SG73389A1 - Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method - Google Patents

Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method

Info

Publication number
SG73389A1
SG73389A1 SG1996005005A SG1996005005A SG73389A1 SG 73389 A1 SG73389 A1 SG 73389A1 SG 1996005005 A SG1996005005 A SG 1996005005A SG 1996005005 A SG1996005005 A SG 1996005005A SG 73389 A1 SG73389 A1 SG 73389A1
Authority
SG
Singapore
Prior art keywords
semiconductor chip
tape
tab tape
bumped
connecting tab
Prior art date
Application number
SG1996005005A
Other languages
English (en)
Inventor
Yasuhide Ohno
Tadakatsu Maruyama
Hiroaki Otsuka
Hiroyuki Tanahashi
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1234916A external-priority patent/JP2780376B2/ja
Priority claimed from JP1234915A external-priority patent/JP2780375B2/ja
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of SG73389A1 publication Critical patent/SG73389A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79Apparatus for Tape Automated Bonding [TAB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49572Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/11Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/113Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • HELECTRICITY
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
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    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
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    • H01L2924/01Chemical elements
    • H01L2924/01032Germanium [Ge]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01061Promethium [Pm]
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    • H01ELECTRIC ELEMENTS
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    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
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    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
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    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12042LASER
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
SG1996005005A 1989-09-11 1990-09-07 Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method SG73389A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23491789 1989-09-11
JP1234916A JP2780376B2 (ja) 1989-09-11 1989-09-11 バンプ付きtabテープの製造方法
JP1234915A JP2780375B2 (ja) 1989-09-11 1989-09-11 Tabテープと半導体チップを接続する方法およびそれに用いるバンプシート

Publications (1)

Publication Number Publication Date
SG73389A1 true SG73389A1 (en) 2000-06-20

Family

ID=27332202

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996005005A SG73389A1 (en) 1989-09-11 1990-09-07 Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method

Country Status (6)

Country Link
US (1) US5164336A (de)
EP (3) EP0911873A3 (de)
KR (1) KR940004246B1 (de)
DE (2) DE69033078T2 (de)
MY (1) MY106847A (de)
SG (1) SG73389A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
JP2715810B2 (ja) * 1991-07-25 1998-02-18 日本電気株式会社 フィルムキャリア半導体装置とその製造方法
JP2558976B2 (ja) * 1991-11-08 1996-11-27 松下電器産業株式会社 電子部品の電極とリードとの接合方法
US5728599A (en) * 1993-10-28 1998-03-17 Lsi Logic Corporation Printable superconductive leadframes for semiconductor device assembly
US5367435A (en) * 1993-11-16 1994-11-22 International Business Machines Corporation Electronic package structure and method of making same
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages
JPH07221105A (ja) * 1994-01-31 1995-08-18 Fujitsu Ltd 半導体装置の製造方法及び半導体装置
JP2833996B2 (ja) * 1994-05-25 1998-12-09 日本電気株式会社 フレキシブルフィルム及びこれを有する半導体装置
FR2728392A1 (fr) * 1994-12-16 1996-06-21 Bull Sa Procede et support de connexion d'un circuit integre a un autre support par l'intermediaire de boules
US5899376A (en) * 1995-07-11 1999-05-04 Nippon Steel Corporation Transfer of flux onto electrodes and production of bumps on electrodes
US6008071A (en) * 1995-09-20 1999-12-28 Fujitsu Limited Method of forming solder bumps onto an integrated circuit device
US5687901A (en) * 1995-11-14 1997-11-18 Nippon Steel Corporation Process and apparatus for forming ball bumps
FR2748849B1 (fr) * 1996-05-20 1998-06-19 Commissariat Energie Atomique Systeme de composants a hybrider et procede d'hybridation autorisant des dilatations thermiques
JP3633941B2 (ja) 1996-08-27 2005-03-30 新日本製鐵株式会社 半導体装置製造方法
JPH10163211A (ja) * 1996-12-02 1998-06-19 Fujitsu Ltd バンプ形成用板部材の製造方法及びバンプ形成方法
US5839191A (en) * 1997-01-24 1998-11-24 Unisys Corporation Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package
US7135397B2 (en) * 2003-09-10 2006-11-14 Texas Instruments Incorporated Method and system for packaging ball grid arrays
US7404513B2 (en) * 2004-12-30 2008-07-29 Texas Instruments Incorporated Wire bonds having pressure-absorbing balls
JP2009099905A (ja) * 2007-10-19 2009-05-07 Rohm Co Ltd 半導体装置
CN104206036B (zh) * 2012-04-10 2017-05-03 松下知识产权经营株式会社 电极接合方法、电极接合结构体的制造方法以及电极接合结构体的制造系统

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Publication number Priority date Publication date Assignee Title
JPS5718347A (en) * 1980-07-08 1982-01-30 Citizen Watch Co Ltd Mounting structure of ic
DE3370240D1 (en) * 1982-12-06 1987-04-16 Welding Inst Bonding leads to semiconductor devices
JPS59202643A (ja) * 1983-04-30 1984-11-16 Sharp Corp Lsi接続方法
JPS6052045A (ja) * 1983-08-31 1985-03-23 Matsushita Electric Ind Co Ltd バンプ電極形成方法
JPS6149432A (ja) * 1984-08-18 1986-03-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
WO1987000686A1 (en) * 1985-07-16 1987-01-29 Nippon Telegraph And Telephone Corporation Connection terminals between substrates and method of producing the same
US4814855A (en) * 1986-04-29 1989-03-21 International Business Machines Corporation Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
EP0260490A1 (de) * 1986-08-27 1988-03-23 Kabushiki Kaisha Toshiba Verbindungsschicht für ein elektronisches Bauelement und Verfahren zum Verbinden eines elektronischen Bauelementes mit einer solchen Schicht
JP2532464B2 (ja) * 1987-05-20 1996-09-11 松下電器産業株式会社 バンプの転写方法
JPS63291427A (ja) * 1987-05-23 1988-11-29 Matsushita Electric Works Ltd バンプ付フィンガ−リ−ド担持体の製法
JPH0795554B2 (ja) * 1987-09-14 1995-10-11 株式会社日立製作所 はんだ球整列装置
JPH01243554A (ja) * 1988-03-25 1989-09-28 Hitachi Ltd 半導体装置の製造方法
US5006917A (en) * 1989-08-25 1991-04-09 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging

Also Published As

Publication number Publication date
DE69027448T2 (de) 1996-10-10
DE69033078D1 (de) 1999-06-02
KR940004246B1 (ko) 1994-05-19
EP0527387B1 (de) 1996-06-12
EP0427384B1 (de) 1999-04-28
EP0911873A3 (de) 1999-12-15
EP0427384A2 (de) 1991-05-15
EP0427384A3 (en) 1992-01-02
KR910007096A (ko) 1991-04-30
EP0527387A1 (de) 1993-02-17
MY106847A (en) 1995-08-30
DE69033078T2 (de) 1999-12-23
DE69027448D1 (de) 1996-07-18
EP0911873A2 (de) 1999-04-28
US5164336A (en) 1992-11-17

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