DE60016133D1 - Verfahren zum Entfernen von Oberflächenverunreinigungen - Google Patents

Verfahren zum Entfernen von Oberflächenverunreinigungen

Info

Publication number
DE60016133D1
DE60016133D1 DE60016133T DE60016133T DE60016133D1 DE 60016133 D1 DE60016133 D1 DE 60016133D1 DE 60016133 T DE60016133 T DE 60016133T DE 60016133 T DE60016133 T DE 60016133T DE 60016133 D1 DE60016133 D1 DE 60016133D1
Authority
DE
Germany
Prior art keywords
ozone
contaminants
deposited
substrates
removing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60016133T
Other languages
English (en)
Other versions
DE60016133T2 (de
Inventor
Hisashi Muraoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nomura Micro Science Co Ltd
UMS Co Ltd
Original Assignee
Nomura Micro Science Co Ltd
UMS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26553579&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60016133(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nomura Micro Science Co Ltd, UMS Co Ltd filed Critical Nomura Micro Science Co Ltd
Publication of DE60016133D1 publication Critical patent/DE60016133D1/de
Application granted granted Critical
Publication of DE60016133T2 publication Critical patent/DE60016133T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C11D7/30—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60016133T 1999-09-30 2000-09-29 Verfahren zum Entfernen von Oberflächenverunreinigungen Expired - Fee Related DE60016133T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP28001799 1999-09-30
JP28001799 1999-09-30
JP2000086924 2000-03-27
JP2000086924 2000-03-27

Publications (2)

Publication Number Publication Date
DE60016133D1 true DE60016133D1 (de) 2004-12-30
DE60016133T2 DE60016133T2 (de) 2005-05-25

Family

ID=26553579

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60016133T Expired - Fee Related DE60016133T2 (de) 1999-09-30 2000-09-29 Verfahren zum Entfernen von Oberflächenverunreinigungen

Country Status (6)

Country Link
US (1) US6699330B1 (de)
EP (1) EP1088603B1 (de)
KR (1) KR100707126B1 (de)
AT (1) ATE283119T1 (de)
DE (1) DE60016133T2 (de)
TW (1) TW466558B (de)

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US7250312B2 (en) * 2003-08-08 2007-07-31 Semiconductor Energy Laboratory Co., Ltd. Doping method and method for fabricating thin film transistor
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JP2005265718A (ja) * 2004-03-19 2005-09-29 Sumitomo Mitsubishi Silicon Corp 不純物の分析方法
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US7402213B2 (en) * 2006-02-03 2008-07-22 Applied Materials, Inc. Stripping and removal of organic-containing materials from electronic device substrate surfaces
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JP4745307B2 (ja) * 2007-09-28 2011-08-10 株式会社東芝 磁気記録媒体および磁気記録媒体の製造方法
US7767586B2 (en) * 2007-10-29 2010-08-03 Applied Materials, Inc. Methods for forming connective elements on integrated circuits for packaging applications
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US20090117500A1 (en) * 2007-11-01 2009-05-07 Roman Gouk Photoresist strip with ozonated acetic acid solution
US7955440B2 (en) * 2007-12-07 2011-06-07 Sumco Corporation Method for cleaning silicon wafer and apparatus for cleaning the silicon wafer
JP5216633B2 (ja) 2008-03-19 2013-06-19 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． バックグラウンドめっきを抑制する方法
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JP2011140007A (ja) * 2010-01-08 2011-07-21 Omron Healthcare Co Ltd 薄板部材洗浄装置
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CA2856196C (en) 2011-12-06 2020-09-01 Masco Corporation Of Indiana Ozone distribution in a faucet
JP6592316B2 (ja) * 2015-09-24 2019-10-16 エイブリック株式会社 半導体基板処理装置、フォトレジストを剥離する方法、および半導体装置の製造方法
CN108463437B (zh) 2015-12-21 2022-07-08 德尔塔阀门公司 包括消毒装置的流体输送系统
CN105655239B (zh) * 2016-03-31 2018-05-25 苏州晶樱光电科技有限公司 硅晶片清洗工艺
WO2019150967A1 (ja) * 2018-01-31 2019-08-08 富士フイルム株式会社 分析方法、薬液、及び、薬液の製造方法
KR102072581B1 (ko) * 2018-05-04 2020-02-03 세메스 주식회사 기판 처리방법 및 처리장치
CN109201605B (zh) * 2018-09-13 2023-05-09 无锡市恒利弘实业有限公司 一种金属表面保护uv油墨的脱膜装置
CN109201606B (zh) * 2018-09-13 2023-05-09 无锡市恒利弘实业有限公司 一种金属基材表面uv油墨的剥离联用工艺
CN109201607B (zh) * 2018-09-13 2023-05-09 无锡市恒利弘实业有限公司 一种金属基材表面uv油墨的剥离联用装置
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Also Published As

Publication number Publication date
US6699330B1 (en) 2004-03-02
KR20010039947A (ko) 2001-05-15
KR100707126B1 (ko) 2007-04-16
TW466558B (en) 2001-12-01
ATE283119T1 (de) 2004-12-15
EP1088603B1 (de) 2004-11-24
EP1088603A1 (de) 2001-04-04
DE60016133T2 (de) 2005-05-25

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8339 Ceased/non-payment of the annual fee