DE60127911D1 - Verfahren zum steuern des kupfergehalts in einem weichlöttauchbad - Google Patents

Verfahren zum steuern des kupfergehalts in einem weichlöttauchbad

Info

Publication number
DE60127911D1
DE60127911D1 DE60127911T DE60127911T DE60127911D1 DE 60127911 D1 DE60127911 D1 DE 60127911D1 DE 60127911 T DE60127911 T DE 60127911T DE 60127911 T DE60127911 T DE 60127911T DE 60127911 D1 DE60127911 D1 DE 60127911D1
Authority
DE
Germany
Prior art keywords
copper
bath
solder
density
replenished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60127911T
Other languages
English (en)
Other versions
DE60127911T2 (de
Inventor
Tetsuro Nishimura
Masuo Koshi
K Todoroki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Panasonic Corp
Original Assignee
Nihon Superior Sha Co Ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18569687&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60127911(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nihon Superior Sha Co Ltd, Matsushita Electric Industrial Co Ltd filed Critical Nihon Superior Sha Co Ltd
Application granted granted Critical
Publication of DE60127911D1 publication Critical patent/DE60127911D1/de
Publication of DE60127911T2 publication Critical patent/DE60127911T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Coating With Molten Metal (AREA)
DE60127911T 2000-02-24 2001-02-23 Verfahren zum Steuern der Zusammensetzung einer Schmelzlötlegierung in einem Lötbad Expired - Lifetime DE60127911T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000047437 2000-02-24
JP2000047437A JP3221670B2 (ja) 2000-02-24 2000-02-24 ディップはんだ槽の銅濃度制御方法
PCT/JP2001/001359 WO2001062433A1 (en) 2000-02-24 2001-02-23 A control method for copper content in a solder dipping bath

Publications (2)

Publication Number Publication Date
DE60127911D1 true DE60127911D1 (de) 2007-05-31
DE60127911T2 DE60127911T2 (de) 2007-08-30

Family

ID=18569687

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60127911T Expired - Lifetime DE60127911T2 (de) 2000-02-24 2001-02-23 Verfahren zum Steuern der Zusammensetzung einer Schmelzlötlegierung in einem Lötbad

Country Status (17)

Country Link
US (1) US6699306B2 (de)
EP (1) EP1189725B1 (de)
JP (1) JP3221670B2 (de)
KR (1) KR100852403B1 (de)
CN (1) CN1187161C (de)
AT (1) ATE359894T1 (de)
AU (1) AU782095B2 (de)
BR (1) BR0104486B1 (de)
CA (1) CA2368384C (de)
CZ (1) CZ301025B6 (de)
DE (1) DE60127911T2 (de)
ES (1) ES2286099T3 (de)
MX (1) MXPA01009644A (de)
MY (1) MY122835A (de)
SK (1) SK286033B6 (de)
TW (1) TW533115B (de)
WO (1) WO2001062433A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3312618B2 (ja) * 2000-02-03 2002-08-12 千住金属工業株式会社 はんだ槽へのはんだの追加供給方法
US6924044B2 (en) * 2001-08-14 2005-08-02 Snag, Llc Tin-silver coatings
ATE500018T1 (de) * 2002-01-10 2011-03-15 Senju Metal Industry Co Lötverfahren mit zusatzversorgung eines gegen oxidation enthaltenden lotes
US20060075758A1 (en) 2004-10-07 2006-04-13 Tigerone Development, Llc; Air-conditioning and heating system utilizing thermo-electric solid state devices
TWI465312B (zh) 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP2007080891A (ja) * 2005-09-12 2007-03-29 Fuji Electric Holdings Co Ltd はんだ槽中はんだの銅濃度の経時変化の推定方法
CN101356293B (zh) * 2006-01-10 2010-12-29 伊利诺斯工具制品有限公司 低铜溶解的无铅焊料
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
JP4375491B1 (ja) 2008-06-23 2009-12-02 日本ジョイント株式会社 電子部品のはんだ付け装置およびはんだ付け方法
WO2010089905A1 (ja) 2009-02-09 2010-08-12 日本ジョイント株式会社 電子部品用錫またははんだ合金の製造方法、製造装置、及びはんだ合金
DE102010038452A1 (de) * 2010-07-27 2012-02-02 Robert Bosch Gmbh Leiterquerschnitt mit Verzinnung
DE102011077242A1 (de) 2011-06-09 2012-12-13 Robert Bosch Gmbh Schutzgaszuführung
DE102011077245A1 (de) 2011-06-09 2012-12-13 Eutect Gmbh Lothöhenmessung
DE102011077247A1 (de) 2011-06-09 2012-12-13 Eutect Gmbh Verfahren und Vorrichtung zum Auftragen von Lot
US10329642B2 (en) * 2013-03-13 2019-06-25 Nihon Superior Co., Ltd. Solder alloy and joint thereof
JP7276021B2 (ja) * 2019-09-06 2023-05-18 オムロン株式会社 検出装置、検出方法およびプログラム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567286A (en) * 1941-10-01 1945-02-07 John Louis Coltman Improvements in or relating to the manufacture of heat exchange devices
JPS54120255A (en) * 1978-03-13 1979-09-18 Toshiba Corp Removing method for impurities of solder
JPS5711768A (en) * 1980-06-26 1982-01-21 Brother Ind Ltd Method for control of solder vessel
JPS57168767A (en) * 1981-04-10 1982-10-18 Matsushita Electric Ind Co Ltd Picking-up method for impurity from solder in solder bath
JPS57206570A (en) * 1981-06-10 1982-12-17 Tamura Seisakusho Co Ltd Dip type soldering device
JPS58120678A (ja) * 1982-01-12 1983-07-18 Mitsubishi Rayon Co Ltd 防汚塗料用組成物
JPS60155664A (ja) * 1984-01-24 1985-08-15 Toshiba Corp 超音波はんだめつき装置
US4634044A (en) * 1985-10-04 1987-01-06 Westinghouse Electric Corp. Process for restricted lead content soldering of copper fins to copper alloy tubing with controlled copper contamination of the molten solder reservoir
JPH0284266A (ja) * 1988-09-20 1990-03-26 Tamura Seisakusho Co Ltd はんだ槽におけるはんだ組成管理方法
US5169128A (en) * 1991-09-30 1992-12-08 General Electric Company Molten solder filter
US5405577A (en) * 1993-04-29 1995-04-11 Seelig; Karl F. Lead-free and bismuth-free tin alloy solder composition
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions

Also Published As

Publication number Publication date
EP1189725A1 (de) 2002-03-27
CA2368384A1 (en) 2001-08-30
SK286033B6 (sk) 2008-01-07
AU3415501A (en) 2001-09-03
MY122835A (en) 2006-05-31
US6699306B2 (en) 2004-03-02
TW533115B (en) 2003-05-21
BR0104486A (pt) 2002-01-08
CN1187161C (zh) 2005-02-02
DE60127911T2 (de) 2007-08-30
ES2286099T3 (es) 2007-12-01
JP3221670B2 (ja) 2001-10-22
AU782095B2 (en) 2005-06-30
ATE359894T1 (de) 2007-05-15
BR0104486B1 (pt) 2012-10-16
WO2001062433A1 (en) 2001-08-30
US20020134200A1 (en) 2002-09-26
KR20020007384A (ko) 2002-01-26
CZ301025B6 (cs) 2009-10-14
KR100852403B1 (ko) 2008-08-14
CN1362904A (zh) 2002-08-07
EP1189725B1 (de) 2007-04-18
SK15152001A3 (sk) 2002-02-05
MXPA01009644A (es) 2002-08-12
CA2368384C (en) 2011-04-05
CZ20013830A3 (cs) 2002-05-15
JP2001237536A (ja) 2001-08-31

Similar Documents

Publication Publication Date Title
ATE359894T1 (de) Verfahren zum steuern des kupfergehalts in einem weichlöttauchbad
JP2002113590A (ja) ソルダペ−スト
GB2139132B (en) Vapour phase soldering
MY129904A (en) Apparatus and method for soldering electronic components to printed circuit boards
MY133551A (en) Soldering method and solder alloy for additional supply
TW200724282A (en) A replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath
ATE395715T1 (de) Sicherungseinsatz, verfahren zu seiner herstellung und lotsubstanz
EP0638656A4 (de) Zu beschichtende legierung, plattierungsverfahren und plattierungslösung.
TWI812401B (zh) 焊料合金及焊料接頭
TH33527B (th) วิธีการควบคุมความหนาแน่นของทองแดงในอ่างจุ่มสารบัดกรี
ATE34783T1 (de) Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen; sowie durchkontaktierte leiterplatte.
KR100560708B1 (ko) 납땜방법
Ramli et al. Solderability of Sn-0.7 Cu-0.05 Ni-xZn Solder Ball on Sn-0.7 Cu and Sn-0.7 Cu-0.05 Ni Solder Coating
JPS5411864A (en) Soldering method
TW200711778A (en) Solder alloy, and electronic substrate making use of the solder alloy and process for producing the same
JPH0537134A (ja) 半田付け方法
JP2003273504A (ja) はんだ付け方法
MY150455A (en) Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath
JPH04357899A (ja) 予備半田層付き回路基板の製造方法
Bunning Electroless Nickel--Immersion Gold-Surfaces for High Value Printed Circuit Boards
JP2001313458A (ja) 電極表面処理法
JP2003198118A (ja) 非鉛系接合部材の形成方法及び回路基板
JPS6417494A (en) Surface mounting method of electronic component
JP2004241593A (ja) 電子部品接合補助具、接合用電子部品、電子部品接合中間基板及び電子部品の接合方法

Legal Events

Date Code Title Description
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: NIHON SUPERIOR SHA CO., LTD., SUITA, OSAKA, JP

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP