JPS55151338A - Fabricating method of semiconductor device - Google Patents
Fabricating method of semiconductor deviceInfo
- Publication number
- JPS55151338A JPS55151338A JP6018179A JP6018179A JPS55151338A JP S55151338 A JPS55151338 A JP S55151338A JP 6018179 A JP6018179 A JP 6018179A JP 6018179 A JP6018179 A JP 6018179A JP S55151338 A JPS55151338 A JP S55151338A
- Authority
- JP
- Japan
- Prior art keywords
- film
- resist
- substrate
- coated
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Abstract
PURPOSE:To raise the resolution of a resist and to enable the fine fabrication of the resist by coating a fluidized resin film on the surface of a substrate, reducing the ruggedness of the substrate and coating the resist when forming an element pattern on the semiconductor substrate. CONSTITUTION:After forming a CVD SiO2 film 13 on a silicon substrate 9 formed on an element region, a fluidized resist film 15 is coated on the entire surface of the film 13. Then, the resist film 15 is heat treated to be solidified, an Mo film 16 is coated thereon, and a resist film 17 is coated on the film 16. Thereafter, the film 17 is exposed and developed to form an opening at the film 16, with the film 16 as a mask it is dry etched with O2, and a resist pattern is formed on the film 15. In this manner, the ruggedness on the surface of the substrate is reduced to improve the resolution accuracy of the film 17, and since the dry etching is employed for the resist film 15, accurate pattern can be formed thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6018179A JPS55151338A (en) | 1979-05-16 | 1979-05-16 | Fabricating method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6018179A JPS55151338A (en) | 1979-05-16 | 1979-05-16 | Fabricating method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55151338A true JPS55151338A (en) | 1980-11-25 |
JPS647492B2 JPS647492B2 (en) | 1989-02-09 |
Family
ID=13134724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6018179A Granted JPS55151338A (en) | 1979-05-16 | 1979-05-16 | Fabricating method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55151338A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583232A (en) * | 1981-06-30 | 1983-01-10 | Fujitsu Ltd | Forming method for pattern |
JPS5913329A (en) * | 1982-07-03 | 1984-01-24 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of producing semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023039270A2 (en) | 2021-09-13 | 2023-03-16 | Danisco Us Inc. | Bioactive-containing granules |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51107775A (en) * | 1975-03-19 | 1976-09-24 | Hitachi Ltd | Handotaisochino bisaikakohoho |
-
1979
- 1979-05-16 JP JP6018179A patent/JPS55151338A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51107775A (en) * | 1975-03-19 | 1976-09-24 | Hitachi Ltd | Handotaisochino bisaikakohoho |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583232A (en) * | 1981-06-30 | 1983-01-10 | Fujitsu Ltd | Forming method for pattern |
JPH0224017B2 (en) * | 1981-06-30 | 1990-05-28 | Fujitsu Ltd | |
JPS5913329A (en) * | 1982-07-03 | 1984-01-24 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of producing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS647492B2 (en) | 1989-02-09 |
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