TW366537B - Method of improving wafer post cleaning after chemical mechanical polishing process - Google Patents

Method of improving wafer post cleaning after chemical mechanical polishing process

Info

Publication number
TW366537B
TW366537B TW087106124A TW87106124A TW366537B TW 366537 B TW366537 B TW 366537B TW 087106124 A TW087106124 A TW 087106124A TW 87106124 A TW87106124 A TW 87106124A TW 366537 B TW366537 B TW 366537B
Authority
TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
cleaning
polishing process
chips
Prior art date
Application number
TW087106124A
Other languages
Chinese (zh)
Inventor
Peng-Yih Peng
Chien-Hsin Lai
Hau-Guang Chiou
Kuen-Lin Wu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW087106124A priority Critical patent/TW366537B/en
Application granted granted Critical
Publication of TW366537B publication Critical patent/TW366537B/en

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A cleaning method of complete removal of particles attached onto surface of chips in post cleaning of chemical mechanical polishing CMP. The method disclosed in the present invention deals with, after CMP of chips, placing the chip into a megasonic tank for megasonic cleaning process before carrying out the post-CMP cleaning process. In addition of injecting D.I. Water in the megasonic tank, NH4OH is also injected for heating with a heater for removal of particles from the chip, being said manufacturing process to provide humidification to the chips.
TW087106124A 1998-04-21 1998-04-21 Method of improving wafer post cleaning after chemical mechanical polishing process TW366537B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW087106124A TW366537B (en) 1998-04-21 1998-04-21 Method of improving wafer post cleaning after chemical mechanical polishing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW087106124A TW366537B (en) 1998-04-21 1998-04-21 Method of improving wafer post cleaning after chemical mechanical polishing process

Publications (1)

Publication Number Publication Date
TW366537B true TW366537B (en) 1999-08-11

Family

ID=57941136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087106124A TW366537B (en) 1998-04-21 1998-04-21 Method of improving wafer post cleaning after chemical mechanical polishing process

Country Status (1)

Country Link
TW (1) TW366537B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI816386B (en) * 2021-05-04 2023-09-21 美商應用材料股份有限公司 Hot water generation for chemical mechanical polishing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI816386B (en) * 2021-05-04 2023-09-21 美商應用材料股份有限公司 Hot water generation for chemical mechanical polishing

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