JPS5656261A - Method and apparatus for rotary coating - Google Patents

Method and apparatus for rotary coating

Info

Publication number
JPS5656261A
JPS5656261A JP13148479A JP13148479A JPS5656261A JP S5656261 A JPS5656261 A JP S5656261A JP 13148479 A JP13148479 A JP 13148479A JP 13148479 A JP13148479 A JP 13148479A JP S5656261 A JPS5656261 A JP S5656261A
Authority
JP
Japan
Prior art keywords
substrate
photoresist
liquid
coating liquid
injected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13148479A
Other languages
Japanese (ja)
Other versions
JPS6250194B2 (en
Inventor
Kazuhiko Tsuji
Shuji Kondo
Shigetoshi Takayanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP13148479A priority Critical patent/JPS5656261A/en
Publication of JPS5656261A publication Critical patent/JPS5656261A/en
Publication of JPS6250194B2 publication Critical patent/JPS6250194B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To effectively form homogeneous paint film in the hot etching process of a manufacturing line of semiconductors by a method in which a substrate is set by facing it downward in the face of the surface of coating liquid and then the coating liquid is injected from an exhaust nozzle installed in the coating liquid.
CONSTITUTION: The silicone semiconductor substrate 101 is adhered to a rotary stage 17 by facing its surface to be coated downward and then lowered down to a position I in closed proximity of the surface of a photoresist liquid 16 by means of a sliding mechanism. Then, the photoresist liquid is injected at the surface of the substrate 101. Then, the rotary stage 17 is turned by a motor 701 to spread excessive photoresist liquid over the whole area of the substrate and also to recover the excessive photoresist in a liquid chamber 11. In addition, in a high-speed turning region in a position II, photoresist film is uniformly formed on the surface of the substrate.
COPYRIGHT: (C)1981,JPO&Japio
JP13148479A 1979-10-11 1979-10-11 Method and apparatus for rotary coating Granted JPS5656261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13148479A JPS5656261A (en) 1979-10-11 1979-10-11 Method and apparatus for rotary coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13148479A JPS5656261A (en) 1979-10-11 1979-10-11 Method and apparatus for rotary coating

Publications (2)

Publication Number Publication Date
JPS5656261A true JPS5656261A (en) 1981-05-18
JPS6250194B2 JPS6250194B2 (en) 1987-10-23

Family

ID=15059052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13148479A Granted JPS5656261A (en) 1979-10-11 1979-10-11 Method and apparatus for rotary coating

Country Status (1)

Country Link
JP (1) JPS5656261A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208832A (en) * 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd Applicator
JPS60189936A (en) * 1984-03-12 1985-09-27 Nippon Kogaku Kk <Nikon> Producting device of semiconductor
JPS61104623A (en) * 1984-10-29 1986-05-22 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Rotary coater
JPH03272140A (en) * 1990-03-22 1991-12-03 Fujitsu Ltd Chemical treater for semiconductor substrate
JP2009021268A (en) * 2007-07-10 2009-01-29 Tokyo Electron Ltd Substrate processing equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4996080A (en) * 1989-04-05 1991-02-26 Olin Hunt Specialty Products Inc. Process for coating a photoresist composition onto a substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208832A (en) * 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd Applicator
JPS60189936A (en) * 1984-03-12 1985-09-27 Nippon Kogaku Kk <Nikon> Producting device of semiconductor
JPS61104623A (en) * 1984-10-29 1986-05-22 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Rotary coater
JPH0248136B2 (en) * 1984-10-29 1990-10-24 Intaanashonaru Bijinesu Mashiinzu Corp
JPH03272140A (en) * 1990-03-22 1991-12-03 Fujitsu Ltd Chemical treater for semiconductor substrate
JP2009021268A (en) * 2007-07-10 2009-01-29 Tokyo Electron Ltd Substrate processing equipment

Also Published As

Publication number Publication date
JPS6250194B2 (en) 1987-10-23

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