DE3685475D1 - Verfahren zum loeten ohne flussmittel in einer silanatmosphaere. - Google Patents

Verfahren zum loeten ohne flussmittel in einer silanatmosphaere.

Info

Publication number
DE3685475D1
DE3685475D1 DE8686113231T DE3685475T DE3685475D1 DE 3685475 D1 DE3685475 D1 DE 3685475D1 DE 8686113231 T DE8686113231 T DE 8686113231T DE 3685475 T DE3685475 T DE 3685475T DE 3685475 D1 DE3685475 D1 DE 3685475D1
Authority
DE
Germany
Prior art keywords
mosphaere
silanate
soldering
fluid
silanate mosphaere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686113231T
Other languages
English (en)
Inventor
Howard, Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3685475D1 publication Critical patent/DE3685475D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
DE8686113231T 1985-10-31 1986-09-26 Verfahren zum loeten ohne flussmittel in einer silanatmosphaere. Expired - Fee Related DE3685475D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/793,404 US4646958A (en) 1985-10-31 1985-10-31 Fluxless soldering process using a silane atmosphere

Publications (1)

Publication Number Publication Date
DE3685475D1 true DE3685475D1 (de) 1992-07-02

Family

ID=25159847

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686113231T Expired - Fee Related DE3685475D1 (de) 1985-10-31 1986-09-26 Verfahren zum loeten ohne flussmittel in einer silanatmosphaere.

Country Status (4)

Country Link
US (1) US4646958A (de)
EP (1) EP0221326B1 (de)
JP (1) JPS62104672A (de)
DE (1) DE3685475D1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
JPH0292454A (ja) * 1988-09-30 1990-04-03 Kanto Yakin Kogyo Kk 雰囲気熱処理方法
DE68907033T2 (de) * 1988-12-23 1993-12-02 Ibm Löten und Verbinden von Halbleiterkontakten.
US5225711A (en) * 1988-12-23 1993-07-06 International Business Machines Corporation Palladium enhanced soldering and bonding of semiconductor device contacts
US5048744A (en) * 1988-12-23 1991-09-17 International Business Machines Corporation Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
US4979664A (en) * 1989-11-15 1990-12-25 At&T Bell Laboratories Method for manufacturing a soldered article
JP2564667B2 (ja) * 1989-12-06 1996-12-18 古河電気工業株式会社 絶縁型ヒートパイプの接合方法
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device
US5139704A (en) * 1991-02-12 1992-08-18 Hughes Aircraft Company Fluxless solder
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
FR2686212B1 (fr) * 1992-01-13 1994-03-11 Air Liquide Procede d'application de composition de soudure sur des broches de composants electroniques.
US5249733A (en) * 1992-07-16 1993-10-05 At&T Bell Laboratories Solder self-alignment methods
US5604831A (en) * 1992-11-16 1997-02-18 International Business Machines Corporation Optical module with fluxless laser reflow soldered joints
JPH06209058A (ja) * 1993-01-12 1994-07-26 Mitsubishi Electric Corp 半導体装置及びその製造方法，並びにその実装方法
US5299731A (en) * 1993-02-22 1994-04-05 L'air Liquide Corrosion resistant welding of stainless steel
US5499754A (en) * 1993-11-19 1996-03-19 Mcnc Fluxless soldering sample pretreating system
US6021940A (en) * 1993-12-15 2000-02-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and apparatus for reflow soldering metallic surfaces
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
US5411200A (en) * 1994-02-28 1995-05-02 American Air Liquide, Inc. Process and apparatus for the wave soldering of circuit boards
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
US5615825A (en) * 1995-05-12 1997-04-01 Mcnc Fluorinated fluxless soldering
US6013381A (en) * 1996-12-06 2000-01-11 Mcnc Fluorinated fluxless soldering
US6092714A (en) * 1999-03-16 2000-07-25 Mcms, Inc. Method of utilizing a plasma gas mixture containing argon and CF4 to clean and coat a conductor
US6489229B1 (en) 2001-09-07 2002-12-03 Motorola, Inc. Method of forming a semiconductor device having conductive bumps without using gold
WO2006124625A2 (en) * 2005-05-12 2006-11-23 Nanosys, Inc. Use of nanoparticles in film formation and as solder
WO2012099771A1 (en) * 2011-01-17 2012-07-26 Orthodyne Electronics Corporation Systems and methods for processing ribbon and wire in ultrasonic bonding systems
DE102011009964A1 (de) 2011-02-01 2012-08-02 Linde Aktiengesellschaft Verfahren zum Weich-, Hart- und Hochtemperaturlöten

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2768278A (en) * 1954-06-11 1956-10-23 Union Carbide & Carbon Corp Gas shielded metal arc welding
US3012903A (en) * 1960-05-03 1961-12-12 Coast Metals Inc Method of brazing
US3381081A (en) * 1965-04-16 1968-04-30 Cts Corp Electrical connection and method of making the same
DE1552919A1 (de) * 1966-12-06 1970-03-05 Licentia Gmbh Verfahren zum flussmittelfreien Weichloeten
US3665590A (en) * 1970-01-19 1972-05-30 Ncr Co Semiconductor flip-chip soldering method
US3754698A (en) * 1970-10-29 1973-08-28 North American Rockwell Hot gas fusion apparatus
US3921285A (en) * 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
US4576659A (en) * 1982-12-02 1986-03-18 International Business Machines Corporation Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures

Also Published As

Publication number Publication date
JPS62104672A (ja) 1987-05-15
EP0221326A2 (de) 1987-05-13
EP0221326B1 (de) 1992-05-27
EP0221326A3 (en) 1988-01-27
US4646958A (en) 1987-03-03
JPH0223266B2 (de) 1990-05-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee