JPS5522833A - Manufacturing of semiconductor device - Google Patents
Manufacturing of semiconductor deviceInfo
- Publication number
- JPS5522833A JPS5522833A JP9533478A JP9533478A JPS5522833A JP S5522833 A JPS5522833 A JP S5522833A JP 9533478 A JP9533478 A JP 9533478A JP 9533478 A JP9533478 A JP 9533478A JP S5522833 A JPS5522833 A JP S5522833A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- photoregist
- film
- adhesion
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE: To obtain the mask suitable to the formation of the fine pattern by forming the photoregist pattern on the semiconductor substrate, hardening the surface thereof by use of gas plasma and intensifying the degree of adhesion through the heat treatment.
CONSTITUTION: On a semiconductor substrate 21 coated is an Al film 22, on which a photoregist pattern 23 is formed. The degree of adhesion between the pattern 23' and the film 22 is increased through the heat treatment carried out in gas plasma of N2 or CF4 for 10 minutes. Then, the film 22 is etched off by use of etching solution consisted of phosphoric acid. After that, the pattern 23' is removed to leave an Al pattern 24. By doing so, any pattern distrotion is not caused on the photoregist pattern 23', and the desired width of Al pattern can be obtained, thus effecting an improvement in process yield.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9533478A JPS5522833A (en) | 1978-08-03 | 1978-08-03 | Manufacturing of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9533478A JPS5522833A (en) | 1978-08-03 | 1978-08-03 | Manufacturing of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5522833A true JPS5522833A (en) | 1980-02-18 |
JPS6366049B2 JPS6366049B2 (en) | 1988-12-19 |
Family
ID=14134807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9533478A Granted JPS5522833A (en) | 1978-08-03 | 1978-08-03 | Manufacturing of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5522833A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5884430A (en) * | 1981-11-14 | 1983-05-20 | Daikin Ind Ltd | Method of increasing etching resistance of resist film |
JPS63232330A (en) * | 1987-03-20 | 1988-09-28 | Ushio Inc | Treatment of resist |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53110374A (en) * | 1977-03-08 | 1978-09-27 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1978
- 1978-08-03 JP JP9533478A patent/JPS5522833A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53110374A (en) * | 1977-03-08 | 1978-09-27 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5884430A (en) * | 1981-11-14 | 1983-05-20 | Daikin Ind Ltd | Method of increasing etching resistance of resist film |
JPS63232330A (en) * | 1987-03-20 | 1988-09-28 | Ushio Inc | Treatment of resist |
Also Published As
Publication number | Publication date |
---|---|
JPS6366049B2 (en) | 1988-12-19 |
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