DE60140780D1 - Verfahren und Vorrichtung zum Reinigen und Trocknen eines Substrats - Google Patents

Verfahren und Vorrichtung zum Reinigen und Trocknen eines Substrats

Info

Publication number
DE60140780D1
DE60140780D1 DE60140780T DE60140780T DE60140780D1 DE 60140780 D1 DE60140780 D1 DE 60140780D1 DE 60140780 T DE60140780 T DE 60140780T DE 60140780 T DE60140780 T DE 60140780T DE 60140780 D1 DE60140780 D1 DE 60140780D1
Authority
DE
Germany
Prior art keywords
substrate
liquid
drying
cleaning
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140780T
Other languages
English (en)
Inventor
Paul Mertens
Marc Meuris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Application granted granted Critical
Publication of DE60140780D1 publication Critical patent/DE60140780D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/10—Arrangements for feeding, heating or supporting materials; Controlling movement, tension or position of materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/24—Arrangements of devices using drying processes not involving heating
    • F26B13/28—Arrangements of devices using drying processes not involving heating for applying pressure; for brushing; for wiping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE60140780T 2000-06-27 2001-06-26 Verfahren und Vorrichtung zum Reinigen und Trocknen eines Substrats Expired - Lifetime DE60140780D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21469300P 2000-06-27 2000-06-27

Publications (1)

Publication Number Publication Date
DE60140780D1 true DE60140780D1 (de) 2010-01-28

Family

ID=22800074

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140780T Expired - Lifetime DE60140780D1 (de) 2000-06-27 2001-06-26 Verfahren und Vorrichtung zum Reinigen und Trocknen eines Substrats

Country Status (5)

Country Link
US (2) US6632751B2 (de)
EP (1) EP1168422B1 (de)
JP (1) JP4629270B2 (de)
AT (1) ATE452419T1 (de)
DE (1) DE60140780D1 (de)

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US6875289B2 (en) 2002-09-13 2005-04-05 Fsi International, Inc. Semiconductor wafer cleaning systems and methods
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US7793233B1 (en) 2003-03-12 2010-09-07 Microsoft Corporation System and method for customizing note flags
US7454763B2 (en) * 2003-03-26 2008-11-18 Microsoft Corporation System and method for linking page content with a video media file and displaying the links
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US7707255B2 (en) 2003-07-01 2010-04-27 Microsoft Corporation Automatic grouping of electronic mail
US8255828B2 (en) 2004-08-16 2012-08-28 Microsoft Corporation Command user interface for displaying selectable software functionality controls
US8117542B2 (en) * 2004-08-16 2012-02-14 Microsoft Corporation User interface for displaying selectable software functionality controls that are contextually relevant to a selected object
US7703036B2 (en) 2004-08-16 2010-04-20 Microsoft Corporation User interface for displaying selectable software functionality controls that are relevant to a selected object
US8146016B2 (en) 2004-08-16 2012-03-27 Microsoft Corporation User interface for displaying a gallery of formatting options applicable to a selected object
US7712049B2 (en) * 2004-09-30 2010-05-04 Microsoft Corporation Two-dimensional radial user interface for computer software applications
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US7530029B2 (en) * 2005-05-24 2009-05-05 Microsoft Corporation Narrow mode navigation pane
US7845540B2 (en) * 2005-08-30 2010-12-07 Micron Technology, Inc. Systems and methods for depositing conductive material into openings in microfeature workpieces
US7739259B2 (en) * 2005-09-12 2010-06-15 Microsoft Corporation Integrated search and find user interface
US8627222B2 (en) 2005-09-12 2014-01-07 Microsoft Corporation Expanded search and find user interface
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
US9727989B2 (en) 2006-06-01 2017-08-08 Microsoft Technology Licensing, Llc Modifying and formatting a chart using pictorially provided chart elements
US7775219B2 (en) 2006-12-29 2010-08-17 Applied Materials, Inc. Process chamber lid and controlled exhaust
US20080236615A1 (en) * 2007-03-28 2008-10-02 Mimken Victor B Method of processing wafers in a sequential fashion
US8484578B2 (en) 2007-06-29 2013-07-09 Microsoft Corporation Communication between a document editor in-space user interface and a document editor out-space user interface
US8762880B2 (en) 2007-06-29 2014-06-24 Microsoft Corporation Exposing non-authoring features through document status information in an out-space user interface
JP4994990B2 (ja) * 2007-08-03 2012-08-08 東京エレクトロン株式会社 基板処理方法、基板処理装置、プログラム、記録媒体および置換剤
JP2009081366A (ja) * 2007-09-27 2009-04-16 Elpida Memory Inc バッチ処理装置
US9588781B2 (en) 2008-03-31 2017-03-07 Microsoft Technology Licensing, Llc Associating command surfaces with multiple active components
US9665850B2 (en) 2008-06-20 2017-05-30 Microsoft Technology Licensing, Llc Synchronized conversation-centric message list and message reading pane
JP5564038B2 (ja) * 2008-09-03 2014-07-30 東レバッテリーセパレータフィルム株式会社 熱可塑性シートを乾燥させる装置および方法
KR101421752B1 (ko) * 2008-10-21 2014-07-22 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
WO2010065270A2 (en) * 2008-11-25 2010-06-10 3M Innovative Properties Company Apparatus and method for cleaning flexible webs
DE102008061521B4 (de) * 2008-12-10 2011-12-08 Siltronic Ag Verfahren zur Behandlung einer Halbleiterscheibe
EP2381310B1 (de) 2010-04-22 2015-05-06 ASML Netherlands BV Flüssigkeitshandhabungsstruktur und lithographischer Apparat
US8732978B2 (en) * 2011-06-02 2014-05-27 Yuji Richard Kuan Drying silicon particles and recovering solvent
US9508582B2 (en) * 2011-06-03 2016-11-29 Tel Nexx, Inc. Parallel single substrate marangoni module
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system

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Also Published As

Publication number Publication date
US20020016082A1 (en) 2002-02-07
US6910487B2 (en) 2005-06-28
JP2002164319A (ja) 2002-06-07
EP1168422A2 (de) 2002-01-02
ATE452419T1 (de) 2010-01-15
EP1168422A3 (de) 2006-03-22
US6632751B2 (en) 2003-10-14
EP1168422B1 (de) 2009-12-16
JP4629270B2 (ja) 2011-02-09
US20040010933A1 (en) 2004-01-22

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Legal Events

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8364 No opposition during term of opposition