ATE443343T1 - Verfahren und vorrichtung zur reinigung von einem halbleiterwafer - Google Patents
Verfahren und vorrichtung zur reinigung von einem halbleiterwaferInfo
- Publication number
- ATE443343T1 ATE443343T1 AT00937934T AT00937934T ATE443343T1 AT E443343 T1 ATE443343 T1 AT E443343T1 AT 00937934 T AT00937934 T AT 00937934T AT 00937934 T AT00937934 T AT 00937934T AT E443343 T1 ATE443343 T1 AT E443343T1
- Authority
- AT
- Austria
- Prior art keywords
- brush
- wafer
- cleaning
- cleaning brush
- scrubbing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/329,207 US6711775B2 (en) | 1999-06-10 | 1999-06-10 | System for cleaning a semiconductor wafer |
PCT/US2000/014849 WO2000077835A1 (en) | 1999-06-10 | 2000-05-30 | Method and system for cleaning a semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE443343T1 true ATE443343T1 (de) | 2009-10-15 |
Family
ID=23284347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00937934T ATE443343T1 (de) | 1999-06-10 | 2000-05-30 | Verfahren und vorrichtung zur reinigung von einem halbleiterwafer |
Country Status (10)
Country | Link |
---|---|
US (2) | US6711775B2 (de) |
EP (1) | EP1186006B1 (de) |
JP (1) | JP2003502840A (de) |
KR (1) | KR100750545B1 (de) |
CN (1) | CN1156890C (de) |
AT (1) | ATE443343T1 (de) |
AU (1) | AU5304600A (de) |
DE (1) | DE60042970D1 (de) |
TW (1) | TW457533B (de) |
WO (1) | WO2000077835A1 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6711775B2 (en) * | 1999-06-10 | 2004-03-30 | Lam Research Corporation | System for cleaning a semiconductor wafer |
JP4484339B2 (ja) * | 1999-08-14 | 2010-06-16 | アプライド マテリアルズ インコーポレイテッド | スクラバにおける背面エッチング |
US7007333B1 (en) | 2002-06-28 | 2006-03-07 | Lam Research Corporation | System and method for a combined contact and non-contact wafer cleaning module |
US7067016B1 (en) * | 2003-03-31 | 2006-06-27 | Lam Research Corporation | Chemically assisted mechanical cleaning of MRAM structures |
KR101122792B1 (ko) * | 2004-01-29 | 2012-03-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 스크러버 브러쉬를 맨드릴 상에 설치하는 장치 및 방법 |
CN1933759B (zh) * | 2004-03-31 | 2010-12-15 | 兰姆研究有限公司 | 利用相容化学品的基板刷子擦洗和接近清洗干燥程序、接近基板制备程序和实施前述程序的方法、设备和系统 |
US20050252547A1 (en) * | 2004-05-11 | 2005-11-17 | Applied Materials, Inc. | Methods and apparatus for liquid chemical delivery |
JP4537826B2 (ja) * | 2004-10-22 | 2010-09-08 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
US20070093406A1 (en) * | 2005-10-24 | 2007-04-26 | Omoregie Henryson | Novel cleaning process for masks and mask blanks |
CN101384380B (zh) * | 2006-02-10 | 2011-12-28 | 坦南特公司 | 具有功能发生器的清洁设备、和电化学活化清洁液体的制造方法 |
KR20080113479A (ko) * | 2007-06-25 | 2008-12-31 | 엘지이노텍 주식회사 | 웨이퍼 재활용 방법 |
CN101610641B (zh) * | 2008-06-19 | 2011-06-29 | 富葵精密组件(深圳)有限公司 | 湿处理系统及湿处理方法 |
JP2011165751A (ja) * | 2010-02-05 | 2011-08-25 | Toshiba Corp | 洗浄装置及び半導体装置の製造方法 |
CN101935883B (zh) * | 2010-09-10 | 2012-05-02 | 北京工业大学 | 超高真空离子源晶片清洗系统 |
US20130255721A1 (en) * | 2012-04-03 | 2013-10-03 | Illinois Tool Works Inc. | Concave nodule sponge brush |
SG11201502457YA (en) * | 2012-09-28 | 2015-04-29 | Entegris Inc | Cmp brush packaging |
US9211568B2 (en) | 2013-03-12 | 2015-12-15 | Taiwan Semiconductor Manufacturing Company Limited | Clean function for semiconductor wafer scrubber |
CN103230884B (zh) * | 2013-04-24 | 2016-06-08 | 清华大学 | 用于晶圆的刷洗装置 |
KR102121238B1 (ko) * | 2013-11-25 | 2020-06-10 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
KR101600774B1 (ko) * | 2014-12-01 | 2016-03-08 | 주식회사 케이씨텍 | 브러쉬 세정 장치 |
US9748090B2 (en) * | 2015-01-22 | 2017-08-29 | Toshiba Memory Corporation | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
KR102626035B1 (ko) * | 2016-08-31 | 2024-01-17 | 주식회사 케이씨텍 | 기판 스피닝 장치 및 그 제어방법 |
US11923208B2 (en) * | 2017-05-19 | 2024-03-05 | Illinois Tool Works Inc. | Methods and apparatuses for chemical delivery for brush conditioning |
US10410936B2 (en) * | 2017-05-19 | 2019-09-10 | Illinois Tool Works Inc. | Methods and apparatuses for effluent monitoring for brush conditioning |
US10149135B1 (en) * | 2017-05-30 | 2018-12-04 | Illinois Tool Works Inc. | Methods and apparatuses for wireless communication with a brush |
KR102573572B1 (ko) * | 2017-12-20 | 2023-09-01 | 삼성전자주식회사 | 웨이퍼 세정 장치 |
CN113967888B (zh) * | 2020-07-23 | 2022-06-24 | 长鑫存储技术有限公司 | 海绵刷的更换工具和安装方法、半导体化学机械抛光设备 |
TW202404741A (zh) * | 2022-05-31 | 2024-02-01 | 美商恩特葛瑞斯股份有限公司 | 用於半導體製造製程之清潔刷 |
CN116631849B (zh) * | 2023-07-21 | 2024-05-07 | 山东有研艾斯半导体材料有限公司 | 一种硅片的清洗方法 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3970471A (en) * | 1975-04-23 | 1976-07-20 | Western Electric Co., Inc. | Methods and apparatus for treating wafer-like articles |
US4062463A (en) | 1976-05-11 | 1977-12-13 | Machine Technology, Inc. | Automated single cassette load mechanism for scrubber |
US4202071A (en) | 1978-03-20 | 1980-05-13 | Scharpf Mike A | Apparatus for washing and drying phonograph records |
US4382308A (en) | 1981-02-18 | 1983-05-10 | Chemcut Corporation | Scrubbing torque monitoring and control system |
JPS60143634A (ja) * | 1983-12-29 | 1985-07-29 | Fujitsu Ltd | ウエ−ハ処理方法及び装置 |
JPS634617A (ja) | 1986-06-24 | 1988-01-09 | Mitsubishi Electric Corp | 洗浄方法 |
JPH07109680B2 (ja) * | 1987-06-25 | 1995-11-22 | 株式会社日立製作所 | 磁気記録再生装置のテ−プロ−ディング機構 |
US5129955A (en) | 1989-01-11 | 1992-07-14 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method |
US5357645A (en) | 1989-04-09 | 1994-10-25 | System Seiko Co., Ltd. | Apparatus for cleaning and drying hard disk substrates |
JP2887408B2 (ja) * | 1990-08-10 | 1999-04-26 | 株式会社荏原製作所 | ウエハ洗浄装置 |
JPH04213826A (ja) * | 1990-12-11 | 1992-08-04 | Nec Yamagata Ltd | 半導体製造用ウェーハ洗浄装置 |
US5144711A (en) * | 1991-03-25 | 1992-09-08 | Westech Systems, Inc. | Cleaning brush for semiconductor wafer |
JPH04363022A (ja) * | 1991-06-06 | 1992-12-15 | Enya Syst:Kk | 貼付板洗浄装置 |
JPH053184A (ja) * | 1991-06-24 | 1993-01-08 | Sony Corp | ウエハの洗浄方法 |
US5317778A (en) | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
US5486134A (en) | 1992-02-27 | 1996-01-23 | Oliver Design, Inc. | System and method for texturing magnetic data storage disks |
KR100230694B1 (ko) * | 1992-05-18 | 1999-11-15 | 다카시마 히로시 | 기판세정처리장치 |
JPH06120192A (ja) * | 1992-10-01 | 1994-04-28 | Sumitomo Precision Prod Co Ltd | 両面スクラブ洗浄装置 |
JP2877216B2 (ja) | 1992-10-02 | 1999-03-31 | 東京エレクトロン株式会社 | 洗浄装置 |
JPH0817772A (ja) * | 1994-06-30 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | 回転式基板洗浄装置 |
JP2888412B2 (ja) | 1994-07-04 | 1999-05-10 | 信越半導体株式会社 | ブラシ洗浄装置及びワーク洗浄システム |
US5723019A (en) * | 1994-07-15 | 1998-03-03 | Ontrak Systems, Incorporated | Drip chemical delivery method and apparatus |
FR2722511B1 (fr) | 1994-07-15 | 1999-04-02 | Ontrak Systems Inc | Procede pour enlever les metaux dans un dispositif de recurage |
TW316995B (de) | 1995-01-19 | 1997-10-01 | Tokyo Electron Co Ltd | |
JPH08238463A (ja) * | 1995-03-03 | 1996-09-17 | Ebara Corp | 洗浄方法及び洗浄装置 |
US5639311A (en) | 1995-06-07 | 1997-06-17 | International Business Machines Corporation | Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations |
US5624501A (en) | 1995-09-26 | 1997-04-29 | Gill, Jr.; Gerald L. | Apparatus for cleaning semiconductor wafers |
EP1046433B1 (de) | 1995-10-13 | 2004-01-02 | Lam Research Corporation | Verfahren zum Entfernen von Verunreinigungen durch Bürsten |
US5693148A (en) | 1995-11-08 | 1997-12-02 | Ontrak Systems, Incorporated | Process for brush cleaning |
US5675856A (en) | 1996-06-14 | 1997-10-14 | Solid State Equipment Corp. | Wafer scrubbing device |
US5875507A (en) | 1996-07-15 | 1999-03-02 | Oliver Design, Inc. | Wafer cleaning apparatus |
US5778554A (en) | 1996-07-15 | 1998-07-14 | Oliver Design, Inc. | Wafer spin dryer and method of drying a wafer |
US5709755A (en) | 1996-08-09 | 1998-01-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for CMP cleaning improvement |
US5862560A (en) * | 1996-08-29 | 1999-01-26 | Ontrak Systems, Inc. | Roller with treading and system including the same |
JPH1126408A (ja) * | 1997-07-08 | 1999-01-29 | Matsushita Electric Ind Co Ltd | 基板の洗浄方法及び装置 |
JP3320640B2 (ja) * | 1997-07-23 | 2002-09-03 | 東京エレクトロン株式会社 | 洗浄装置 |
US6196896B1 (en) | 1997-10-31 | 2001-03-06 | Obsidian, Inc. | Chemical mechanical polisher |
JPH11179646A (ja) * | 1997-12-19 | 1999-07-06 | Speedfam Co Ltd | 洗浄装置 |
US6093254A (en) * | 1998-10-30 | 2000-07-25 | Lam Research Corporation | Method of HF-HF Cleaning |
US6711775B2 (en) * | 1999-06-10 | 2004-03-30 | Lam Research Corporation | System for cleaning a semiconductor wafer |
JP5675856B2 (ja) * | 2013-01-15 | 2015-02-25 | キヤノン株式会社 | 画像処理装置及び方法、及びプログラムを記録した記憶媒体 |
-
1999
- 1999-06-10 US US09/329,207 patent/US6711775B2/en not_active Expired - Fee Related
-
2000
- 2000-05-30 AT AT00937934T patent/ATE443343T1/de not_active IP Right Cessation
- 2000-05-30 JP JP2001503217A patent/JP2003502840A/ja active Pending
- 2000-05-30 KR KR1020017015789A patent/KR100750545B1/ko not_active IP Right Cessation
- 2000-05-30 EP EP00937934A patent/EP1186006B1/de not_active Expired - Lifetime
- 2000-05-30 AU AU53046/00A patent/AU5304600A/en not_active Abandoned
- 2000-05-30 WO PCT/US2000/014849 patent/WO2000077835A1/en not_active Application Discontinuation
- 2000-05-30 DE DE60042970T patent/DE60042970D1/de not_active Expired - Fee Related
- 2000-05-30 CN CNB008087334A patent/CN1156890C/zh not_active Expired - Fee Related
- 2000-07-21 TW TW089111375A patent/TW457533B/zh not_active IP Right Cessation
-
2004
- 2004-01-27 US US10/766,733 patent/US20040216764A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE60042970D1 (de) | 2009-10-29 |
EP1186006A1 (de) | 2002-03-13 |
JP2003502840A (ja) | 2003-01-21 |
CN1355929A (zh) | 2002-06-26 |
EP1186006B1 (de) | 2009-09-16 |
US20040216764A1 (en) | 2004-11-04 |
US20020062842A1 (en) | 2002-05-30 |
CN1156890C (zh) | 2004-07-07 |
KR20020008413A (ko) | 2002-01-30 |
TW457533B (en) | 2001-10-01 |
US6711775B2 (en) | 2004-03-30 |
KR100750545B1 (ko) | 2007-08-20 |
AU5304600A (en) | 2001-01-02 |
WO2000077835A1 (en) | 2000-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |