DE69012373D1 - Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit. - Google Patents

Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit.

Info

Publication number
DE69012373D1
DE69012373D1 DE69012373T DE69012373T DE69012373D1 DE 69012373 D1 DE69012373 D1 DE 69012373D1 DE 69012373 T DE69012373 T DE 69012373T DE 69012373 T DE69012373 T DE 69012373T DE 69012373 D1 DE69012373 D1 DE 69012373D1
Authority
DE
Germany
Prior art keywords
treatment
liquid
drying substrates
substrates
drying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69012373T
Other languages
English (en)
Other versions
DE69012373T2 (de
Inventor
Adriaan Franciscus Ma Leenaars
Oekel Jacques Jules Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE69012373D1 publication Critical patent/DE69012373D1/de
Publication of DE69012373T2 publication Critical patent/DE69012373T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
DE69012373T 1989-02-27 1990-02-21 Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit. Expired - Lifetime DE69012373T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8900480A NL8900480A (nl) 1989-02-27 1989-02-27 Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.

Publications (2)

Publication Number Publication Date
DE69012373D1 true DE69012373D1 (de) 1994-10-20
DE69012373T2 DE69012373T2 (de) 1995-04-20

Family

ID=19854214

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69012373T Expired - Lifetime DE69012373T2 (de) 1989-02-27 1990-02-21 Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit.

Country Status (7)

Country Link
US (4) US6012472A (de)
EP (1) EP0385536B1 (de)
JP (1) JP3009699B2 (de)
KR (1) KR0173449B1 (de)
CN (1) CN1023450C (de)
DE (1) DE69012373T2 (de)
NL (1) NL8900480A (de)

Families Citing this family (100)

* Cited by examiner, † Cited by third party
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JPH04215878A (ja) * 1990-03-14 1992-08-06 Seiko Epson Corp 液中ジェット洗浄方法及び洗浄装置
JP3209426B2 (ja) 1991-10-04 2001-09-17 シーエフエムティ インコーポレイテッド 複雑な形状を有するマイクロパーツの洗浄
JP2639771B2 (ja) * 1991-11-14 1997-08-13 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
JPH06196472A (ja) * 1992-12-22 1994-07-15 Soltec:Kk ウェットエッチング方法及びウェット洗浄方法
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5911837A (en) * 1993-07-16 1999-06-15 Legacy Systems, Inc. Process for treatment of semiconductor wafers in a fluid
AU7923894A (en) † 1993-09-22 1995-04-10 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
JP2888409B2 (ja) * 1993-12-14 1999-05-10 信越半導体株式会社 ウェーハ洗浄槽
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US5772784A (en) 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
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US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
DE19549490C2 (de) * 1995-01-05 2001-01-18 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
DE19546990C2 (de) * 1995-01-05 1997-07-03 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
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JP4421686B2 (ja) 1996-06-24 2010-02-24 インテルウニフェルシテール ミクロエレクトロニカ セントルム フェライニジンク ゾンダ ウィンストベヤーク 平坦な基材を湿式でクリーニングまたはエッチングするための装置および方法
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EP3840023B1 (de) 2019-12-18 2022-10-19 Siltronic AG Verbesserte vorrichtung zum trocknen von halbleitersubstraten
EP3840021B1 (de) 2019-12-18 2022-10-19 Siltronic AG Verbesserte vorrichtung zum trocknen von halbleitersubstraten

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Also Published As

Publication number Publication date
US6012472A (en) 2000-01-11
JP3009699B2 (ja) 2000-02-14
NL8900480A (nl) 1990-09-17
CN1045539A (zh) 1990-09-26
EP0385536A1 (de) 1990-09-05
CN1023450C (zh) 1994-01-12
KR900013597A (ko) 1990-09-06
US6170495B1 (en) 2001-01-09
US6139645A (en) 2000-10-31
DE69012373T2 (de) 1995-04-20
US6533872B1 (en) 2003-03-18
KR0173449B1 (ko) 1999-04-01
JPH02291128A (ja) 1990-11-30
EP0385536B1 (de) 1994-09-14

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