JPS5772360A - Semiconductor device assembled according to film carrier system - Google Patents

Semiconductor device assembled according to film carrier system

Info

Publication number
JPS5772360A
JPS5772360A JP55148335A JP14833580A JPS5772360A JP S5772360 A JPS5772360 A JP S5772360A JP 55148335 A JP55148335 A JP 55148335A JP 14833580 A JP14833580 A JP 14833580A JP S5772360 A JPS5772360 A JP S5772360A
Authority
JP
Japan
Prior art keywords
chip
pads
leads
semiconductor device
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55148335A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55148335A priority Critical patent/JPS5772360A/en
Publication of JPS5772360A publication Critical patent/JPS5772360A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To manufacture the semiconductor device easily, at low cost and in excellent yield by a method wherein a connecting position of a lead to a semiconductor chip is bent to the semiconductor chip side and formed prominently, and the porjecting section is directly connected to a pad of the semiconductor chip. CONSTITUTION:The Al pads 2 are attached to the IC chip 1, and the leads 3 are directly heated and welded to the pads 2. The connected or combined positions of the leads 3 to the pads 2 are bent mechanically to the chip 1 side, and the bent projecting sections 4 fill the role of bumps. According to this constitution, a chip for normal wire bonding with no bump is used as the chip 1, the pads 2 are applied to the projecting sections 4 of the leads 3 from the lower side, and the whole is heated under this condition, thus combining the leads 3 and the chip 1, then electrically connecting them.
JP55148335A 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system Pending JPS5772360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55148335A JPS5772360A (en) 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55148335A JPS5772360A (en) 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system

Publications (1)

Publication Number Publication Date
JPS5772360A true JPS5772360A (en) 1982-05-06

Family

ID=15450460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55148335A Pending JPS5772360A (en) 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system

Country Status (1)

Country Link
JP (1) JPS5772360A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297833A (en) * 1988-05-26 1989-11-30 Hitachi Ltd Semiconductor device
JPH02192747A (en) * 1989-01-20 1990-07-30 Hitachi Cable Ltd Tape carrier for tab

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297833A (en) * 1988-05-26 1989-11-30 Hitachi Ltd Semiconductor device
JPH02192747A (en) * 1989-01-20 1990-07-30 Hitachi Cable Ltd Tape carrier for tab

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