JPS5591138A - Die forming of semiconductor device - Google Patents
Die forming of semiconductor deviceInfo
- Publication number
- JPS5591138A JPS5591138A JP16487378A JP16487378A JPS5591138A JP S5591138 A JPS5591138 A JP S5591138A JP 16487378 A JP16487378 A JP 16487378A JP 16487378 A JP16487378 A JP 16487378A JP S5591138 A JPS5591138 A JP S5591138A
- Authority
- JP
- Japan
- Prior art keywords
- film
- scribe line
- wafer
- line
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To improve the integration level with a finer seribing by forming a groove on the surface of the semiconductor wafer by dry etching and completely dividing thereof by a jet scrubber when the wafer is divided into dice.
CONSTITUTION: An electrode wiring Al film 22 is applied on an Si wafer 21 having an element formed thereon and an SiO2 film 23 is grown on the film 22 in a gaseous phase to protect the film. Then, coated with a photoresist film 24, the film 24 undergoes a division matching exposure and a development to remove proper portion on the scribe line leaving the film 24 on the other areas. Thereafter, an engraving is made on the substrate 21 along the scribe line by a plasma etching to peel the film 24. Then, high pressure pure water ranging 100W400kg/cm2 is jetted one line at a time along the scribe line 25 to divide the substrate 21 generating a skewness on the bottom. With such an arrangement, a fine scribing line can be obtained without any spalling of Si during the division into while lack of requirement for organic chemicals facilitates the treatment.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16487378A JPS5591138A (en) | 1978-12-27 | 1978-12-27 | Die forming of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16487378A JPS5591138A (en) | 1978-12-27 | 1978-12-27 | Die forming of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5591138A true JPS5591138A (en) | 1980-07-10 |
Family
ID=15801540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16487378A Pending JPS5591138A (en) | 1978-12-27 | 1978-12-27 | Die forming of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5591138A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4822755A (en) * | 1988-04-25 | 1989-04-18 | Xerox Corporation | Method of fabricating large area semiconductor arrays |
| US5259925A (en) * | 1992-06-05 | 1993-11-09 | Mcdonnell Douglas Corporation | Method of cleaning a plurality of semiconductor devices |
| US5358590A (en) * | 1992-04-08 | 1994-10-25 | Sony Corporation | Method of manufacturing individual element arrays |
| WO2003036712A1 (en) * | 2001-10-19 | 2003-05-01 | Applied Materials, Inc. | Method and apparatus for dicing a semiconductor wafer |
| JP2016018139A (en) * | 2014-07-10 | 2016-02-01 | 株式会社ディスコ | Method for producing exposure mask |
-
1978
- 1978-12-27 JP JP16487378A patent/JPS5591138A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4822755A (en) * | 1988-04-25 | 1989-04-18 | Xerox Corporation | Method of fabricating large area semiconductor arrays |
| US5358590A (en) * | 1992-04-08 | 1994-10-25 | Sony Corporation | Method of manufacturing individual element arrays |
| US5259925A (en) * | 1992-06-05 | 1993-11-09 | Mcdonnell Douglas Corporation | Method of cleaning a plurality of semiconductor devices |
| WO2003036712A1 (en) * | 2001-10-19 | 2003-05-01 | Applied Materials, Inc. | Method and apparatus for dicing a semiconductor wafer |
| JP2016018139A (en) * | 2014-07-10 | 2016-02-01 | 株式会社ディスコ | Method for producing exposure mask |
| CN105301891A (en) * | 2014-07-10 | 2016-02-03 | 株式会社迪思科 | Manufacturing method for exposure mask film |
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