JPS55143031A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS55143031A
JPS55143031A JP5124179A JP5124179A JPS55143031A JP S55143031 A JPS55143031 A JP S55143031A JP 5124179 A JP5124179 A JP 5124179A JP 5124179 A JP5124179 A JP 5124179A JP S55143031 A JPS55143031 A JP S55143031A
Authority
JP
Japan
Prior art keywords
film
substrate
diffused layer
glass
diffused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5124179A
Other languages
Japanese (ja)
Inventor
Tadashi Kirisako
Takeshi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5124179A priority Critical patent/JPS55143031A/en
Publication of JPS55143031A publication Critical patent/JPS55143031A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

PURPOSE:To heighten the dimensional accuracy of a diffused layer, by providing an SiO2 film of a prescribed pattern on an Si substrate, coating a glass-like film of an organic Si compound which contains an impurity inverse in electroconductive type to the substrate, removing the part of the glass-like film on the SiO2 film and using the glass-like film left on the surface of the substrate, as a diffused substance source. CONSTITUTION:An SiO2 film 2 is coated on a p-type Si substrate 1. The part of the film 2 corresponding to a to-be-produced diffused layer is removed by photographic etching so that the other part 2A of the film 2 is left. An organic Si compound dissolved in an organic solvent and containing an n-type impurity is uniformly coated over the substrate 1. The solvent is evaporated to provide a silica film 3. A photoresist film 4 is made on the film 3 and patterned so that a film 4A is provided as a mask on only a diffused layer making part. Etching is effected while using the film 4A as a mask, thereby removing the film 3 located aon the film 2A. The film 3A left on the diffused layer making part is used as a diffused substance source to produce an n-type region in the substrate 1 by diffusion.
JP5124179A 1979-04-25 1979-04-25 Manufacture of semiconductor device Pending JPS55143031A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5124179A JPS55143031A (en) 1979-04-25 1979-04-25 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5124179A JPS55143031A (en) 1979-04-25 1979-04-25 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS55143031A true JPS55143031A (en) 1980-11-08

Family

ID=12881441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5124179A Pending JPS55143031A (en) 1979-04-25 1979-04-25 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS55143031A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110036A (en) * 1981-12-23 1983-06-30 Matsushita Electronics Corp Diffusion of impurity
JPS58168221A (en) * 1982-03-29 1983-10-04 Toshiba Corp Preparation of semiconductor device
JPH03250729A (en) * 1990-02-28 1991-11-08 Rohm Co Ltd Manufacture of semiconductor element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110036A (en) * 1981-12-23 1983-06-30 Matsushita Electronics Corp Diffusion of impurity
JPS58168221A (en) * 1982-03-29 1983-10-04 Toshiba Corp Preparation of semiconductor device
JPH03250729A (en) * 1990-02-28 1991-11-08 Rohm Co Ltd Manufacture of semiconductor element

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