CN101610641B - 湿处理系统及湿处理方法 - Google Patents
湿处理系统及湿处理方法 Download PDFInfo
- Publication number
- CN101610641B CN101610641B CN2008103022308A CN200810302230A CN101610641B CN 101610641 B CN101610641 B CN 101610641B CN 2008103022308 A CN2008103022308 A CN 2008103022308A CN 200810302230 A CN200810302230 A CN 200810302230A CN 101610641 B CN101610641 B CN 101610641B
- Authority
- CN
- China
- Prior art keywords
- liquid
- jet device
- conveyer
- wet
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 68
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000012546 transfer Methods 0.000 claims description 48
- 238000005530 etching Methods 0.000 claims description 31
- 238000004891 communication Methods 0.000 claims description 2
- 239000003463 adsorbent Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 description 45
- 239000002184 metal Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000012530 fluid Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 210000005056 cell body Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000008234 soft water Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103022308A CN101610641B (zh) | 2008-06-19 | 2008-06-19 | 湿处理系统及湿处理方法 |
US12/345,896 US20090314739A1 (en) | 2008-06-19 | 2008-12-30 | Wet processing system and wet processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103022308A CN101610641B (zh) | 2008-06-19 | 2008-06-19 | 湿处理系统及湿处理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101610641A CN101610641A (zh) | 2009-12-23 |
CN101610641B true CN101610641B (zh) | 2011-06-29 |
Family
ID=41430160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008103022308A Expired - Fee Related CN101610641B (zh) | 2008-06-19 | 2008-06-19 | 湿处理系统及湿处理方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090314739A1 (zh) |
CN (1) | CN101610641B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101985752B (zh) * | 2009-07-28 | 2013-01-09 | 富葵精密组件(深圳)有限公司 | 喷蚀装置 |
GB2510994B (en) * | 2010-06-04 | 2014-12-31 | Plastic Logic Ltd | Edge detection |
CN110349856B (zh) * | 2019-06-28 | 2021-04-27 | Tcl华星光电技术有限公司 | 湿式蚀刻方法及装置 |
CN111885835B (zh) * | 2020-08-06 | 2022-02-01 | 上海美维科技有限公司 | 基于co2激光的印刷电路板的制作系统及制作方法 |
CN112533390B (zh) * | 2021-02-03 | 2021-04-30 | 四川英创力电子科技股份有限公司 | 一种嵌铜pcb板铜板制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1282981A (zh) * | 1999-07-28 | 2001-02-07 | 日本电气株式会社 | 湿处理装置 |
CN1340848A (zh) * | 2000-08-30 | 2002-03-20 | 阿尔卑斯电气株式会社 | 湿式处理装置 |
CN1284212C (zh) * | 2003-02-05 | 2006-11-08 | 阿尔卑斯电气株式会社 | 湿式处理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4907612A (en) * | 1988-10-28 | 1990-03-13 | National Semiconductor Corporation | Universal material handling apparatus |
JP3953682B2 (ja) * | 1999-06-02 | 2007-08-08 | 株式会社荏原製作所 | ウエハ洗浄装置 |
US6711775B2 (en) * | 1999-06-10 | 2004-03-30 | Lam Research Corporation | System for cleaning a semiconductor wafer |
AU772539B2 (en) * | 1999-07-29 | 2004-04-29 | Kaneka Corporation | Method for cleaning photovoltaic module and cleaning apparatus |
EP1077474A3 (en) * | 1999-08-14 | 2004-05-12 | Applied Materials, Inc. | Backside etching in a scrubber |
CN1248565C (zh) * | 2000-09-19 | 2006-03-29 | 松下电器产业株式会社 | 元件吸附装置、元件安装装置和元件安装方法 |
DE10065335A1 (de) * | 2000-12-27 | 2002-07-04 | Bsh Bosch Siemens Hausgeraete | Waschmaschine mit Fördervorrichtung |
US6733596B1 (en) * | 2002-12-23 | 2004-05-11 | Lam Research Corporation | Substrate cleaning brush preparation sequence, method, and system |
JP2005211717A (ja) * | 2004-01-27 | 2005-08-11 | Shinko Electric Ind Co Ltd | 基板の処理装置 |
TWI280218B (en) * | 2006-03-22 | 2007-05-01 | United Benefit Inc | Agitated machine for wet process |
-
2008
- 2008-06-19 CN CN2008103022308A patent/CN101610641B/zh not_active Expired - Fee Related
- 2008-12-30 US US12/345,896 patent/US20090314739A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1282981A (zh) * | 1999-07-28 | 2001-02-07 | 日本电气株式会社 | 湿处理装置 |
CN1340848A (zh) * | 2000-08-30 | 2002-03-20 | 阿尔卑斯电气株式会社 | 湿式处理装置 |
CN1284212C (zh) * | 2003-02-05 | 2006-11-08 | 阿尔卑斯电气株式会社 | 湿式处理装置 |
Also Published As
Publication number | Publication date |
---|---|
US20090314739A1 (en) | 2009-12-24 |
CN101610641A (zh) | 2009-12-23 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 |