DE3686103D1 - Verfahren zum flachmachen eines substrats. - Google Patents
Verfahren zum flachmachen eines substrats.Info
- Publication number
- DE3686103D1 DE3686103D1 DE8686107012T DE3686103T DE3686103D1 DE 3686103 D1 DE3686103 D1 DE 3686103D1 DE 8686107012 T DE8686107012 T DE 8686107012T DE 3686103 T DE3686103 T DE 3686103T DE 3686103 D1 DE3686103 D1 DE 3686103D1
- Authority
- DE
- Germany
- Prior art keywords
- flatching
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
- H01L21/0212—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Formation Of Insulating Films (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/759,030 US4612210A (en) | 1985-07-25 | 1985-07-25 | Process for planarizing a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3686103D1 true DE3686103D1 (de) | 1992-08-27 |
DE3686103T2 DE3686103T2 (de) | 1993-03-04 |
Family
ID=25054129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686107012T Expired - Fee Related DE3686103T2 (de) | 1985-07-25 | 1986-05-23 | Verfahren zum flachmachen eines substrats. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4612210A (de) |
EP (1) | EP0209670B1 (de) |
JP (1) | JPH06105704B2 (de) |
DE (1) | DE3686103T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4892896A (en) * | 1988-04-04 | 1990-01-09 | Ethyl Corporation | Processing polyimide precursor compositions |
US5114757A (en) * | 1990-10-26 | 1992-05-19 | Linde Harold G | Enhancement of polyimide adhesion on reactive metals |
US5194928A (en) * | 1991-01-14 | 1993-03-16 | International Business Machines Corporation | Passivation of metal in metal/polyimide structure |
US5114754A (en) * | 1991-01-14 | 1992-05-19 | International Business Machines Corporation | Passivation of metal in metal/polyimide structures |
US5153307A (en) * | 1991-07-31 | 1992-10-06 | International Business Machines Corporation | Stabilization of polyamide alkyl ester solutions |
US5276126A (en) * | 1991-11-04 | 1994-01-04 | Ocg Microelectronic Materials, Inc. | Selected novolak resin planarization layer for lithographic applications |
US5940729A (en) * | 1996-04-17 | 1999-08-17 | International Business Machines Corp. | Method of planarizing a curved substrate and resulting structure |
US5738915A (en) * | 1996-09-19 | 1998-04-14 | Lambda Technologies, Inc. | Curing polymer layers on semiconductor substrates using variable frequency microwave energy |
DE19705882A1 (de) * | 1997-02-15 | 1998-08-20 | Beck & Co Ag Dr | Mischungen aus Lösungen von Polyamidocarbonsäuren und Lösungen von polyimidbildenden Ausgangsstoffen |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3882085A (en) * | 1969-04-03 | 1975-05-06 | Veba Chemie Ag | Polyamide polymers from amino polyamide reactants |
GB1317321A (en) * | 1970-04-13 | 1973-05-16 | Int Harvester Co | Polyimides |
US3779450A (en) * | 1972-03-29 | 1973-12-18 | Pennwalt Corp | Basket centrifuge |
JPS6040705B2 (ja) * | 1978-06-26 | 1985-09-12 | インタ−ナシヨナル・ビジネス・マシ−ンンズ・コ−ポレ−シヨン | 電子回路の保護被覆形成方法 |
JPS56118857A (en) * | 1980-02-25 | 1981-09-18 | Nitto Electric Ind Co | Thermofusing polyimide composite film and its manufacture |
US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
EP0048219B1 (de) * | 1980-09-15 | 1986-10-01 | Ciba-Geigy Ag | Verwendung von flexiblem Basismaterial zur Herstellung von gedruckten Schaltungen |
US4515828A (en) * | 1981-01-02 | 1985-05-07 | International Business Machines Corporation | Planarization method |
GB2104411B (en) * | 1981-07-08 | 1985-02-20 | Ube Industries | Aromatic polyimide composite separating membrane |
JPH07105319B2 (ja) * | 1982-09-20 | 1995-11-13 | 富士通株式会社 | 半導体装置の製造方法 |
JPS5976451A (ja) * | 1982-10-26 | 1984-05-01 | Hitachi Ltd | 半導体装置 |
DE3301197A1 (de) * | 1983-01-15 | 1984-07-19 | Akzo Gmbh, 5600 Wuppertal | Polyimid-laminate mit hoher schaelfestigkeit |
US4528216A (en) * | 1983-02-24 | 1985-07-09 | Oki Electric Industry Co., Ltd. | Process for forming heat-resistant resin films of polyimide and organosilicic reactants |
US4467000A (en) * | 1983-03-29 | 1984-08-21 | International Business Machines Corporation | Process for coating a substrate with polyimide |
JPS59212834A (ja) * | 1983-05-17 | 1984-12-01 | Mitsubishi Electric Corp | 感光性耐熱材料 |
DE3486131T2 (de) * | 1983-08-01 | 1993-10-28 | Hitachi Chemical Co Ltd | Harzmaterial mit geringer thermischer Ausdehnung für Verdrahtungsisolationsfolie. |
US4533574A (en) * | 1984-09-14 | 1985-08-06 | E. I. Du Pont De Nemours And Company | Polyimide coating compositions of esterified anhydride and aromatic amine mixture |
US4568601A (en) * | 1984-10-19 | 1986-02-04 | International Business Machines Corporation | Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures |
-
1985
- 1985-07-25 US US06/759,030 patent/US4612210A/en not_active Expired - Fee Related
-
1986
- 1986-05-23 EP EP86107012A patent/EP0209670B1/de not_active Expired - Lifetime
- 1986-05-23 DE DE8686107012T patent/DE3686103T2/de not_active Expired - Fee Related
- 1986-06-18 JP JP61140402A patent/JPH06105704B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0209670B1 (de) | 1992-07-22 |
EP0209670A3 (en) | 1989-10-25 |
DE3686103T2 (de) | 1993-03-04 |
US4612210A (en) | 1986-09-16 |
EP0209670A2 (de) | 1987-01-28 |
JPH06105704B2 (ja) | 1994-12-21 |
JPS6226825A (ja) | 1987-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |