DE60314218D1 - Gefüllte Epoxidharz-Zusammensetzung zur Einkapselung von Halbleitern sowie ein damit eingekapselter Halbleiterbauteil - Google Patents
Gefüllte Epoxidharz-Zusammensetzung zur Einkapselung von Halbleitern sowie ein damit eingekapselter HalbleiterbauteilInfo
- Publication number
- DE60314218D1 DE60314218D1 DE60314218T DE60314218T DE60314218D1 DE 60314218 D1 DE60314218 D1 DE 60314218D1 DE 60314218 T DE60314218 T DE 60314218T DE 60314218 T DE60314218 T DE 60314218T DE 60314218 D1 DE60314218 D1 DE 60314218D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- resin composition
- epoxy resin
- filled epoxy
- device encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002328726 | 2002-11-12 | ||
JP2002328726A JP3822556B2 (ja) | 2002-11-12 | 2002-11-12 | 半導体装置 |
JP2002339798 | 2002-11-22 | ||
JP2002339797A JP3876216B2 (ja) | 2002-11-22 | 2002-11-22 | 半導体封止用エポキシ樹脂組成物の製法 |
JP2002339798A JP3876217B2 (ja) | 2002-11-22 | 2002-11-22 | 半導体封止用エポキシ樹脂組成物の製法 |
JP2002339797 | 2002-11-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60314218D1 true DE60314218D1 (de) | 2007-07-19 |
DE60314218T2 DE60314218T2 (de) | 2007-09-27 |
Family
ID=32180313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60314218T Expired - Fee Related DE60314218T2 (de) | 2002-11-12 | 2003-11-07 | Gefüllte Epoxidharz-Zusammensetzung zur Einkapselung von Halbleitern sowie ein damit eingekapselter Halbleiterbauteil |
Country Status (8)
Country | Link |
---|---|
US (1) | US7265167B2 (de) |
EP (1) | EP1420035B1 (de) |
KR (1) | KR100676002B1 (de) |
CN (1) | CN1315184C (de) |
DE (1) | DE60314218T2 (de) |
MY (1) | MY135619A (de) |
SG (1) | SG115586A1 (de) |
TW (1) | TWI259503B (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006073600A (ja) * | 2004-08-31 | 2006-03-16 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4383324B2 (ja) * | 2004-11-10 | 2009-12-16 | Necエレクトロニクス株式会社 | 半導体装置 |
CN102223912B (zh) * | 2008-12-12 | 2014-02-12 | 日本来富恩株式会社 | 心腔内除颤导管 |
KR101041774B1 (ko) * | 2009-09-18 | 2011-06-17 | 원정희 | 공기조화시스템의 공조용 여과필터 |
JP2013023661A (ja) * | 2011-07-25 | 2013-02-04 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
CN104277420B (zh) * | 2014-09-18 | 2017-08-22 | 华侨大学 | 一种聚合物结构复合材料及其制备方法 |
CN110651007A (zh) * | 2017-06-09 | 2020-01-03 | 长濑化成株式会社 | 环氧树脂组合物、电子部件安装结构体及其制造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
JPS59179539A (ja) * | 1983-03-29 | 1984-10-12 | Denki Kagaku Kogyo Kk | 樹脂用充填剤 |
JPS60115641A (ja) * | 1983-11-25 | 1985-06-22 | Denki Kagaku Kogyo Kk | 封止樹脂用充填剤及びその組成物 |
JPS60210643A (ja) * | 1983-11-30 | 1985-10-23 | Denki Kagaku Kogyo Kk | 充填剤及びその組成物 |
JPS6140811A (ja) | 1984-07-31 | 1986-02-27 | Nippon Chem Ind Co Ltd:The | 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 |
US4816299A (en) * | 1987-05-20 | 1989-03-28 | Corning Glass Works | Encapsulating compositions containing ultra-pure, fused-silica fillers |
JPH0196008A (ja) | 1987-10-07 | 1989-04-14 | Nippon Chem Ind Co Ltd | 溶融球状シリカ及びその製造方法 |
JP2704281B2 (ja) | 1988-11-25 | 1998-01-26 | 日本化学工業株式会社 | 溶融球状シリカ及びこれをフィラーとする封止用樹脂組成物 |
JPH02158637A (ja) | 1988-12-09 | 1990-06-19 | Nippon Chem Ind Co Ltd | シリカフィラーおよびこれを用いた封止用樹脂組成物 |
JPH0362844A (ja) * | 1989-02-27 | 1991-03-18 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP2665539B2 (ja) | 1989-02-27 | 1997-10-22 | 日本化学工業株式会社 | シリカフィラーおよびこれを用いた封止用樹脂組成物 |
US5028407A (en) * | 1990-01-25 | 1991-07-02 | International Minerals & Chemical Corp. | Method of production of high purity fusible silica |
JP2510928B2 (ja) * | 1992-05-27 | 1996-06-26 | 日本アエロジル株式会社 | 高純度シリカビ―ズの製造方法 |
KR19990008146A (ko) * | 1995-04-28 | 1999-01-25 | 미우라아끼라 | 합성 석영 분말의 제조방법 및 석영 유리 성형체의 제조방법 |
KR100206880B1 (ko) | 1995-12-29 | 1999-07-01 | 구본준 | 히트싱크가 부착된 컬럼형 패키지 |
JP2948184B2 (ja) | 1998-01-05 | 1999-09-13 | 大塚化学株式会社 | Cvケーブル用プレハブ型接続箱 |
JPH11343392A (ja) | 1998-06-02 | 1999-12-14 | Hitachi Chem Co Ltd | テープキャリアパッケージ用エポキシ樹脂組成物 |
CN1113083C (zh) * | 1998-06-09 | 2003-07-02 | 日东电工株式会社 | 半导体封装用环氧树脂组合物及使用了该组合物的半导体器件 |
JP4089019B2 (ja) | 1998-06-22 | 2008-05-21 | 旭硝子株式会社 | 多孔質石英ガラス母材合成用多重管バーナ |
JP2000230039A (ja) * | 1998-12-08 | 2000-08-22 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2001192499A (ja) | 2000-01-14 | 2001-07-17 | Otsuka Chem Co Ltd | 導電性樹脂組成物 |
JP2001354838A (ja) | 2000-06-14 | 2001-12-25 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置並びに評価方法 |
JP3876217B2 (ja) | 2002-11-22 | 2007-01-31 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物の製法 |
-
2003
- 2003-11-07 DE DE60314218T patent/DE60314218T2/de not_active Expired - Fee Related
- 2003-11-07 EP EP03025681A patent/EP1420035B1/de not_active Expired - Lifetime
- 2003-11-07 SG SG200306808A patent/SG115586A1/en unknown
- 2003-11-07 MY MYPI20034266A patent/MY135619A/en unknown
- 2003-11-10 US US10/703,494 patent/US7265167B2/en active Active
- 2003-11-11 TW TW092131483A patent/TWI259503B/zh not_active IP Right Cessation
- 2003-11-12 CN CNB2003101142815A patent/CN1315184C/zh not_active Expired - Fee Related
- 2003-11-12 KR KR1020030079792A patent/KR100676002B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100676002B1 (ko) | 2007-01-29 |
US7265167B2 (en) | 2007-09-04 |
DE60314218T2 (de) | 2007-09-27 |
US20040097632A1 (en) | 2004-05-20 |
SG115586A1 (en) | 2005-10-28 |
CN1499618A (zh) | 2004-05-26 |
TWI259503B (en) | 2006-08-01 |
EP1420035B1 (de) | 2007-06-06 |
CN1315184C (zh) | 2007-05-09 |
EP1420035A1 (de) | 2004-05-19 |
KR20040044337A (ko) | 2004-05-28 |
TW200415683A (en) | 2004-08-16 |
MY135619A (en) | 2008-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |