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A cleaning method of complete removal of particles attached onto surface of chips in post cleaning of chemical mechanical polishing CMP. The method disclosed in the present invention deals with, after CMP of chips, placing the chip into a megasonic tank for megasonic cleaning process before carrying out the post-CMP cleaning process. In addition of injecting D.I. Water in the megasonic tank, NH4OH is also injected for heating with a heater for removal of particles from the chip, being said manufacturing process to provide humidification to the chips.
TW087106124A1998-04-211998-04-21Method of improving wafer post cleaning after chemical mechanical polishing process
TW366537B
(en)