JPS5267985A - Manufacturing process of semiconductor unit - Google Patents
Manufacturing process of semiconductor unitInfo
- Publication number
- JPS5267985A JPS5267985A JP14472775A JP14472775A JPS5267985A JP S5267985 A JPS5267985 A JP S5267985A JP 14472775 A JP14472775 A JP 14472775A JP 14472775 A JP14472775 A JP 14472775A JP S5267985 A JPS5267985 A JP S5267985A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing process
- semiconductor unit
- substrate
- sio
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Element Separation (AREA)
Abstract
PURPOSE: The insulation separation is given to circuit element which is formed on semiconductor substrate. In this case, Si substrate is etched into a prescribed depth using Si3N4 separation mask. SiO2 film is coated into concavity formed, and part of this removed to form SiO2 film again. In this way, projection occurrence is avoided on substrate surface.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14472775A JPS5267985A (en) | 1975-12-04 | 1975-12-04 | Manufacturing process of semiconductor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14472775A JPS5267985A (en) | 1975-12-04 | 1975-12-04 | Manufacturing process of semiconductor unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5267985A true JPS5267985A (en) | 1977-06-06 |
Family
ID=15368907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14472775A Pending JPS5267985A (en) | 1975-12-04 | 1975-12-04 | Manufacturing process of semiconductor unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5267985A (en) |
-
1975
- 1975-12-04 JP JP14472775A patent/JPS5267985A/en active Pending
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