ATE283119T1 - Verfahren zum entfernen von oberflächenverunreinigungen - Google Patents

Verfahren zum entfernen von oberflächenverunreinigungen

Info

Publication number
ATE283119T1
ATE283119T1 AT00121431T AT00121431T ATE283119T1 AT E283119 T1 ATE283119 T1 AT E283119T1 AT 00121431 T AT00121431 T AT 00121431T AT 00121431 T AT00121431 T AT 00121431T AT E283119 T1 ATE283119 T1 AT E283119T1
Authority
AT
Austria
Prior art keywords
ozone
contaminants
deposited
substrates
treating solution
Prior art date
Application number
AT00121431T
Other languages
English (en)
Inventor
Hisashi Muraoka
Original Assignee
Nomura Micro Science Kk
Ums Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26553579&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE283119(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nomura Micro Science Kk, Ums Co Ltd filed Critical Nomura Micro Science Kk
Application granted granted Critical
Publication of ATE283119T1 publication Critical patent/ATE283119T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C11D7/30—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT00121431T 1999-09-30 2000-09-29 Verfahren zum entfernen von oberflächenverunreinigungen ATE283119T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28001799 1999-09-30
JP2000086924 2000-03-27

Publications (1)

Publication Number Publication Date
ATE283119T1 true ATE283119T1 (de) 2004-12-15

Family

ID=26553579

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00121431T ATE283119T1 (de) 1999-09-30 2000-09-29 Verfahren zum entfernen von oberflächenverunreinigungen

Country Status (6)

Country Link
US (1) US6699330B1 (de)
EP (1) EP1088603B1 (de)
KR (1) KR100707126B1 (de)
AT (1) ATE283119T1 (de)
DE (1) DE60016133T2 (de)
TW (1) TW466558B (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL119523A0 (en) * 1996-10-30 1997-01-10 Algotec Systems Ltd Data distribution system
JP2002001320A (ja) * 2000-06-21 2002-01-08 Sumitomo Precision Prod Co Ltd 排オゾン水の処理方法
JP4038557B2 (ja) * 2002-04-16 2008-01-30 リアライズ・アドバンストテクノロジ株式会社 レジスト除去装置及びレジスト除去方法
GB2391164B (en) * 2002-07-24 2005-08-17 Abb Offshore Systems Ltd Method of cleaning surfaces in contact with a fluid flow
KR100951898B1 (ko) 2002-12-09 2010-04-09 삼성전자주식회사 포토레지스트 제거용 스트리핑 조성물 및 이를 사용한액정 표시 장치의 박막 트랜지스터 기판의 제조방법
US7250312B2 (en) * 2003-08-08 2007-07-31 Semiconductor Energy Laboratory Co., Ltd. Doping method and method for fabricating thin film transistor
NL1024132C2 (nl) * 2003-08-20 2005-02-22 Vetco Gray Controls Ltd Werkwijze voor het zuiveren van oppervlakken die in contact staan met een fluïdumstroom.
US20050247807A1 (en) * 2004-03-15 2005-11-10 Wen-Ben Liu System for automatically recycling flat glass from workpiece and method of the same
JP2005265718A (ja) * 2004-03-19 2005-09-29 Sumitomo Mitsubishi Silicon Corp 不純物の分析方法
US7632756B2 (en) * 2004-08-26 2009-12-15 Applied Materials, Inc. Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
US7235479B2 (en) * 2004-08-26 2007-06-26 Applied Materials, Inc. Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials
US7722951B2 (en) * 2004-10-15 2010-05-25 Georgia Tech Research Corporation Insulator coating and method for forming same
US20070095366A1 (en) * 2005-11-02 2007-05-03 Applied Materials, Inc. Stripping and cleaning of organic-containing materials from electronic device substrate surfaces
KR100753959B1 (ko) * 2006-01-12 2007-08-31 에이펫(주) 기판 건조장치를 이용한 기판 건조방법
US7402213B2 (en) * 2006-02-03 2008-07-22 Applied Materials, Inc. Stripping and removal of organic-containing materials from electronic device substrate surfaces
US20090011222A1 (en) * 2006-03-27 2009-01-08 Georgia Tech Research Corporation Superhydrophobic surface and method for forming same
US20070261718A1 (en) * 2006-05-10 2007-11-15 Rubinder Randhawa Method and apparatus for ozone-enhanced cleaning of flat objects with pulsed liquid jet
JP4795854B2 (ja) * 2006-06-05 2011-10-19 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
US7527695B2 (en) * 2006-06-21 2009-05-05 Asahi Glass Company, Limited Apparatus and method for cleaning substrate
DE102006036475A1 (de) * 2006-08-04 2008-02-07 Khs Ag Verfahren zur Sterilisation von Reinräumen für die Behandlung und/oder das Füllen und Verschließen von Behältern
JP4946321B2 (ja) * 2006-09-29 2012-06-06 富士通セミコンダクター株式会社 基板処理装置及び基板処理方法
US7958899B2 (en) * 2007-08-21 2011-06-14 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning apparatus and substrate cleaning method
JP4745307B2 (ja) * 2007-09-28 2011-08-10 株式会社東芝 磁気記録媒体および磁気記録媒体の製造方法
US7767586B2 (en) * 2007-10-29 2010-08-03 Applied Materials, Inc. Methods for forming connective elements on integrated circuits for packaging applications
US20090111277A1 (en) * 2007-10-29 2009-04-30 Applied Materials, Inc. Wet photoresist strip for wafer bumping with ozonated acetic anhydride
US20090117500A1 (en) * 2007-11-01 2009-05-07 Roman Gouk Photoresist strip with ozonated acetic acid solution
US7955440B2 (en) * 2007-12-07 2011-06-07 Sumco Corporation Method for cleaning silicon wafer and apparatus for cleaning the silicon wafer
JP5216633B2 (ja) 2008-03-19 2013-06-19 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． バックグラウンドめっきを抑制する方法
DE102009035341A1 (de) * 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Vorrichtung zur Reinigung von Substraten an einem Träger
JP2011140007A (ja) * 2010-01-08 2011-07-21 Omron Healthcare Co Ltd 薄板部材洗浄装置
KR101044713B1 (ko) * 2010-07-29 2011-06-28 (주)하이레벤 태양광 발전설비의 세척을 구현하는 효율향상설비
KR20120028079A (ko) * 2010-09-14 2012-03-22 삼성모바일디스플레이주식회사 기판의 세정 장치 및 세정 방법
ITMI20110646A1 (it) 2011-04-15 2012-10-16 St Microelectronics Srl Apparecchiatura per la lavorazione di wafer semiconduttori, in particolare per realizzare una fase di processo di rimozione di polimeri.
CA2856196C (en) 2011-12-06 2020-09-01 Masco Corporation Of Indiana Ozone distribution in a faucet
JP6592316B2 (ja) * 2015-09-24 2019-10-16 エイブリック株式会社 半導体基板処理装置、フォトレジストを剥離する方法、および半導体装置の製造方法
CN108463437B (zh) 2015-12-21 2022-07-08 德尔塔阀门公司 包括消毒装置的流体输送系统
CN105655239B (zh) * 2016-03-31 2018-05-25 苏州晶樱光电科技有限公司 硅晶片清洗工艺
WO2019150967A1 (ja) * 2018-01-31 2019-08-08 富士フイルム株式会社 分析方法、薬液、及び、薬液の製造方法
KR102072581B1 (ko) * 2018-05-04 2020-02-03 세메스 주식회사 기판 처리방법 및 처리장치
CN109201605B (zh) * 2018-09-13 2023-05-09 无锡市恒利弘实业有限公司 一种金属表面保护uv油墨的脱膜装置
CN109201606B (zh) * 2018-09-13 2023-05-09 无锡市恒利弘实业有限公司 一种金属基材表面uv油墨的剥离联用工艺
CN109201607B (zh) * 2018-09-13 2023-05-09 无锡市恒利弘实业有限公司 一种金属基材表面uv油墨的剥离联用装置
US11786893B2 (en) 2019-03-01 2023-10-17 United Laboratories International, Llc Solvent system for cleaning fixed bed reactor catalyst in situ
WO2023018742A1 (en) * 2021-08-09 2023-02-16 Delta-Energy Group, Llc Process for remediation of articles contaminated with radioactive materials
CN114289390A (zh) * 2021-12-30 2022-04-08 湖南科技大学 硅料清洗系统

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS614232A (ja) * 1984-06-19 1986-01-10 Nec Corp 半導体基板の洗浄方法
JPH07114191B2 (ja) * 1990-11-14 1995-12-06 株式会社荏原総合研究所 洗浄方法
JP3320549B2 (ja) * 1994-04-26 2002-09-03 岩手東芝エレクトロニクス株式会社 被膜除去方法および被膜除去剤
JP3379232B2 (ja) * 1994-08-25 2003-02-24 株式会社神戸製鋼所 ＡｌまたはＡｌ合金の溶解法
JP4347426B2 (ja) * 1996-09-26 2009-10-21 芝浦メカトロニクス株式会社 洗浄処理装置
ATE522926T1 (de) * 1997-02-14 2011-09-15 Imec Verfahren zur entfernung organischer kontamination von einer halbleiteroberfläche
US20020011257A1 (en) * 1997-02-14 2002-01-31 Degendt Stefan Method for removing organic contaminants from a semiconductor surface
US6701941B1 (en) * 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
US6080531A (en) * 1998-03-30 2000-06-27 Fsi International, Inc. Organic removal process
US6758938B1 (en) * 1999-08-31 2004-07-06 Micron Technology, Inc. Delivery of dissolved ozone
JP3538114B2 (ja) * 1999-09-30 2004-06-14 野村マイクロ・サイエンス株式会社 表面付着汚染物質の除去方法及び除去装置
AU4308101A (en) * 1999-12-02 2001-06-12 Cfmt, Inc. Apparatus for providing ozonated process fluid and methods for using same
WO2001068277A1 (en) * 2000-03-13 2001-09-20 Cfmt, Inc. Processes and apparatus for treating electronic components
JP2002025971A (ja) * 2000-07-04 2002-01-25 Seiko Epson Corp 基材処理方法、基材処理装置及び電子デバイスの製造方法
KR100867924B1 (ko) * 2007-03-07 2008-11-10 삼성에스디아이 주식회사 도너기판, 그의 제조방법 및 유기전계발광소자

Also Published As

Publication number Publication date
US6699330B1 (en) 2004-03-02
KR20010039947A (ko) 2001-05-15
KR100707126B1 (ko) 2007-04-16
TW466558B (en) 2001-12-01
EP1088603B1 (de) 2004-11-24
EP1088603A1 (de) 2001-04-04
DE60016133D1 (de) 2004-12-30
DE60016133T2 (de) 2005-05-25

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