DE630991T1 - Stromloses goldbeschichtungsbad. - Google Patents

Stromloses goldbeschichtungsbad.

Info

Publication number
DE630991T1
DE630991T1 DE0630991T DE92924008T DE630991T1 DE 630991 T1 DE630991 T1 DE 630991T1 DE 0630991 T DE0630991 T DE 0630991T DE 92924008 T DE92924008 T DE 92924008T DE 630991 T1 DE630991 T1 DE 630991T1
Authority
DE
Germany
Prior art keywords
salt
coating bath
gold coating
mercaptobenzothiazole
thiosulfate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE0630991T
Other languages
English (en)
Inventor
Shigetaka Hoshino
Masaru Kato
Yutaka Yazama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Original Assignee
Kanto Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc filed Critical Kanto Chemical Co Inc
Publication of DE630991T1 publication Critical patent/DE630991T1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Claims (2)

EP 92 92 4008.3 KANTO KAGAKU K.K. u. Z. : H 088 EP Patentansprüche Übersetzung nach Art. 67 EPÜ
1. Lösung zum stromlosen Vergolden, umfassend eine wäßrige Lösung, die als Bestandteile a) Tetrachlorogold(III)-Säure oder ein Salz davon oder ein Sulfit- oder Thiosulfat-Gold(I)-Komplexsalz als Goldquelle, b) ein Alkalimetall- oder Ammoniumsulfit oder -thiosulfat, c) Ascorbinsäure oder ein Salz davon und d) einen pH-Puffer enthält, dadurch gekennzeichnet, daß ferner e) eine Verbindung, gewählt aus 2-Mercaptobenzothiazol, 6-Ethoxy-2-Mercaptobenzothiazol, 2-Mercaptobenzimida&zgr;ol, 2-Mercaptobenzoxazol und Salzen davon, vorhanden ist.
2. Lösung zum stromlosen Vergolden nach Anspruch 1, dadurch gekennzeichnet, daß als zusätzlicher Bestandteil f) eine Verbindung, gewählt aus Alkylaminverbindungen und Sulfaten und Hydrochloriden davon, vorhanden ist.
DE0630991T 1992-11-25 1992-11-25 Stromloses goldbeschichtungsbad. Pending DE630991T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1992/001538 WO1994012686A1 (en) 1992-11-25 1992-11-25 Electroless gold plating bath

Publications (1)

Publication Number Publication Date
DE630991T1 true DE630991T1 (de) 1995-07-13

Family

ID=14042674

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69224914T Expired - Fee Related DE69224914T2 (de) 1992-11-25 1992-11-25 Stromloses goldbeschichtungsbad
DE0630991T Pending DE630991T1 (de) 1992-11-25 1992-11-25 Stromloses goldbeschichtungsbad.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69224914T Expired - Fee Related DE69224914T2 (de) 1992-11-25 1992-11-25 Stromloses goldbeschichtungsbad

Country Status (4)

Country Link
US (1) US5470381A (de)
EP (1) EP0630991B1 (de)
DE (2) DE69224914T2 (de)
WO (1) WO1994012686A1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2927142B2 (ja) * 1993-03-26 1999-07-28 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
WO1999018255A1 (en) 1997-10-03 1999-04-15 Massachusetts Institute Of Technology Selective substrate metallization
DE19745601C2 (de) * 1997-10-08 2001-07-12 Fraunhofer Ges Forschung Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung
DE19745602C1 (de) 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Verfahren und Lösung zur Herstellung von Goldschichten
US5935306A (en) * 1998-02-10 1999-08-10 Technic Inc. Electroless gold plating bath
JP3920462B2 (ja) * 1998-07-13 2007-05-30 株式会社大和化成研究所 貴金属を化学的還元析出によって得るための水溶液
US6383269B1 (en) 1999-01-27 2002-05-07 Shipley Company, L.L.C. Electroless gold plating solution and process
JP3466521B2 (ja) * 1999-10-04 2003-11-10 新光電気工業株式会社 置換型無電解金めっき液及び無電解金めっき方法
EP1090825A3 (de) 1999-10-07 2002-04-10 Österreichische Bundesbahnen Zweiachsiger Eisenbahngüterwagen
DE10018025A1 (de) 2000-04-04 2001-10-18 Atotech Deutschland Gmbh Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern
JP3482402B2 (ja) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金メッキ液
JP4375702B2 (ja) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． めっき組成物
US6911230B2 (en) * 2001-12-14 2005-06-28 Shipley Company, L.L.C. Plating method
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
SG116489A1 (en) * 2003-04-21 2005-11-28 Shipley Co Llc Plating composition.
KR100953612B1 (ko) * 2003-06-02 2010-04-20 삼성에스디아이 주식회사 생체물질 고정용 기판 및 이의 제조방법
EP1645658A4 (de) * 2003-06-05 2011-08-03 Nippon Mining Co Lösung zur stromlosen vergoldung
JP4603320B2 (ja) * 2003-10-22 2010-12-22 関東化学株式会社 無電解金めっき液
US7300501B2 (en) * 2004-04-05 2007-11-27 Nikko Materials Co., Ltd. Electroless gold plating liquid
JP4711435B2 (ja) * 2004-07-09 2011-06-29 Ｊｘ日鉱日石金属株式会社 無電解金めっき液
JP4740137B2 (ja) * 2004-07-15 2011-08-03 積水化学工業株式会社 導電性微粒子の製造方法
JP2006111960A (ja) * 2004-09-17 2006-04-27 Shinko Electric Ind Co Ltd 非シアン無電解金めっき液及び無電解金めっき方法
EP1813696B1 (de) * 2004-11-15 2018-12-26 JX Nippon Mining & Metals Corporation Lösung zur stromlosen vergoldung
US20070175358A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution
US20070175359A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution and method
GB0903642D0 (en) * 2009-02-27 2009-09-30 Bae Systems Plc Electroless metal deposition for micron scale structures
DE102009041264A1 (de) 2009-09-11 2011-03-24 IPHT Jena Institut für Photonische Technologien e.V. Verfahren zur Herstellung von optisch aktiven Nanostrukturen
JP4831710B1 (ja) * 2010-07-20 2011-12-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液及び無電解金めっき方法
JP5610500B1 (ja) * 2014-05-21 2014-10-22 小島化学薬品株式会社 有機金錯体
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700469A (en) * 1971-03-08 1972-10-24 Bell Telephone Labor Inc Electroless gold plating baths
US3697296A (en) * 1971-03-09 1972-10-10 Du Pont Electroless gold plating bath and process
US3977884A (en) * 1975-01-02 1976-08-31 Shipley Company, Inc. Metal plating solution
JPS5217333A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Plating solution
GB1547028A (en) * 1976-11-19 1979-06-06 Mine Safety Appliances Co Electroless gold plating baths
US4246195A (en) * 1978-10-06 1981-01-20 Halcon Research And Development Corporation Purification of carbonylation products
JPS56108869A (en) * 1980-01-31 1981-08-28 Asahi Glass Co Ltd Nickel coat forming method
JPS5819468A (ja) * 1981-07-28 1983-02-04 Asahi Glass Co Ltd ニツケル被膜の形成方法
GB2114159B (en) * 1982-01-25 1986-02-12 Mine Safety Appliances Co Method and bath for the electroless plating of gold
JPS61253376A (ja) * 1985-05-01 1986-11-11 Shinko Electric Ind Co Ltd 銅又は銅合金材の電解金めっき用前処理液
CN1003524B (zh) * 1985-10-14 1989-03-08 株式会社日立制作所 无电浸镀金溶液
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
DE3614090C1 (en) * 1986-04-25 1987-04-30 Heraeus Gmbh W C Bath for the currentless deposition of gold layers
DE3640028C1 (de) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Saures Bad fuer das stromlose Abscheiden von Goldschichten
JP2655329B2 (ja) * 1988-01-28 1997-09-17 関東化学 株式会社 無電解金めつき液
JPH0270084A (ja) * 1988-09-06 1990-03-08 C Uyemura & Co Ltd 金めっき浴及び金めっき方法
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US5258062A (en) * 1989-06-01 1993-11-02 Shinko Electric Industries Co., Ltd. Electroless gold plating solutions
US4985076A (en) * 1989-11-03 1991-01-15 General Electric Company Autocatalytic electroless gold plating composition
JPH04350172A (ja) * 1991-05-28 1992-12-04 Kanto Chem Co Inc 無電解金めっき液
US5232492A (en) * 1992-01-23 1993-08-03 Applied Electroless Concepts Inc. Electroless gold plating composition
EP0618307B1 (de) * 1993-03-26 1997-11-12 C. Uyemura & Co, Ltd Chemisches Vergoldungsbad
JPH06299477A (ja) * 1993-04-15 1994-10-25 Mitsubishi Baarinton Kk カーペツトの製造方法
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths

Also Published As

Publication number Publication date
DE69224914D1 (de) 1998-04-30
EP0630991A4 (de) 1995-01-18
DE69224914T2 (de) 1998-10-22
EP0630991A1 (de) 1994-12-28
EP0630991B1 (de) 1998-03-25
WO1994012686A1 (en) 1994-06-09
US5470381A (en) 1995-11-28

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