ATE280935T1 - Verfahren zur trocknung eines substrats - Google Patents

Verfahren zur trocknung eines substrats

Info

Publication number
ATE280935T1
ATE280935T1 AT99935126T AT99935126T ATE280935T1 AT E280935 T1 ATE280935 T1 AT E280935T1 AT 99935126 T AT99935126 T AT 99935126T AT 99935126 T AT99935126 T AT 99935126T AT E280935 T1 ATE280935 T1 AT E280935T1
Authority
AT
Austria
Prior art keywords
drying
substrate
fluid
substrates
cleaning
Prior art date
Application number
AT99935126T
Other languages
English (en)
Inventor
Norio Maeda
Koji Sumi
Hiroshi Aihara
Masao Oono
Naoaki Izutani
Original Assignee
Toho Kasei Ltd
Daikin Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toho Kasei Ltd, Daikin Ind Ltd filed Critical Toho Kasei Ltd
Application granted granted Critical
Publication of ATE280935T1 publication Critical patent/ATE280935T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
AT99935126T 1999-01-18 1999-08-10 Verfahren zur trocknung eines substrats ATE280935T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP933899 1999-01-18
JP12269699A JP3174038B2 (ja) 1999-01-18 1999-04-28 基板乾燥方法およびその装置
PCT/JP1999/004335 WO2000042373A1 (fr) 1999-01-18 1999-08-10 Technique de séchage de substrat et dispositif correspondant

Publications (1)

Publication Number Publication Date
ATE280935T1 true ATE280935T1 (de) 2004-11-15

Family

ID=26344042

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99935126T ATE280935T1 (de) 1999-01-18 1999-08-10 Verfahren zur trocknung eines substrats

Country Status (8)

Country Link
US (1) US6962007B1 (de)
EP (1) EP1158257B1 (de)
JP (1) JP3174038B2 (de)
KR (1) KR100626881B1 (de)
AT (1) ATE280935T1 (de)
DE (1) DE69921510T2 (de)
TW (1) TW420846B (de)
WO (1) WO2000042373A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6328814B1 (en) * 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
CN101499413B (zh) * 2001-11-02 2011-05-04 应用材料股份有限公司 单个晶片的干燥装置和干燥方法
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
FR2833753B1 (fr) * 2001-12-18 2004-02-20 Vaco Microtechnologies Dispositif de gravure, de rincage, et de sechage de substrats en atmosphere ultra-propre
DE102005000645B4 (de) * 2004-01-12 2010-08-05 Samsung Electronics Co., Ltd., Suwon Vorrichtung und ein Verfahren zum Behandeln von Substraten
JP4769440B2 (ja) * 2004-08-18 2011-09-07 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 処理装置
US7228645B2 (en) * 2005-01-11 2007-06-12 Xuyen Ngoc Pham Multi-zone shower head for drying single semiconductor substrate
KR100753959B1 (ko) * 2006-01-12 2007-08-31 에이펫(주) 기판 건조장치를 이용한 기판 건조방법
US20070246079A1 (en) * 2006-04-21 2007-10-25 Xuyen Pham Multi zone shower head for cleaning and drying wafer and method of cleaning and drying wafer
US7775219B2 (en) * 2006-12-29 2010-08-17 Applied Materials, Inc. Process chamber lid and controlled exhaust
JP5261077B2 (ja) 2008-08-29 2013-08-14 大日本スクリーン製造株式会社 基板洗浄方法および基板洗浄装置
JP5522028B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984597B1 (en) 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
JPS63301528A (ja) 1987-05-30 1988-12-08 Sigma Gijutsu Kogyo Kk 基板乾燥装置
JPH06103686A (ja) 1992-09-17 1994-04-15 Csk Corp リーダーライタ装置
JPH06181198A (ja) 1992-12-11 1994-06-28 Hitachi Ltd ベーパー乾燥装置
JP3347814B2 (ja) 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US5634978A (en) * 1994-11-14 1997-06-03 Yieldup International Ultra-low particle semiconductor method
US5653045A (en) * 1995-06-07 1997-08-05 Ferrell; Gary W. Method and apparatus for drying parts and microelectronic components using sonic created mist
US5685086A (en) * 1995-06-07 1997-11-11 Ferrell; Gary W. Method and apparatus for drying objects using aerosols
EP0784336A3 (de) 1995-12-15 1998-05-13 Texas Instruments Incorporated Verbesserungen bei der Herstellung und Bearbeitung von Halbleitervorrichtungen
JPH09213672A (ja) * 1996-01-30 1997-08-15 Nec Yamaguchi Ltd 半導体ウェハ処理装置および処理方法
JP3955924B2 (ja) * 1996-03-14 2007-08-08 エスエーツェット アクチェンゲゼルシャフト エーロゾルを用いる物品の乾燥及び洗浄方法及び装置
JPH10308378A (ja) 1997-05-07 1998-11-17 Kaijo Corp 基板表面の乾燥方法
JPH10335299A (ja) 1997-06-05 1998-12-18 Sony Corp ウェーハ乾燥装置
JPH11176796A (ja) * 1997-12-16 1999-07-02 Sony Corp ウェーハ処理方法及び装置
US5913981A (en) * 1998-03-05 1999-06-22 Micron Technology, Inc. Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall
JP3364620B2 (ja) * 1998-12-11 2003-01-08 東邦化成株式会社 基板処理装置
US6328814B1 (en) * 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates

Also Published As

Publication number Publication date
JP2000277481A (ja) 2000-10-06
KR100626881B1 (ko) 2006-09-22
DE69921510T2 (de) 2006-02-02
EP1158257A1 (de) 2001-11-28
DE69921510D1 (de) 2004-12-02
US6962007B1 (en) 2005-11-08
EP1158257B1 (de) 2004-10-27
KR20010101575A (ko) 2001-11-14
JP3174038B2 (ja) 2001-06-11
EP1158257A4 (de) 2002-10-23
TW420846B (en) 2001-02-01
WO2000042373A1 (fr) 2000-07-20

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