DE630991T1 - Stromloses goldbeschichtungsbad. - Google Patents
Stromloses goldbeschichtungsbad.Info
- Publication number
- DE630991T1 DE630991T1 DE0630991T DE92924008T DE630991T1 DE 630991 T1 DE630991 T1 DE 630991T1 DE 0630991 T DE0630991 T DE 0630991T DE 92924008 T DE92924008 T DE 92924008T DE 630991 T1 DE630991 T1 DE 630991T1
- Authority
- DE
- Germany
- Prior art keywords
- salt
- coating bath
- gold coating
- mercaptobenzothiazole
- thiosulfate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims 4
- 239000010931 gold Substances 0.000 title claims 4
- 229910052737 gold Inorganic materials 0.000 title claims 4
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 230000005611 electricity Effects 0.000 title 1
- 150000003839 salts Chemical class 0.000 claims 4
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 239000000243 solution Substances 0.000 claims 2
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 claims 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 claims 1
- HOASVNMVYBSLSU-UHFFFAOYSA-N 6-ethoxy-3h-1,3-benzothiazole-2-thione Chemical compound CCOC1=CC=C2N=C(S)SC2=C1 HOASVNMVYBSLSU-UHFFFAOYSA-N 0.000 claims 1
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 claims 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- -1 alkylamine compounds Chemical class 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 229960005070 ascorbic acid Drugs 0.000 claims 1
- 235000010323 ascorbic acid Nutrition 0.000 claims 1
- 239000011668 ascorbic acid Substances 0.000 claims 1
- ZBKIUFWVEIBQRT-UHFFFAOYSA-N gold(1+) Chemical compound [Au+] ZBKIUFWVEIBQRT-UHFFFAOYSA-N 0.000 claims 1
- 150000003840 hydrochlorides Chemical class 0.000 claims 1
- 239000006174 pH buffer Substances 0.000 claims 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1992/001538 WO1994012686A1 (fr) | 1992-11-25 | 1992-11-25 | Bain autocatalytique de placage d'or |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE630991T1 true DE630991T1 (de) | 1995-07-13 |
Family
ID=14042674
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE0630991T Pending DE630991T1 (de) | 1992-11-25 | 1992-11-25 | Stromloses goldbeschichtungsbad. |
| DE69224914T Expired - Fee Related DE69224914T2 (de) | 1992-11-25 | 1992-11-25 | Stromloses goldbeschichtungsbad |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69224914T Expired - Fee Related DE69224914T2 (de) | 1992-11-25 | 1992-11-25 | Stromloses goldbeschichtungsbad |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5470381A (OSRAM) |
| EP (1) | EP0630991B1 (OSRAM) |
| DE (2) | DE630991T1 (OSRAM) |
| WO (1) | WO1994012686A1 (OSRAM) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2927142B2 (ja) * | 1993-03-26 | 1999-07-28 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
| WO1999018255A1 (en) | 1997-10-03 | 1999-04-15 | Massachusetts Institute Of Technology | Selective substrate metallization |
| DE19745602C1 (de) | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Verfahren und Lösung zur Herstellung von Goldschichten |
| DE19745601C2 (de) * | 1997-10-08 | 2001-07-12 | Fraunhofer Ges Forschung | Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung |
| US5935306A (en) * | 1998-02-10 | 1999-08-10 | Technic Inc. | Electroless gold plating bath |
| JP3920462B2 (ja) * | 1998-07-13 | 2007-05-30 | 株式会社大和化成研究所 | 貴金属を化学的還元析出によって得るための水溶液 |
| US6383269B1 (en) | 1999-01-27 | 2002-05-07 | Shipley Company, L.L.C. | Electroless gold plating solution and process |
| JP3466521B2 (ja) * | 1999-10-04 | 2003-11-10 | 新光電気工業株式会社 | 置換型無電解金めっき液及び無電解金めっき方法 |
| EP1090825A3 (de) | 1999-10-07 | 2002-04-10 | Österreichische Bundesbahnen | Zweiachsiger Eisenbahngüterwagen |
| DE10018025A1 (de) * | 2000-04-04 | 2001-10-18 | Atotech Deutschland Gmbh | Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern |
| JP3482402B2 (ja) * | 2001-06-29 | 2003-12-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 置換金メッキ液 |
| JP4375702B2 (ja) * | 2001-10-25 | 2009-12-02 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | めっき組成物 |
| US6911230B2 (en) * | 2001-12-14 | 2005-06-28 | Shipley Company, L.L.C. | Plating method |
| JP3892730B2 (ja) * | 2002-01-30 | 2007-03-14 | 関東化学株式会社 | 無電解金めっき液 |
| SG116489A1 (en) * | 2003-04-21 | 2005-11-28 | Shipley Co Llc | Plating composition. |
| KR100953612B1 (ko) * | 2003-06-02 | 2010-04-20 | 삼성에스디아이 주식회사 | 생체물질 고정용 기판 및 이의 제조방법 |
| CN100549228C (zh) * | 2003-06-05 | 2009-10-14 | 日矿金属株式会社 | 无电镀金液 |
| JP4603320B2 (ja) * | 2003-10-22 | 2010-12-22 | 関東化学株式会社 | 無電解金めっき液 |
| KR100732794B1 (ko) * | 2004-04-05 | 2007-06-27 | 닛코킨조쿠 가부시키가이샤 | 무전해 금도금액 |
| US7390354B2 (en) * | 2004-07-09 | 2008-06-24 | Nikko Materials Co., Ltd. | Electroless gold plating solution |
| US20070056403A1 (en) * | 2004-07-15 | 2007-03-15 | Sony Corporation | Electroconductive fine particle, method of producing electroconductive fine particle, and anisotropic electroconductive material |
| JP2006111960A (ja) * | 2004-09-17 | 2006-04-27 | Shinko Electric Ind Co Ltd | 非シアン無電解金めっき液及び無電解金めっき方法 |
| JP3945814B2 (ja) * | 2004-11-15 | 2007-07-18 | 日鉱金属株式会社 | 無電解金めっき液 |
| US20070175358A1 (en) * | 2006-02-01 | 2007-08-02 | Kilnam Hwang | Electroless gold plating solution |
| US20070175359A1 (en) * | 2006-02-01 | 2007-08-02 | Kilnam Hwang | Electroless gold plating solution and method |
| GB0903642D0 (en) * | 2009-02-27 | 2009-09-30 | Bae Systems Plc | Electroless metal deposition for micron scale structures |
| DE102009041264A1 (de) | 2009-09-11 | 2011-03-24 | IPHT Jena Institut für Photonische Technologien e.V. | Verfahren zur Herstellung von optisch aktiven Nanostrukturen |
| JP4831710B1 (ja) * | 2010-07-20 | 2011-12-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液及び無電解金めっき方法 |
| JP5610500B1 (ja) * | 2014-05-21 | 2014-10-22 | 小島化学薬品株式会社 | 有機金錯体 |
| KR101444687B1 (ko) * | 2014-08-06 | 2014-09-26 | (주)엠케이켐앤텍 | 무전해 금도금액 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3700469A (en) * | 1971-03-08 | 1972-10-24 | Bell Telephone Labor Inc | Electroless gold plating baths |
| US3697296A (en) * | 1971-03-09 | 1972-10-10 | Du Pont | Electroless gold plating bath and process |
| US3977884A (en) * | 1975-01-02 | 1976-08-31 | Shipley Company, Inc. | Metal plating solution |
| JPS5217333A (en) * | 1975-08-01 | 1977-02-09 | Hitachi Ltd | Plating solution |
| GB1547028A (en) * | 1976-11-19 | 1979-06-06 | Mine Safety Appliances Co | Electroless gold plating baths |
| US4246195A (en) * | 1978-10-06 | 1981-01-20 | Halcon Research And Development Corporation | Purification of carbonylation products |
| JPS56108869A (en) * | 1980-01-31 | 1981-08-28 | Asahi Glass Co Ltd | Nickel coat forming method |
| JPS5819468A (ja) * | 1981-07-28 | 1983-02-04 | Asahi Glass Co Ltd | ニツケル被膜の形成方法 |
| GB2114159B (en) * | 1982-01-25 | 1986-02-12 | Mine Safety Appliances Co | Method and bath for the electroless plating of gold |
| JPS61253376A (ja) * | 1985-05-01 | 1986-11-11 | Shinko Electric Ind Co Ltd | 銅又は銅合金材の電解金めっき用前処理液 |
| CN1003524B (zh) * | 1985-10-14 | 1989-03-08 | 株式会社日立制作所 | 无电浸镀金溶液 |
| JPS6299477A (ja) * | 1985-10-25 | 1987-05-08 | C Uyemura & Co Ltd | 無電解金めつき液 |
| DE3614090C1 (en) * | 1986-04-25 | 1987-04-30 | Heraeus Gmbh W C | Bath for the currentless deposition of gold layers |
| DE3640028C1 (de) * | 1986-11-24 | 1987-10-01 | Heraeus Gmbh W C | Saures Bad fuer das stromlose Abscheiden von Goldschichten |
| JP2655329B2 (ja) * | 1988-01-28 | 1997-09-17 | 関東化学 株式会社 | 無電解金めつき液 |
| JPH0270084A (ja) * | 1988-09-06 | 1990-03-08 | C Uyemura & Co Ltd | 金めっき浴及び金めっき方法 |
| US5130168A (en) * | 1988-11-22 | 1992-07-14 | Technic, Inc. | Electroless gold plating bath and method of using same |
| US5258062A (en) * | 1989-06-01 | 1993-11-02 | Shinko Electric Industries Co., Ltd. | Electroless gold plating solutions |
| US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
| JPH04350172A (ja) * | 1991-05-28 | 1992-12-04 | Kanto Chem Co Inc | 無電解金めっき液 |
| US5232492A (en) * | 1992-01-23 | 1993-08-03 | Applied Electroless Concepts Inc. | Electroless gold plating composition |
| US5364460A (en) * | 1993-03-26 | 1994-11-15 | C. Uyemura & Co., Ltd. | Electroless gold plating bath |
| JPH06299477A (ja) * | 1993-04-15 | 1994-10-25 | Mitsubishi Baarinton Kk | カーペツトの製造方法 |
| US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
-
1992
- 1992-11-25 WO PCT/JP1992/001538 patent/WO1994012686A1/ja not_active Ceased
- 1992-11-25 EP EP92924008A patent/EP0630991B1/en not_active Expired - Lifetime
- 1992-11-25 US US08/256,369 patent/US5470381A/en not_active Expired - Lifetime
- 1992-11-25 DE DE0630991T patent/DE630991T1/de active Pending
- 1992-11-25 DE DE69224914T patent/DE69224914T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69224914D1 (de) | 1998-04-30 |
| US5470381A (en) | 1995-11-28 |
| WO1994012686A1 (fr) | 1994-06-09 |
| EP0630991A1 (en) | 1994-12-28 |
| EP0630991A4 (OSRAM) | 1995-01-18 |
| DE69224914T2 (de) | 1998-10-22 |
| EP0630991B1 (en) | 1998-03-25 |
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