JPS55103736A - Hardening method of proving ink for semiconductor wafer - Google Patents

Hardening method of proving ink for semiconductor wafer

Info

Publication number
JPS55103736A
JPS55103736A JP969779A JP969779A JPS55103736A JP S55103736 A JPS55103736 A JP S55103736A JP 969779 A JP969779 A JP 969779A JP 969779 A JP969779 A JP 969779A JP S55103736 A JPS55103736 A JP S55103736A
Authority
JP
Japan
Prior art keywords
ink
semiconductor wafer
hardening
ultraviolet ray
proving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP969779A
Other languages
Japanese (ja)
Other versions
JPS628937B2 (en
Inventor
Kinzo Tao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP969779A priority Critical patent/JPS55103736A/en
Publication of JPS55103736A publication Critical patent/JPS55103736A/en
Publication of JPS628937B2 publication Critical patent/JPS628937B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To promote adherent power by heating ink thru wafer, in a method of hardening after coating ultraviolet ray-hardning-type providing ink onto the surface of semiconductor wafers.
CONSTITUTION: Semiconductor wafer 1, 1', which are selectively coated with ultraviolet ray sensitive hardning ink (UV ink) layer 2, 2' are placed onto the surface of block heater 4. As UV ink layers 2, 2' are heated up thru semiconductor wafer, hardening is proceeded first from adherent side with semiconductor wafer. Consequently, adhesion of UV ink layer shows good results. Furthermore, when used together with ultraviolet ray irradiation, hardening time can be reduced.
COPYRIGHT: (C)1980,JPO&Japio
JP969779A 1979-02-01 1979-02-01 Hardening method of proving ink for semiconductor wafer Granted JPS55103736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP969779A JPS55103736A (en) 1979-02-01 1979-02-01 Hardening method of proving ink for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP969779A JPS55103736A (en) 1979-02-01 1979-02-01 Hardening method of proving ink for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS55103736A true JPS55103736A (en) 1980-08-08
JPS628937B2 JPS628937B2 (en) 1987-02-25

Family

ID=11727410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP969779A Granted JPS55103736A (en) 1979-02-01 1979-02-01 Hardening method of proving ink for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55103736A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224637A (en) * 1985-07-24 1987-02-02 Matsushita Electronics Corp Wafer making

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023014527A1 (en) * 2021-08-05 2023-02-09 Sekisui Kydex, Llc Systems and methods for an enclosed dye sublimation apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5225576A (en) * 1975-08-22 1977-02-25 Hitachi Ltd Exposure method of photo-resist
JPS5277671A (en) * 1975-12-24 1977-06-30 Toshiba Corp Method and equipment of masking
JPS52137267A (en) * 1976-05-12 1977-11-16 Hitachi Ltd Sorting method for transistors and its device
JPS543473A (en) * 1977-06-09 1979-01-11 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5225576A (en) * 1975-08-22 1977-02-25 Hitachi Ltd Exposure method of photo-resist
JPS5277671A (en) * 1975-12-24 1977-06-30 Toshiba Corp Method and equipment of masking
JPS52137267A (en) * 1976-05-12 1977-11-16 Hitachi Ltd Sorting method for transistors and its device
JPS543473A (en) * 1977-06-09 1979-01-11 Fujitsu Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224637A (en) * 1985-07-24 1987-02-02 Matsushita Electronics Corp Wafer making

Also Published As

Publication number Publication date
JPS628937B2 (en) 1987-02-25

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