DE69033078D1 - Verfahren zum Verbinden eines TAB-Bandes an einem Halbleiterchip - Google Patents

Verfahren zum Verbinden eines TAB-Bandes an einem Halbleiterchip

Info

Publication number
DE69033078D1
DE69033078D1 DE69033078T DE69033078T DE69033078D1 DE 69033078 D1 DE69033078 D1 DE 69033078D1 DE 69033078 T DE69033078 T DE 69033078T DE 69033078 T DE69033078 T DE 69033078T DE 69033078 D1 DE69033078 D1 DE 69033078D1
Authority
DE
Germany
Prior art keywords
semiconductor chip
tab tape
tab
tape
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69033078T
Other languages
English (en)
Other versions
DE69033078T2 (de
Inventor
Yasuhide Ono
Tadakatsu Maruyama
Hiroaki Otsuka
Hiroyuki Tanahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1234916A external-priority patent/JP2780376B2/ja
Priority claimed from JP1234915A external-priority patent/JP2780375B2/ja
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Application granted granted Critical
Publication of DE69033078D1 publication Critical patent/DE69033078D1/de
Publication of DE69033078T2 publication Critical patent/DE69033078T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
DE69033078T 1989-09-11 1990-09-07 Verfahren zum Verbinden eines TAB-Bandes an einem Halbleiterchip Expired - Lifetime DE69033078T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1234916A JP2780376B2 (ja) 1989-09-11 1989-09-11 バンプ付きｔａｂテープの製造方法
JP1234915A JP2780375B2 (ja) 1989-09-11 1989-09-11 Ｔａｂテープと半導体チップを接続する方法およびそれに用いるバンプシート
JP23491789 1989-09-11

Publications (2)

Publication Number Publication Date
DE69033078D1 true DE69033078D1 (de) 1999-06-02
DE69033078T2 DE69033078T2 (de) 1999-12-23

Family

ID=27332202

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69033078T Expired - Lifetime DE69033078T2 (de) 1989-09-11 1990-09-07 Verfahren zum Verbinden eines TAB-Bandes an einem Halbleiterchip
DE69027448T Expired - Lifetime DE69027448T2 (de) 1989-09-11 1990-09-07 Verfahrungen und Vorrichtung zur Befestigung von Kontakthöckern auf TAB-Trägerleiter

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69027448T Expired - Lifetime DE69027448T2 (de) 1989-09-11 1990-09-07 Verfahrungen und Vorrichtung zur Befestigung von Kontakthöckern auf TAB-Trägerleiter

Country Status (6)

Country Link
US (1) US5164336A (de)
EP (3) EP0911873A3 (de)
KR (1) KR940004246B1 (de)
DE (2) DE69033078T2 (de)
MY (1) MY106847A (de)
SG (1) SG73389A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
JP2715810B2 (ja) * 1991-07-25 1998-02-18 日本電気株式会社 フィルムキャリア半導体装置とその製造方法
JP2558976B2 (ja) * 1991-11-08 1996-11-27 松下電器産業株式会社 電子部品の電極とリードとの接合方法
US5728599A (en) * 1993-10-28 1998-03-17 Lsi Logic Corporation Printable superconductive leadframes for semiconductor device assembly
US5367435A (en) * 1993-11-16 1994-11-22 International Business Machines Corporation Electronic package structure and method of making same
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages
JPH07221105A (ja) * 1994-01-31 1995-08-18 Fujitsu Ltd 半導体装置の製造方法及び半導体装置
JP2833996B2 (ja) * 1994-05-25 1998-12-09 日本電気株式会社 フレキシブルフィルム及びこれを有する半導体装置
FR2728392A1 (fr) * 1994-12-16 1996-06-21 Bull Sa Procede et support de connexion d'un circuit integre a un autre support par l'intermediaire de boules
US5899376A (en) * 1995-07-11 1999-05-04 Nippon Steel Corporation Transfer of flux onto electrodes and production of bumps on electrodes
US6008071A (en) * 1995-09-20 1999-12-28 Fujitsu Limited Method of forming solder bumps onto an integrated circuit device
US5687901A (en) * 1995-11-14 1997-11-18 Nippon Steel Corporation Process and apparatus for forming ball bumps
FR2748849B1 (fr) * 1996-05-20 1998-06-19 Commissariat Energie Atomique Systeme de composants a hybrider et procede d'hybridation autorisant des dilatations thermiques
DE69738324T2 (de) * 1996-08-27 2008-10-09 Nippon Steel Corp. Herstellungsverfahren einer halbleiteranordnung mit niedrig schmelzendem metallhöckern
JPH10163211A (ja) * 1996-12-02 1998-06-19 Fujitsu Ltd バンプ形成用板部材の製造方法及びバンプ形成方法
US5839191A (en) * 1997-01-24 1998-11-24 Unisys Corporation Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package
US7135397B2 (en) * 2003-09-10 2006-11-14 Texas Instruments Incorporated Method and system for packaging ball grid arrays
US7404513B2 (en) * 2004-12-30 2008-07-29 Texas Instruments Incorporated Wire bonds having pressure-absorbing balls
JP2009099905A (ja) * 2007-10-19 2009-05-07 Rohm Co Ltd 半導体装置
US9839143B2 (en) * 2012-04-10 2017-12-05 Panasonic Intellectual Property Management Co., Ltd. Electrode joining method, production method of electrode joined structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718347A (en) * 1980-07-08 1982-01-30 Citizen Watch Co Ltd Mounting structure of ic
EP0117348B1 (de) * 1982-12-06 1987-03-11 The Welding Institute Verfahren zum Anschweissen von Drähten an Halbleiterbauelemente
JPS59202643A (ja) * 1983-04-30 1984-11-16 Sharp Corp Ｌｓｉ接続方法
JPS6052045A (ja) * 1983-08-31 1985-03-23 Matsushita Electric Ind Co Ltd バンプ電極形成方法
JPS6149432A (ja) * 1984-08-18 1986-03-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
DE3685647T2 (de) * 1985-07-16 1993-01-07 Nippon Telegraph & Telephone Verbindungskontakte zwischen substraten und verfahren zur herstellung derselben.
US4814855A (en) * 1986-04-29 1989-03-21 International Business Machines Corporation Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
EP0260490A1 (de) * 1986-08-27 1988-03-23 Kabushiki Kaisha Toshiba Verbindungsschicht für ein elektronisches Bauelement und Verfahren zum Verbinden eines elektronischen Bauelementes mit einer solchen Schicht
JP2532464B2 (ja) * 1987-05-20 1996-09-11 松下電器産業株式会社 バンプの転写方法
JPS63291427A (ja) * 1987-05-23 1988-11-29 Matsushita Electric Works Ltd バンプ付フィンガ−リ−ド担持体の製法
JPH0795554B2 (ja) * 1987-09-14 1995-10-11 株式会社日立製作所 はんだ球整列装置
JPH01243554A (ja) * 1988-03-25 1989-09-28 Hitachi Ltd 半導体装置の製造方法
US5006917A (en) * 1989-08-25 1991-04-09 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging

Also Published As

Publication number Publication date
EP0427384A3 (en) 1992-01-02
KR910007096A (ko) 1991-04-30
US5164336A (en) 1992-11-17
SG73389A1 (en) 2000-06-20
EP0911873A3 (de) 1999-12-15
DE69027448T2 (de) 1996-10-10
EP0427384A2 (de) 1991-05-15
DE69033078T2 (de) 1999-12-23
EP0911873A2 (de) 1999-04-28
EP0427384B1 (de) 1999-04-28
DE69027448D1 (de) 1996-07-18
EP0527387B1 (de) 1996-06-12
EP0527387A1 (de) 1993-02-17
KR940004246B1 (ko) 1994-05-19
MY106847A (en) 1995-08-30

Similar Documents

Publication Publication Date Title
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