JPS5469383A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5469383A
JPS5469383A JP13631777A JP13631777A JPS5469383A JP S5469383 A JPS5469383 A JP S5469383A JP 13631777 A JP13631777 A JP 13631777A JP 13631777 A JP13631777 A JP 13631777A JP S5469383 A JPS5469383 A JP S5469383A
Authority
JP
Japan
Prior art keywords
carrier
metallic foil
tape
tape carrier
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13631777A
Other languages
Japanese (ja)
Inventor
Toshihiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13631777A priority Critical patent/JPS5469383A/en
Publication of JPS5469383A publication Critical patent/JPS5469383A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: To avoid the deterioration dependent upon metallic compund generation by providing no dump in the wiring pad of a semiconductor element and forming a bump at the terminal of the finger lead of a tape carrier in the tape carrier system.
CONSTITUTION: Tape carrier 11 is formed by resin such as polymide, and metallic foil such as Cu is caused to adhere to one main face of tape rail 2 constituting a carrier by adhesive 3. Next, aperture 15 corresponding to semiconductor element 10 is provided in this metallic foil 14, and finger leads 14f and 14f' consisting of split metallic foil 14 ae caused to stand out in this aperture, and bumps 14b and 14b' such as Au and Zn for leading and connecting to electrode connection pads are provided at the tip lower face of finger leads. After that, the pad provided on element 10 and the bump are positioned to fix the element and the carrier to each other by thermo compression bonding. Thus, the deterioration is prevented even in a high-temperature life, and the cost is lowered.
COPYRIGHT: (C)1979,JPO&Japio
JP13631777A 1977-11-15 1977-11-15 Production of semiconductor device Pending JPS5469383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13631777A JPS5469383A (en) 1977-11-15 1977-11-15 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13631777A JPS5469383A (en) 1977-11-15 1977-11-15 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5469383A true JPS5469383A (en) 1979-06-04

Family

ID=15172378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13631777A Pending JPS5469383A (en) 1977-11-15 1977-11-15 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5469383A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
JPS5848445A (en) * 1981-09-17 1983-03-22 Matsushita Electric Ind Co Ltd Manufacture of film carrier
JPH03123046A (en) * 1981-07-17 1991-05-24 British Telecommun Plc <Bt> Method of manufacturing tape for automatic bonding

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
JPH03123046A (en) * 1981-07-17 1991-05-24 British Telecommun Plc <Bt> Method of manufacturing tape for automatic bonding
JPH0371778B2 (en) * 1981-07-17 1991-11-14 Buriteitsushu Terekomyunikeeshonzu Plc
JPS5848445A (en) * 1981-09-17 1983-03-22 Matsushita Electric Ind Co Ltd Manufacture of film carrier
JPS6234142B2 (en) * 1981-09-17 1987-07-24 Matsushita Electric Ind Co Ltd

Similar Documents

Publication Publication Date Title
GB1109806A (en) Improvements in the interconnection of electrical circuit devices
JPS6428945A (en) Circuit package assembly
SG82590A1 (en) Bumpless flip chip assembly with strips and via-fill
MY106847A (en) Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method.
JPS5655067A (en) Semiconductor integrated circuit device
JPS5469383A (en) Production of semiconductor device
MY120334A (en) Bump formation method
JPS5487173A (en) Semiconductor device
JPS5277587A (en) Wiring of integrated circuit outside chip
JPS5449066A (en) Semiconductor device
JPS5240973A (en) Method of connecting semiconductor devices
JPS6450539A (en) Connection of electronic component and transfer type microlead faceplate used therefor
JPS5546572A (en) Tape carrier for mounting integrated circuit chips
JPS6477136A (en) Tape carrier for semiconductor device
JPS647645A (en) Semiconductor device and manufacture thereof
JPS5353261A (en) Electronic device
JPS5559746A (en) Semiconductor device and its mounting circuit device
JPS5290975A (en) Electronic wristwatch
MY106858A (en) Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin.
JPS5772360A (en) Semiconductor device assembled according to film carrier system
GB8911147D0 (en) Flip chip solder bond structure for devices with gold based metallisation
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS5448166A (en) Electronic parts
JPS5778146A (en) Integrated circuit device
JPS5386572A (en) Semiconductor integrated circuit