DE602007011058D1 - Verfahren zur herstellung eines keramischen, mehrschichtsubstrats - Google Patents

Verfahren zur herstellung eines keramischen, mehrschichtsubstrats

Info

Publication number
DE602007011058D1
DE602007011058D1 DE602007011058T DE602007011058T DE602007011058D1 DE 602007011058 D1 DE602007011058 D1 DE 602007011058D1 DE 602007011058 T DE602007011058 T DE 602007011058T DE 602007011058 T DE602007011058 T DE 602007011058T DE 602007011058 D1 DE602007011058 D1 DE 602007011058D1
Authority
DE
Germany
Prior art keywords
ceramic
conductive patterns
green
boundary
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007011058T
Other languages
English (en)
Inventor
Akiyoshi Kawamura
Takayuki Tsukizawa
Tetsuya Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE602007011058D1 publication Critical patent/DE602007011058D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/16—Two dimensionally sectional layer
    • Y10T428/163—Next to unitary web or sheet of equal or greater extent
    • Y10T428/164—Continuous two dimensionally sectional layer
    • Y10T428/166—Glass, ceramic, or metal sections [e.g., floor or wall tile, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
DE602007011058T 2006-05-29 2007-05-09 Verfahren zur herstellung eines keramischen, mehrschichtsubstrats Active DE602007011058D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006148246 2006-05-29
PCT/JP2007/059612 WO2007138826A1 (ja) 2006-05-29 2007-05-09 セラミック多層基板の製造方法

Publications (1)

Publication Number Publication Date
DE602007011058D1 true DE602007011058D1 (de) 2011-01-20

Family

ID=38778346

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007011058T Active DE602007011058D1 (de) 2006-05-29 2007-05-09 Verfahren zur herstellung eines keramischen, mehrschichtsubstrats

Country Status (8)

Country Link
US (1) US8105453B2 (de)
EP (1) EP2023701B1 (de)
JP (1) JP4803185B2 (de)
KR (1) KR100989342B1 (de)
CN (1) CN101341808B (de)
AT (1) ATE491327T1 (de)
DE (1) DE602007011058D1 (de)
WO (1) WO2007138826A1 (de)

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CN101347058B (zh) * 2006-08-07 2010-09-22 株式会社村田制作所 陶瓷多层基板的制造方法
KR100887127B1 (ko) * 2007-11-23 2009-03-04 삼성전기주식회사 적층 세라믹 기판의 제조방법
EP2120522A4 (de) * 2008-02-19 2011-01-26 Murata Manufacturing Co Verfahren zur herstellung von laminierten keramischen elektronischen teilen
KR101018102B1 (ko) * 2008-08-25 2011-02-25 삼성전기주식회사 다층 ｌｔｃｃ 기판 및 그 제조방법
DE102008046336A1 (de) * 2008-09-09 2010-03-11 Osram Gesellschaft mit beschränkter Haftung LTCC-Schichtstapel
JP2010245088A (ja) * 2009-04-01 2010-10-28 Murata Mfg Co Ltd 積層型セラミック電子部品の製造方法
JP5673064B2 (ja) * 2010-12-15 2015-02-18 株式会社村田製作所 コイル内蔵基板の製造方法
WO2012092619A2 (en) 2010-12-30 2012-07-05 Saint-Gobain Abrasives, Inc. Coated abrasive aggregates and products containg same
JP5921074B2 (ja) * 2011-03-17 2016-05-24 株式会社村田製作所 積層基板の製造方法
JP5945099B2 (ja) 2011-04-20 2016-07-05 日本特殊陶業株式会社 配線基板、多数個取り配線基板、およびその製造方法
KR20140075718A (ko) 2011-09-29 2014-06-19 생-고뱅 어브레이시브즈, 인코포레이티드 연마 제품 및 경질 표면 마무리 방법
WO2013057867A1 (ja) * 2011-10-21 2013-04-25 パナソニック株式会社 半導体装置
JP4999029B1 (ja) * 2011-11-11 2012-08-15 株式会社Ｍａｒｕｗａ 裁断焼結セラミックシート及びその製造方法
JP5682548B2 (ja) * 2011-12-14 2015-03-11 株式会社村田製作所 積層型インダクタ素子およびその製造方法
WO2013106575A1 (en) 2012-01-10 2013-07-18 Saint-Gobain Abrasives, Inc. Abrasive products and methods for finishing coated surfaces
RU2595788C2 (ru) 2012-03-16 2016-08-27 Сэнт-Гобэн Эбрейзивс, Инк. Абразивные продукты и способы чистовой обработки поверхностей
WO2013149197A1 (en) 2012-03-30 2013-10-03 Saint-Gobain Abrasives, Inc. Abrasive products and methods for fine polishing of ophthalmic lenses
TW201440983A (zh) * 2013-04-24 2014-11-01 Spirox Corp 微型被動元件之製造方法
KR101490760B1 (ko) * 2013-07-04 2015-02-11 에스케이씨 주식회사 재단 적층 시트 및 그 제조방법
KR20150121567A (ko) 2014-04-21 2015-10-29 삼성전기주식회사 적층 세라믹 커패시터 및 그의 제조 방법
US9724897B2 (en) * 2015-01-07 2017-08-08 Emisense Technologies, Llc Processing method for constraining lower melting point metals within ceramic laminates during sintering
CN105098300A (zh) * 2015-09-11 2015-11-25 禾邦电子（中国）有限公司 共模滤波器及其制造方法
JP6781258B2 (ja) * 2016-07-21 2020-11-04 日本碍子株式会社 センサ素子の製造方法
JP7180619B2 (ja) * 2020-01-10 2022-11-30 Tdk株式会社 電子部品及びその製造方法
TWI775280B (zh) * 2021-01-20 2022-08-21 力晶積成電子製造股份有限公司 電容集成結構、電容單元及其製造方法

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Also Published As

Publication number Publication date
JP4803185B2 (ja) 2011-10-26
KR20080033996A (ko) 2008-04-17
CN101341808A (zh) 2009-01-07
CN101341808B (zh) 2010-06-23
EP2023701B1 (de) 2010-12-08
WO2007138826A1 (ja) 2007-12-06
EP2023701A1 (de) 2009-02-11
JPWO2007138826A1 (ja) 2009-10-01
EP2023701A4 (de) 2009-05-20
ATE491327T1 (de) 2010-12-15
US20080135155A1 (en) 2008-06-12
KR100989342B1 (ko) 2010-10-25
US8105453B2 (en) 2012-01-31

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