)
DE (2) DE69130399T2 (de)

Families Citing this family (117)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567762A (ja) * 1991-03-06 1993-03-19 Matsushita Electron Corp 固体撮像装置およびその製造方法
US5321249A (en) * 1991-10-31 1994-06-14 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method of manufacturing the same
JPH05134111A (ja) * 1991-11-15 1993-05-28 Sharp Corp 固体撮像装置
JP3170847B2 (ja) * 1992-02-14 2001-05-28 キヤノン株式会社 固体撮像素子及びそれを用いた光学機器
GB2267579A (en) * 1992-05-15 1993-12-08 Sharp Kk Optical device comprising facing lenticular or parallax screens of different pitch
US5514888A (en) * 1992-05-22 1996-05-07 Matsushita Electronics Corp. On-chip screen type solid state image sensor and manufacturing method thereof
JPH05335531A (ja) * 1992-05-27 1993-12-17 Sharp Corp 固体撮像装置
JPH06232379A (ja) * 1993-02-01 1994-08-19 Sharp Corp 固体撮像素子
US5581379A (en) * 1993-02-15 1996-12-03 Omron Corporation Rectangular based convex microlenses surrounded within a frame and method of making
GB9314402D0 (en) * 1993-07-12 1993-08-25 Philips Electronics Uk Ltd An imaging device
US5563738A (en) * 1993-09-03 1996-10-08 Jenmar Visual Systems Light transmitting and dispersing filter having low reflectance
JP2950714B2 (ja) * 1993-09-28 1999-09-20 シャープ株式会社 固体撮像装置およびその製造方法
JP2925444B2 (ja) * 1993-10-05 1999-07-28 シャープ株式会社 固体撮像素子およびその製造方法
KR970005706B1 (ko) * 1994-01-24 1997-04-19 금성일렉트론 주식회사 고체촬상소자 및 그 제조방법
KR0147401B1 (ko) * 1994-02-23 1998-08-01 구본준 고체촬상소자 및 그 제조방법
JPH08204059A (ja) * 1995-01-20 1996-08-09 Kyocera Corp 半導体素子収納用パッケージ
JPH08243078A (ja) * 1995-03-07 1996-09-24 Fuji Photo Optical Co Ltd 電子内視鏡の撮像素子組付け体
JP3405620B2 (ja) * 1995-05-22 2003-05-12 松下電器産業株式会社 固体撮像装置
US5801884A (en) * 1995-10-09 1998-09-01 Mitsubishi Chemical Corporation Optical device and process for producing the same
KR100213968B1 (ko) 1996-07-15 1999-08-02 구자홍 액정표시장치
US6043481A (en) * 1997-04-30 2000-03-28 Hewlett-Packard Company Optoelectronic array device having a light transmissive spacer layer with a ridged pattern and method of making same
WO1999008149A1 (fr) * 1997-08-08 1999-02-18 Japan, As Represented By Director General Of Agency Of Industrial Science And Technology Element optique, procede et appareil de commande optique et procede de fabrication dudit element optique
JPH11211902A (ja) 1998-01-21 1999-08-06 Micro Opt:Kk 平板型マイクロレンズアレイ
JP3931936B2 (ja) * 1998-05-11 2007-06-20 セイコーエプソン株式会社 マイクロレンズアレイ基板及びその製造方法並びに表示装置
US6600599B2 (en) 1998-06-09 2003-07-29 Avery Dennison Corporation Rear projection screens and light filters with conformable coatings and methods of making the same
JP3824425B2 (ja) * 1998-06-17 2006-09-20 日本板硝子株式会社 平板型マイクロレンズアレイ
US6137634A (en) * 1999-02-01 2000-10-24 Intel Corporation Microlens array
US6583438B1 (en) * 1999-04-12 2003-06-24 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device
US7023594B2 (en) * 2000-06-23 2006-04-04 E-Vision, Llc Electro-optic lens with integrated components
US6986579B2 (en) * 1999-07-02 2006-01-17 E-Vision, Llc Method of manufacturing an electro-active lens
US6871951B2 (en) * 2000-06-23 2005-03-29 E-Vision, Llc Electro-optic lens with integrated components
US6517203B1 (en) 1999-07-02 2003-02-11 E-Vision, Llc System, apparatus, and method for correcting vision using electro-active spectacles
US6491394B1 (en) 1999-07-02 2002-12-10 E-Vision, Llc Method for refracting and dispensing electro-active spectacles
US6491391B1 (en) 1999-07-02 2002-12-10 E-Vision Llc System, apparatus, and method for reducing birefringence
US6619799B1 (en) * 1999-07-02 2003-09-16 E-Vision, Llc Optical lens system with electro-active lens having alterably different focal lengths
US6733130B2 (en) 1999-07-02 2004-05-11 E-Vision, Llc Method for refracting and dispensing electro-active spectacles
US6857741B2 (en) * 2002-01-16 2005-02-22 E-Vision, Llc Electro-active multi-focal spectacle lens
US7264354B2 (en) 1999-07-02 2007-09-04 E-Vision, Llc Method and apparatus for correcting vision using an electro-active phoropter
US6851805B2 (en) * 1999-07-02 2005-02-08 E-Vision, Llc Stabilized electro-active contact lens
US7290875B2 (en) * 2004-11-02 2007-11-06 Blum Ronald D Electro-active spectacles and method of fabricating same
US7988286B2 (en) 1999-07-02 2011-08-02 E-Vision Llc Static progressive surface region in optical communication with a dynamic optic
US7404636B2 (en) 1999-07-02 2008-07-29 E-Vision, Llc Electro-active spectacle employing modal liquid crystal lenses
US7775660B2 (en) 1999-07-02 2010-08-17 E-Vision Llc Electro-active ophthalmic lens having an optical power blending region
US7604349B2 (en) 1999-07-02 2009-10-20 E-Vision, Llc Static progressive surface region in optical communication with a dynamic optic
US7290876B2 (en) * 1999-07-02 2007-11-06 E-Vision, Llc Method and system for electro-active spectacle lens design
US6324010B1 (en) 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
WO2001035149A1 (fr) * 1999-11-10 2001-05-17 Hamamatsu Photonics K.K. Lentille optique et systeme optique
US6221687B1 (en) 1999-12-23 2001-04-24 Tower Semiconductor Ltd. Color image sensor with embedded microlens array
FR2803395A1 (fr) * 1999-12-30 2001-07-06 Commissariat Energie Atomique Microsysteme optique solide a face plane et procede de realisation d'un tel microsysteme
JP4123667B2 (ja) * 2000-01-26 2008-07-23 凸版印刷株式会社 固体撮像素子の製造方法
JP3840058B2 (ja) * 2000-04-07 2006-11-01 キヤノン株式会社 マイクロレンズ、固体撮像装置及びそれらの製造方法
AU8015701A (en) * 2000-08-29 2002-03-13 Jsr Corp Composition having refractive index sensitively changeable by radiation and method for forming refractive index pattern
GB2378522B (en) 2001-08-08 2003-08-13 Pearpoint Ltd Integrated camera and lighting device and a method of manufacture thereof
BR0213012A (pt) * 2001-10-05 2004-12-28 E Vision Llc Lentes eletro-ativas hìbridas
JP2003197897A (ja) * 2001-12-28 2003-07-11 Fuji Film Microdevices Co Ltd 半導体光電変換装置
JP2003244560A (ja) * 2002-02-21 2003-08-29 Seiko Precision Inc 固体撮像装置
CN100345303C (zh) * 2002-08-01 2007-10-24 台湾积体电路制造股份有限公司 影像感测器微透镜组、影像感测器及其制造方法
KR100774775B1 (ko) * 2002-09-17 2007-11-07 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
US7008757B2 (en) * 2002-12-17 2006-03-07 Lucent Technologies Inc. Patterned structures of high refractive index materials
DE10302150B4 (de) * 2003-01-21 2006-10-12 Siemens Ag Syntheseverfahren und -Vorrichtung
JP2005057024A (ja) * 2003-08-04 2005-03-03 Matsushita Electric Ind Co Ltd 固体撮像装置、固体撮像装置の製造方法、カメラ
EP1654566B1 (de) 2003-08-15 2015-02-25 E-Vision LLC Verbessertes elektroaktives linsensystem
US7474350B2 (en) * 2003-09-08 2009-01-06 Sanyo Electric Co., Ltd. Solid state image pickup device comprising lenses for condensing light on photodetection parts
US20050109916A1 (en) * 2003-11-21 2005-05-26 Eastman Kodak Company Large pixel micro-lens
JP4508619B2 (ja) * 2003-12-03 2010-07-21 キヤノン株式会社 固体撮像装置の製造方法
US7205526B2 (en) * 2003-12-22 2007-04-17 Micron Technology, Inc. Methods of fabricating layered lens structures
EP1557886A3 (de) * 2004-01-26 2006-06-07 Matsushita Electric Industrial Co., Ltd. Festkörperbildaufnahmevorrichtung und Kamera
US20050237485A1 (en) * 2004-04-21 2005-10-27 Blum Ronald D Method and apparatus for correcting vision
KR100753391B1 (ko) * 2004-05-14 2007-08-30 매그나칩 반도체 유한회사 씨모스 이미지센서
US7443005B2 (en) * 2004-06-10 2008-10-28 Tiawan Semiconductor Manufacturing Co., Ltd. Lens structures suitable for use in image sensors and method for making the same
US7453653B2 (en) 2004-09-14 2008-11-18 Omnivision Cdm Optics, Inc. Low height imaging system and associated methods
US7125738B2 (en) * 2004-10-14 2006-10-24 Powerchip Semiconductor Corp. Method of fabricating a photosensitive structure
US8778022B2 (en) 2004-11-02 2014-07-15 E-Vision Smart Optics Inc. Electro-active intraocular lenses
US9801709B2 (en) 2004-11-02 2017-10-31 E-Vision Smart Optics, Inc. Electro-active intraocular lenses
US8915588B2 (en) 2004-11-02 2014-12-23 E-Vision Smart Optics, Inc. Eyewear including a heads up display
WO2006050366A2 (en) 2004-11-02 2006-05-11 E-Vision, Llc Electro-active spectacles and method of fabricating same
US7344244B2 (en) 2004-12-03 2008-03-18 Searete, Llc Adjustable lens system with neural-based control
US7350919B2 (en) 2004-12-03 2008-04-01 Searete Llc Vision modification with reflected image
US8244342B2 (en) 2004-12-03 2012-08-14 The Invention Science Fund I, Llc Method and system for adaptive vision modification
US9155483B2 (en) 2004-12-03 2015-10-13 The Invention Science Fund I, Llc Vision modification with reflected image
US7656569B2 (en) 2004-12-03 2010-02-02 Searete Llc Vision modification with reflected image
US7470027B2 (en) 2004-12-03 2008-12-30 Searete Llc Temporal vision modification
US7486988B2 (en) 2004-12-03 2009-02-03 Searete Llc Method and system for adaptive vision modification
US7931373B2 (en) 2004-12-03 2011-04-26 The Invention Science Fund I, Llc Vision modification with reflected image
US7334894B2 (en) 2004-12-03 2008-02-26 Searete, Llc Temporal vision modification
US7594727B2 (en) 2004-12-03 2009-09-29 Searete Llc Vision modification with reflected image
US7390088B2 (en) 2004-12-03 2008-06-24 Searete Llc Adjustable lens system with neural-based control
US8104892B2 (en) 2004-12-03 2012-01-31 The Invention Science Fund I, Llc Vision modification with reflected image
US7334892B2 (en) 2004-12-03 2008-02-26 Searete Llc Method and system for vision enhancement
US20060131683A1 (en) * 2004-12-17 2006-06-22 Eastman Kodak Company Microlens array
TWI251931B (en) * 2004-12-29 2006-03-21 Advanced Chip Eng Tech Inc Imagine sensor with a protection layer
US20080273166A1 (en) 2007-05-04 2008-11-06 William Kokonaski Electronic eyeglass frame
US7656509B2 (en) 2006-05-24 2010-02-02 Pixeloptics, Inc. Optical rangefinder for an electro-active lens
KR101449986B1 (ko) 2006-06-23 2014-10-13 픽셀옵틱스, 인크. 전기-활성 안경 렌즈용 전자 어댑터
US20090201460A1 (en) * 2006-10-27 2009-08-13 Blum Ronald D Spectacle temple for lens
US20080173791A1 (en) * 2007-01-19 2008-07-24 Palum Russell J Image sensor with three sets of microlenses
AR064985A1 (es) 2007-01-22 2009-05-06 E Vision Llc Lente electroactivo flexible
TWM322104U (en) * 2007-02-09 2007-11-11 Sin Guang Li Internat Co Ltd Improved structure of solar cell plate
US8215770B2 (en) 2007-02-23 2012-07-10 E-A Ophthalmics Ophthalmic dynamic aperture
US7883207B2 (en) 2007-12-14 2011-02-08 Pixeloptics, Inc. Refractive-diffractive multifocal lens
US20080273169A1 (en) 2007-03-29 2008-11-06 Blum Ronald D Multifocal Lens Having a Progressive Optical Power Region and a Discontinuity
WO2008112037A1 (en) 2007-03-07 2008-09-18 Pixeloptics, Inc. Multifocal lens having a progressive optical power region and a discontinuity
US10613355B2 (en) 2007-05-04 2020-04-07 E-Vision, Llc Moisture-resistant eye wear
US11061252B2 (en) 2007-05-04 2021-07-13 E-Vision, Llc Hinge for electronic spectacles
US8317321B2 (en) 2007-07-03 2012-11-27 Pixeloptics, Inc. Multifocal lens with a diffractive optical power region
AU2009225638A1 (en) 2008-03-18 2009-09-24 Pixeloptics, Inc. Advanced electro-active optic device
US8154804B2 (en) 2008-03-25 2012-04-10 E-Vision Smart Optics, Inc. Electro-optic lenses for correction of higher order aberrations
JP5553707B2 (ja) * 2009-08-21 2014-07-16 株式会社半導体エネルギー研究所 光検出装置
JP5556122B2 (ja) * 2009-10-27 2014-07-23 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、電子機器
CN102130138B (zh) 2010-01-12 2013-01-02 中芯国际集成电路制造(上海)有限公司 图像传感器及其形成方法
DE102011117228A1 (de) * 2011-10-28 2013-05-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikroskopiesystem zur Zustandsbestimmung von Zellen
JP5845856B2 (ja) * 2011-11-30 2016-01-20 ソニー株式会社 固体撮像素子およびその製造方法、並びに電子機器
KR20230020587A (ko) 2012-01-06 2023-02-10 이-비전 스마트 옵틱스, 아이엔씨. 안경류 도킹 스테이션 및 전자 모듈
JP2014187160A (ja) * 2013-03-22 2014-10-02 Toshiba Corp 固体撮像装置および携帯情報端末
US10599006B2 (en) 2016-04-12 2020-03-24 E-Vision Smart Optics, Inc. Electro-active lenses with raised resistive bridges
KR20180127509A (ko) 2016-04-12 2018-11-28 이-비전 스마트 옵틱스, 아이엔씨. 융기 저항 브릿지를 가지는 전기-활성 렌즈
US10297627B1 (en) * 2017-11-08 2019-05-21 Omnivision Technologies, Inc. Chip scale package for an image sensor

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1943995A (en) * 1930-04-03 1934-01-16 Herbert W Weld Glass construction
US3018313A (en) * 1961-01-04 1962-01-23 Daniel H Gattone Light gathering power converter
US3383676A (en) * 1963-02-14 1968-05-14 Robert I. Nagel Lenticular signal lens having a smooth outer surface
US3984583A (en) * 1972-02-29 1976-10-05 Agfa-Gevaert N.V. Electron beam recording method
US4129628A (en) * 1976-07-19 1978-12-12 Rca Corporation Method of making a thermoplastic lens by vacuum forming
JPS5990466A (ja) * 1982-11-15 1984-05-24 Mitsubishi Electric Corp 固体撮像素子
US4667092A (en) * 1982-12-28 1987-05-19 Nec Corporation Solid-state image device with resin lens and resin contact layer
JPS6029703A (ja) * 1983-07-29 1985-02-15 Nippon Telegr & Teleph Corp <Ntt> マイクロレンズアレイおよびその製造方法
JPS6059752A (ja) * 1983-09-13 1985-04-06 Nec Corp 半導体装置の製造方法
JPS6060756A (ja) * 1983-09-14 1985-04-08 Hitachi Ltd マイクロレンズ付固体撮像素子の製造方法
US4695719A (en) * 1983-12-05 1987-09-22 Honeywell Inc. Apparatus and method for opto-electronic package
JPS60175001A (ja) * 1984-02-21 1985-09-09 Toshiba Corp マイクロレンズアレ−
JPS61134061A (ja) * 1984-12-05 1986-06-21 Mitsubishi Electric Corp モ−ルド型撮像素子
GB2173915B (en) * 1985-03-05 1989-05-10 Nippon Sheet Glass Co Ltd Plate microlens having gradient index lenses and manufacture thereof
US4807978A (en) * 1987-09-10 1989-02-28 Hughes Aircraft Company Color display device and method using holographic lenses
JPH02162318A (ja) * 1988-12-16 1990-06-21 Nippon Sheet Glass Co Ltd 画像伝送装置

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EP0441594A3 (en) 1992-08-19
DE69130399T2 (de) 1999-05-20
DE69130399D1 (de) 1998-12-03
EP0441594A2 (de) 1991-08-14
US5239412A (en) 1993-08-24
EP0627637A1 (de) 1994-12-07
DE69130777D1 (de) 1999-02-25
EP0627637B1 (de) 1999-01-13
EP0441594B1 (de) 1998-10-28

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