JPS5494881A - Exposure method - Google Patents

Exposure method

Info

Publication number
JPS5494881A
JPS5494881A JP221278A JP221278A JPS5494881A JP S5494881 A JPS5494881 A JP S5494881A JP 221278 A JP221278 A JP 221278A JP 221278 A JP221278 A JP 221278A JP S5494881 A JPS5494881 A JP S5494881A
Authority
JP
Japan
Prior art keywords
wafer
mark
mask
main surface
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP221278A
Other languages
Japanese (ja)
Inventor
Sunao Ishihara
Toshiro Ono
Nobuya Shinoyama
Kiwao Nakazawa
Toshiaki Shinozaki
Makoto Nakase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Nippon Chemical Industrial Co Ltd
Nippon Telegraph and Telephone Corp
Original Assignee
Toshiba Corp
Nippon Chemical Industrial Co Ltd
Nippon Telegraph and Telephone Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Nippon Chemical Industrial Co Ltd, Nippon Telegraph and Telephone Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP221278A priority Critical patent/JPS5494881A/en
Publication of JPS5494881A publication Critical patent/JPS5494881A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To avert the decrease in the contrast of a mark M and S/N and damaging of the mark itself in film forming process by forming a multiplicity of reducing recesses in the specified position on the main surface of a wafer to provide the positioning mark and performing exposure.
CONSTITUTION: After the relative positions of the wafer 1 to be exposed and a mask 21 for exposure are determined, the mask 21 is disposed in proximate opposition or contact to the main surface of the wafer 1 and exposure of a desired pattern is performed on the main surface of the wafer 1 by the way of the mask 21. In this case, relative positioning of the wafer 1 and mask 21 is accomplished by forming a multiplicity of reducing recesses 5 in the specified position on the main surface of the wafer 1 thereby providing the positioning mark. Thereby, the decrease in the contrast of the mark M and S/N and damaging of the mark itself may be effectively averted in the film forming process of resist films, semiconductor films, etc.
COPYRIGHT: (C)1979,JPO&Japio
JP221278A 1978-01-12 1978-01-12 Exposure method Pending JPS5494881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP221278A JPS5494881A (en) 1978-01-12 1978-01-12 Exposure method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP221278A JPS5494881A (en) 1978-01-12 1978-01-12 Exposure method

Publications (1)

Publication Number Publication Date
JPS5494881A true JPS5494881A (en) 1979-07-26

Family

ID=11523035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP221278A Pending JPS5494881A (en) 1978-01-12 1978-01-12 Exposure method

Country Status (1)

Country Link
JP (1) JPS5494881A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167329A (en) * 1980-05-29 1981-12-23 Nec Corp Piling joint setting mark to be used in fine processing exposure technology
JPS5890728A (en) * 1981-11-25 1983-05-30 Nippon Telegr & Teleph Corp <Ntt> Mark for alignment on semiconductor wafer and manufacture thereof
JPS59103334A (en) * 1982-12-06 1984-06-14 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS59232416A (en) * 1983-06-16 1984-12-27 Oki Electric Ind Co Ltd Alignment mark
JPH04330710A (en) * 1990-03-12 1992-11-18 Fujitsu Ltd Alignment mark, laser trimming apparatus, manufacture of semiconductor device
JP2008135495A (en) * 2006-11-28 2008-06-12 Nec Electronics Corp Semiconductor device and display unit
JP2013168472A (en) * 2012-02-15 2013-08-29 River Eletec Kk Alignment mark

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529503U (en) * 1975-07-05 1977-01-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529503U (en) * 1975-07-05 1977-01-22

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167329A (en) * 1980-05-29 1981-12-23 Nec Corp Piling joint setting mark to be used in fine processing exposure technology
JPS5890728A (en) * 1981-11-25 1983-05-30 Nippon Telegr & Teleph Corp <Ntt> Mark for alignment on semiconductor wafer and manufacture thereof
JPS6211491B2 (en) * 1981-11-25 1987-03-12 Nippon Telegraph & Telephone
JPS59103334A (en) * 1982-12-06 1984-06-14 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS59232416A (en) * 1983-06-16 1984-12-27 Oki Electric Ind Co Ltd Alignment mark
JPH04330710A (en) * 1990-03-12 1992-11-18 Fujitsu Ltd Alignment mark, laser trimming apparatus, manufacture of semiconductor device
JP2008135495A (en) * 2006-11-28 2008-06-12 Nec Electronics Corp Semiconductor device and display unit
JP2013168472A (en) * 2012-02-15 2013-08-29 River Eletec Kk Alignment mark

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