DE60042970D1 - Verfahren und vorrichtung zur reinigung von einem halbleiterwafer - Google Patents

Verfahren und vorrichtung zur reinigung von einem halbleiterwafer

Info

Publication number
DE60042970D1
DE60042970D1 DE60042970T DE60042970T DE60042970D1 DE 60042970 D1 DE60042970 D1 DE 60042970D1 DE 60042970 T DE60042970 T DE 60042970T DE 60042970 T DE60042970 T DE 60042970T DE 60042970 D1 DE60042970 D1 DE 60042970D1
Authority
DE
Germany
Prior art keywords
brush
wafer
cleaning
cleaning brush
scrubbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60042970T
Other languages
English (en)
Inventor
Katrina A Mikhaylich
Mike Ravkin
Don E Anderson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60042970D1 publication Critical patent/DE60042970D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE60042970T 1999-06-10 2000-05-30 Verfahren und vorrichtung zur reinigung von einem halbleiterwafer Expired - Fee Related DE60042970D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/329,207 US6711775B2 (en) 1999-06-10 1999-06-10 System for cleaning a semiconductor wafer
PCT/US2000/014849 WO2000077835A1 (en) 1999-06-10 2000-05-30 Method and system for cleaning a semiconductor wafer

Publications (1)

Publication Number Publication Date
DE60042970D1 true DE60042970D1 (de) 2009-10-29

Family

ID=23284347

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60042970T Expired - Fee Related DE60042970D1 (de) 1999-06-10 2000-05-30 Verfahren und vorrichtung zur reinigung von einem halbleiterwafer

Country Status (10)

Country Link
US (2) US6711775B2 (de)
EP (1) EP1186006B1 (de)
JP (1) JP2003502840A (de)
KR (1) KR100750545B1 (de)
CN (1) CN1156890C (de)
AT (1) ATE443343T1 (de)
AU (1) AU5304600A (de)
DE (1) DE60042970D1 (de)
TW (1) TW457533B (de)
WO (1) WO2000077835A1 (de)

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US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
JP4484339B2 (ja) * 1999-08-14 2010-06-16 アプライド マテリアルズ インコーポレイテッド スクラバにおける背面エッチング
US7007333B1 (en) 2002-06-28 2006-03-07 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
US7067016B1 (en) * 2003-03-31 2006-06-27 Lam Research Corporation Chemically assisted mechanical cleaning of MRAM structures
CN100502722C (zh) * 2004-01-29 2009-06-24 应用材料公司 在心轴上安装洗涤器刷子的方法和设备
CN1933759B (zh) * 2004-03-31 2010-12-15 兰姆研究有限公司 利用相容化学品的基板刷子擦洗和接近清洗干燥程序、接近基板制备程序和实施前述程序的方法、设备和系统
US20050252547A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Methods and apparatus for liquid chemical delivery
JP4537826B2 (ja) * 2004-10-22 2010-09-08 芝浦メカトロニクス株式会社 基板の処理装置
US20070093406A1 (en) * 2005-10-24 2007-04-26 Omoregie Henryson Novel cleaning process for masks and mask blanks
CN101421054B (zh) * 2006-02-10 2012-10-17 坦能公司 电化学活化的阳极电解液和阴极电解液液体
KR20080113479A (ko) * 2007-06-25 2008-12-31 엘지이노텍 주식회사 웨이퍼 재활용 방법
CN101610641B (zh) * 2008-06-19 2011-06-29 富葵精密组件(深圳)有限公司 湿处理系统及湿处理方法
JP2011165751A (ja) * 2010-02-05 2011-08-25 Toshiba Corp 洗浄装置及び半導体装置の製造方法
CN101935883B (zh) * 2010-09-10 2012-05-02 北京工业大学 超高真空离子源晶片清洗系统
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
KR102108084B1 (ko) * 2012-09-28 2020-05-11 엔테그리스, 아이엔씨. Cmp 브러시 팩키징
US9211568B2 (en) 2013-03-12 2015-12-15 Taiwan Semiconductor Manufacturing Company Limited Clean function for semiconductor wafer scrubber
CN103230884B (zh) * 2013-04-24 2016-06-08 清华大学 用于晶圆的刷洗装置
KR102121238B1 (ko) * 2013-11-25 2020-06-10 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR101600774B1 (ko) * 2014-12-01 2016-03-08 주식회사 케이씨텍 브러쉬 세정 장치
US9748090B2 (en) * 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
KR102626035B1 (ko) * 2016-08-31 2024-01-17 주식회사 케이씨텍 기판 스피닝 장치 및 그 제어방법
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US10410936B2 (en) * 2017-05-19 2019-09-10 Illinois Tool Works Inc. Methods and apparatuses for effluent monitoring for brush conditioning
US10149135B1 (en) * 2017-05-30 2018-12-04 Illinois Tool Works Inc. Methods and apparatuses for wireless communication with a brush
KR102573572B1 (ko) * 2017-12-20 2023-09-01 삼성전자주식회사 웨이퍼 세정 장치
CN113967888B (zh) * 2020-07-23 2022-06-24 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备
WO2023235424A1 (en) * 2022-05-31 2023-12-07 Entegris, Inc. Cleaning brush for semiconductor fabrication process
CN116631849B (zh) * 2023-07-21 2024-05-07 山东有研艾斯半导体材料有限公司 一种硅片的清洗方法

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US3970471A (en) * 1975-04-23 1976-07-20 Western Electric Co., Inc. Methods and apparatus for treating wafer-like articles
US4062463A (en) 1976-05-11 1977-12-13 Machine Technology, Inc. Automated single cassette load mechanism for scrubber
US4202071A (en) 1978-03-20 1980-05-13 Scharpf Mike A Apparatus for washing and drying phonograph records
US4382308A (en) 1981-02-18 1983-05-10 Chemcut Corporation Scrubbing torque monitoring and control system
JPS60143634A (ja) * 1983-12-29 1985-07-29 Fujitsu Ltd ウエ−ハ処理方法及び装置
JPS634617A (ja) 1986-06-24 1988-01-09 Mitsubishi Electric Corp 洗浄方法
JPH07109680B2 (ja) * 1987-06-25 1995-11-22 株式会社日立製作所 磁気記録再生装置のテ−プロ−ディング機構
US5129955A (en) 1989-01-11 1992-07-14 Dainippon Screen Mfg. Co., Ltd. Wafer cleaning method
US5357645A (en) 1989-04-09 1994-10-25 System Seiko Co., Ltd. Apparatus for cleaning and drying hard disk substrates
JP2887408B2 (ja) * 1990-08-10 1999-04-26 株式会社荏原製作所 ウエハ洗浄装置
JPH04213826A (ja) * 1990-12-11 1992-08-04 Nec Yamagata Ltd 半導体製造用ウェーハ洗浄装置
US5144711A (en) * 1991-03-25 1992-09-08 Westech Systems, Inc. Cleaning brush for semiconductor wafer
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
JPH053184A (ja) * 1991-06-24 1993-01-08 Sony Corp ウエハの洗浄方法
US5317778A (en) 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
US5486134A (en) 1992-02-27 1996-01-23 Oliver Design, Inc. System and method for texturing magnetic data storage disks
KR100230694B1 (ko) * 1992-05-18 1999-11-15 다카시마 히로시 기판세정처리장치
JPH06120192A (ja) * 1992-10-01 1994-04-28 Sumitomo Precision Prod Co Ltd 両面スクラブ洗浄装置
JP2877216B2 (ja) 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
JPH0817772A (ja) * 1994-06-30 1996-01-19 Dainippon Screen Mfg Co Ltd 回転式基板洗浄装置
JP2888412B2 (ja) 1994-07-04 1999-05-10 信越半導体株式会社 ブラシ洗浄装置及びワーク洗浄システム
DE19525521B4 (de) 1994-07-15 2007-04-26 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Verfahren zum Reinigen von Substraten
US5723019A (en) * 1994-07-15 1998-03-03 Ontrak Systems, Incorporated Drip chemical delivery method and apparatus
TW316995B (de) 1995-01-19 1997-10-01 Tokyo Electron Co Ltd
JPH08238463A (ja) * 1995-03-03 1996-09-17 Ebara Corp 洗浄方法及び洗浄装置
US5639311A (en) 1995-06-07 1997-06-17 International Business Machines Corporation Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations
US5624501A (en) 1995-09-26 1997-04-29 Gill, Jr.; Gerald L. Apparatus for cleaning semiconductor wafers
DE69631258T2 (de) * 1995-10-13 2004-11-18 Lam Research Corp., Fremont Verfahren zum Entfernen von Verunreinigungen durch Bürsten
US5693148A (en) 1995-11-08 1997-12-02 Ontrak Systems, Incorporated Process for brush cleaning
US5675856A (en) 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
US5778554A (en) 1996-07-15 1998-07-14 Oliver Design, Inc. Wafer spin dryer and method of drying a wafer
US5875507A (en) 1996-07-15 1999-03-02 Oliver Design, Inc. Wafer cleaning apparatus
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US5862560A (en) * 1996-08-29 1999-01-26 Ontrak Systems, Inc. Roller with treading and system including the same
JPH1126408A (ja) * 1997-07-08 1999-01-29 Matsushita Electric Ind Co Ltd 基板の洗浄方法及び装置
JP3320640B2 (ja) * 1997-07-23 2002-09-03 東京エレクトロン株式会社 洗浄装置
US6196896B1 (en) 1997-10-31 2001-03-06 Obsidian, Inc. Chemical mechanical polisher
JPH11179646A (ja) * 1997-12-19 1999-07-06 Speedfam Co Ltd 洗浄装置
US6093254A (en) * 1998-10-30 2000-07-25 Lam Research Corporation Method of HF-HF Cleaning
US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
JP5675856B2 (ja) * 2013-01-15 2015-02-25 キヤノン株式会社 画像処理装置及び方法、及びプログラムを記録した記憶媒体

Also Published As

Publication number Publication date
TW457533B (en) 2001-10-01
ATE443343T1 (de) 2009-10-15
KR100750545B1 (ko) 2007-08-20
WO2000077835A1 (en) 2000-12-21
EP1186006B1 (de) 2009-09-16
CN1355929A (zh) 2002-06-26
US20020062842A1 (en) 2002-05-30
US6711775B2 (en) 2004-03-30
KR20020008413A (ko) 2002-01-30
US20040216764A1 (en) 2004-11-04
JP2003502840A (ja) 2003-01-21
EP1186006A1 (de) 2002-03-13
AU5304600A (en) 2001-01-02
CN1156890C (zh) 2004-07-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee