ATE452419T1 - Verfahren und vorrichtung zum reinigen und trocknen eines substrats - Google Patents

Verfahren und vorrichtung zum reinigen und trocknen eines substrats

Info

Publication number
ATE452419T1
ATE452419T1 AT01870138T AT01870138T ATE452419T1 AT E452419 T1 ATE452419 T1 AT E452419T1 AT 01870138 T AT01870138 T AT 01870138T AT 01870138 T AT01870138 T AT 01870138T AT E452419 T1 ATE452419 T1 AT E452419T1
Authority
AT
Austria
Prior art keywords
substrate
liquid
drying
cleaning
removal
Prior art date
Application number
AT01870138T
Other languages
English (en)
Inventor
Paul Mertens
Marc Meuris
Original Assignee
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec filed Critical Imec
Application granted granted Critical
Publication of ATE452419T1 publication Critical patent/ATE452419T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/10—Arrangements for feeding, heating or supporting materials; Controlling movement, tension or position of materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/24—Arrangements of devices using drying processes not involving heating
    • F26B13/28—Arrangements of devices using drying processes not involving heating for applying pressure; for brushing; for wiping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT01870138T 2000-06-27 2001-06-26 Verfahren und vorrichtung zum reinigen und trocknen eines substrats ATE452419T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21469300P 2000-06-27 2000-06-27

Publications (1)

Publication Number Publication Date
ATE452419T1 true ATE452419T1 (de) 2010-01-15

Family

ID=22800074

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01870138T ATE452419T1 (de) 2000-06-27 2001-06-26 Verfahren und vorrichtung zum reinigen und trocknen eines substrats

Country Status (5)

Country Link
US (2) US6632751B2 (de)
EP (1) EP1168422B1 (de)
JP (1) JP4629270B2 (de)
AT (1) ATE452419T1 (de)
DE (1) DE60140780D1 (de)

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US8762880B2 (en) 2007-06-29 2014-06-24 Microsoft Corporation Exposing non-authoring features through document status information in an out-space user interface
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EP2381310B1 (de) 2010-04-22 2015-05-06 ASML Netherlands BV Flüssigkeitshandhabungsstruktur und lithographischer Apparat
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Also Published As

Publication number Publication date
US6632751B2 (en) 2003-10-14
DE60140780D1 (de) 2010-01-28
US20020016082A1 (en) 2002-02-07
JP4629270B2 (ja) 2011-02-09
EP1168422A2 (de) 2002-01-02
US20040010933A1 (en) 2004-01-22
EP1168422A3 (de) 2006-03-22
EP1168422B1 (de) 2009-12-16
US6910487B2 (en) 2005-06-28
JP2002164319A (ja) 2002-06-07

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