ATE365149T1 - Verfahren und vorrichtung zur behandlung eines substrates mit einer ozone-lösungsmittel lösung - Google Patents
Verfahren und vorrichtung zur behandlung eines substrates mit einer ozone-lösungsmittel lösungInfo
- Publication number
- ATE365149T1 ATE365149T1 AT00975337T AT00975337T ATE365149T1 AT E365149 T1 ATE365149 T1 AT E365149T1 AT 00975337 T AT00975337 T AT 00975337T AT 00975337 T AT00975337 T AT 00975337T AT E365149 T1 ATE365149 T1 AT E365149T1
- Authority
- AT
- Austria
- Prior art keywords
- solvent solution
- ozone
- treating
- substrate
- ozone solvent
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/16—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using chemical substances
- A61L2/18—Liquid substances or solutions comprising solids or dissolved gases
- A61L2/183—Ozone dissolved in a liquid
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/16—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using chemical substances
- A61L2/22—Phase substances, e.g. smokes, aerosols or sprayed or atomised substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2202/00—Aspects relating to methods or apparatus for disinfecting or sterilising materials or objects
- A61L2202/20—Targets to be treated
- A61L2202/24—Medical instruments, e.g. endoscopes, catheters, sharps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16043599P | 1999-10-19 | 1999-10-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE365149T1 true ATE365149T1 (de) | 2007-07-15 |
Family
ID=22576885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00975337T ATE365149T1 (de) | 1999-10-19 | 2000-10-19 | Verfahren und vorrichtung zur behandlung eines substrates mit einer ozone-lösungsmittel lösung |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1237824B1 (de) |
JP (1) | JP2003512736A (de) |
AT (1) | ATE365149T1 (de) |
AU (1) | AU1340301A (de) |
DE (1) | DE60035288T2 (de) |
WO (1) | WO2001028950A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6674054B2 (en) * | 2001-04-26 | 2004-01-06 | Phifer-Smith Corporation | Method and apparatus for heating a gas-solvent solution |
US6821892B1 (en) | 2001-06-04 | 2004-11-23 | Promos Technologies, Inc. | Intelligent wet etching tool as a function of chemical concentration, temperature and film loss |
KR100951898B1 (ko) * | 2002-12-09 | 2010-04-09 | 삼성전자주식회사 | 포토레지스트 제거용 스트리핑 조성물 및 이를 사용한액정 표시 장치의 박막 트랜지스터 기판의 제조방법 |
US7556697B2 (en) * | 2004-06-14 | 2009-07-07 | Fsi International, Inc. | System and method for carrying out liquid and subsequent drying treatments on one or more wafers |
US20060131276A1 (en) * | 2004-12-17 | 2006-06-22 | Johnston Steven W | Uniformity in batch spray processing using independent cassette rotation |
US8235068B2 (en) | 2008-05-12 | 2012-08-07 | Fsi International, Inc. | Substrate processing systems and related methods |
JP2009297588A (ja) * | 2008-06-10 | 2009-12-24 | Nomura Micro Sci Co Ltd | 加熱オゾン水の製造方法 |
CN102923936B (zh) * | 2011-08-11 | 2014-12-10 | 富泰华工业(深圳)有限公司 | 蚀刻装置 |
JP6565347B2 (ja) * | 2015-06-08 | 2019-08-28 | 栗田工業株式会社 | ガス溶解水の製造方法 |
KR20230165878A (ko) * | 2018-08-29 | 2023-12-05 | 엠케이에스 인스트루먼츠 인코포레이티드 | 오존수 전달 시스템 및 사용 방법 |
FR3125356A1 (fr) * | 2021-07-19 | 2023-01-20 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Dispositif et procédé de collecte d’éléments contaminants sur une plaque de matériau semi-conducteur |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4341592A (en) * | 1975-08-04 | 1982-07-27 | Texas Instruments Incorporated | Method for removing photoresist layer from substrate by ozone treatment |
US5071485A (en) * | 1990-09-11 | 1991-12-10 | Fusion Systems Corporation | Method for photoresist stripping using reverse flow |
US5266275A (en) * | 1992-09-04 | 1993-11-30 | Faddis Chris G | Ozone sterilization system secondary safety chamber |
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
US5516730A (en) * | 1994-08-26 | 1996-05-14 | Memc Electronic Materials, Inc. | Pre-thermal treatment cleaning process of wafers |
-
2000
- 2000-10-19 AU AU13403/01A patent/AU1340301A/en not_active Abandoned
- 2000-10-19 AT AT00975337T patent/ATE365149T1/de not_active IP Right Cessation
- 2000-10-19 EP EP00975337A patent/EP1237824B1/de not_active Expired - Lifetime
- 2000-10-19 WO PCT/US2000/029167 patent/WO2001028950A1/en active IP Right Grant
- 2000-10-19 JP JP2001531742A patent/JP2003512736A/ja active Pending
- 2000-10-19 DE DE60035288T patent/DE60035288T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU1340301A (en) | 2001-04-30 |
WO2001028950A9 (en) | 2002-05-10 |
DE60035288T2 (de) | 2008-02-14 |
WO2001028950A1 (en) | 2001-04-26 |
EP1237824A1 (de) | 2002-09-11 |
DE60035288D1 (de) | 2007-08-02 |
EP1237824B1 (de) | 2007-06-20 |
JP2003512736A (ja) | 2003-04-02 |
EP1237824A4 (de) | 2005-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
Ref document number: 1237824 Country of ref document: EP |
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REN | Ceased due to non-payment of the annual fee |