BR0104486A - Método de controle do teor de cobre em um banho de imersão de solda - Google Patents
Método de controle do teor de cobre em um banho de imersão de soldaInfo
- Publication number
- BR0104486A BR0104486A BR0104486-9A BR0104486A BR0104486A BR 0104486 A BR0104486 A BR 0104486A BR 0104486 A BR0104486 A BR 0104486A BR 0104486 A BR0104486 A BR 0104486A
- Authority
- BR
- Brazil
- Prior art keywords
- copper
- bath
- solder
- density
- replenished
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Coating With Molten Metal (AREA)
Abstract
Patente de Invenção: "MéTODO DE CONTROLE DO TEOR DE COBRE EM UM BANHO DE IMERSãO DE SOLDA". Este método controla a densidade de cobre em um banho de imersão de solda alimentando uma liga de solda fundida contendo pelo menos cobre como um de seus componentes essenciais durante uma etapa de soldagem por imersão de uma chapa de circuito impresso com uma folha metálica com superfície de cobre e uma peça componente tendo cobre e chumbo anexados a ela. O método inclui uma etapa de apresentação de uma solda reabastecida não contendo nenhum cobre ou com um teor de cobre tendo uma densidade menor que aquela da do banho de solda antes do fornecimento da solda reabastecida ao banho de forma que a densidade do cobre no banho seja controlada até uma densidade constante predeterminada ou inferior a ela. A liga de solda fundida no banho contém estanho, cobre, e níquel como seus principais componentes, e a solda reabastecida contém níquel e o restante sendo estranho, por exemplo. Alternativamente, a liga da solda fundida no banho contém estanho, cobre, e prata como seus principais componentes, e a solda reabastecida contém prata e o saldo sendo estanho. A densidade do cobre da solda fundida no banho é controlada para menos de 0,85% em peso a uma temperatura de solda de cerca de 255<198>C.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-047437 | 2000-02-24 | ||
JP2000047437A JP3221670B2 (ja) | 2000-02-24 | 2000-02-24 | ディップはんだ槽の銅濃度制御方法 |
PCT/JP2001/001359 WO2001062433A1 (en) | 2000-02-24 | 2001-02-23 | A control method for copper content in a solder dipping bath |
Publications (2)
Publication Number | Publication Date |
---|---|
BR0104486A true BR0104486A (pt) | 2002-01-08 |
BR0104486B1 BR0104486B1 (pt) | 2012-10-16 |
Family
ID=18569687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0104486-9A BR0104486B1 (pt) | 2000-02-24 | 2001-02-23 | método de controle de teor de cobre em um banho de imersão de solda e solda reabastecida. |
Country Status (17)
Country | Link |
---|---|
US (1) | US6699306B2 (pt) |
EP (1) | EP1189725B1 (pt) |
JP (1) | JP3221670B2 (pt) |
KR (1) | KR100852403B1 (pt) |
CN (1) | CN1187161C (pt) |
AT (1) | ATE359894T1 (pt) |
AU (1) | AU782095B2 (pt) |
BR (1) | BR0104486B1 (pt) |
CA (1) | CA2368384C (pt) |
CZ (1) | CZ301025B6 (pt) |
DE (1) | DE60127911T2 (pt) |
ES (1) | ES2286099T3 (pt) |
MX (1) | MXPA01009644A (pt) |
MY (1) | MY122835A (pt) |
SK (1) | SK286033B6 (pt) |
TW (1) | TW533115B (pt) |
WO (1) | WO2001062433A1 (pt) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3312618B2 (ja) * | 2000-02-03 | 2002-08-12 | 千住金属工業株式会社 | はんだ槽へのはんだの追加供給方法 |
US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
TWI238094B (en) | 2002-01-10 | 2005-08-21 | Senju Metal Industry Co | Soldering method and solder alloy for additional supply |
US20060075758A1 (en) * | 2004-10-07 | 2006-04-13 | Tigerone Development, Llc; | Air-conditioning and heating system utilizing thermo-electric solid state devices |
TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
JP2007080891A (ja) * | 2005-09-12 | 2007-03-29 | Fuji Electric Holdings Co Ltd | はんだ槽中はんだの銅濃度の経時変化の推定方法 |
CN101356293B (zh) * | 2006-01-10 | 2010-12-29 | 伊利诺斯工具制品有限公司 | 低铜溶解的无铅焊料 |
US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
JP4375491B1 (ja) | 2008-06-23 | 2009-12-02 | 日本ジョイント株式会社 | 電子部品のはんだ付け装置およびはんだ付け方法 |
WO2010089905A1 (ja) | 2009-02-09 | 2010-08-12 | 日本ジョイント株式会社 | 電子部品用錫またははんだ合金の製造方法、製造装置、及びはんだ合金 |
DE102010038452A1 (de) * | 2010-07-27 | 2012-02-02 | Robert Bosch Gmbh | Leiterquerschnitt mit Verzinnung |
DE102011077245A1 (de) | 2011-06-09 | 2012-12-13 | Eutect Gmbh | Lothöhenmessung |
DE102011077247A1 (de) | 2011-06-09 | 2012-12-13 | Eutect Gmbh | Verfahren und Vorrichtung zum Auftragen von Lot |
DE102011077242A1 (de) | 2011-06-09 | 2012-12-13 | Robert Bosch Gmbh | Schutzgaszuführung |
WO2014142153A1 (ja) * | 2013-03-13 | 2014-09-18 | 株式会社日本スペリア社 | はんだ接合物及びはんだ接合方法 |
JP7276021B2 (ja) * | 2019-09-06 | 2023-05-18 | オムロン株式会社 | 検出装置、検出方法およびプログラム |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB567286A (en) * | 1941-10-01 | 1945-02-07 | John Louis Coltman | Improvements in or relating to the manufacture of heat exchange devices |
JPS54120255A (en) * | 1978-03-13 | 1979-09-18 | Toshiba Corp | Removing method for impurities of solder |
JPS5711768A (en) * | 1980-06-26 | 1982-01-21 | Brother Ind Ltd | Method for control of solder vessel |
JPS57168767A (en) * | 1981-04-10 | 1982-10-18 | Matsushita Electric Ind Co Ltd | Picking-up method for impurity from solder in solder bath |
JPS57206570A (en) * | 1981-06-10 | 1982-12-17 | Tamura Seisakusho Co Ltd | Dip type soldering device |
JPS58120678A (ja) * | 1982-01-12 | 1983-07-18 | Mitsubishi Rayon Co Ltd | 防汚塗料用組成物 |
JPS60155664A (ja) * | 1984-01-24 | 1985-08-15 | Toshiba Corp | 超音波はんだめつき装置 |
US4634044A (en) * | 1985-10-04 | 1987-01-06 | Westinghouse Electric Corp. | Process for restricted lead content soldering of copper fins to copper alloy tubing with controlled copper contamination of the molten solder reservoir |
JPH0284266A (ja) * | 1988-09-20 | 1990-03-26 | Tamura Seisakusho Co Ltd | はんだ槽におけるはんだ組成管理方法 |
US5169128A (en) * | 1991-09-30 | 1992-12-08 | General Electric Company | Molten solder filter |
US5405577A (en) * | 1993-04-29 | 1995-04-11 | Seelig; Karl F. | Lead-free and bismuth-free tin alloy solder composition |
US5393489A (en) * | 1993-06-16 | 1995-02-28 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
US5863493A (en) * | 1996-12-16 | 1999-01-26 | Ford Motor Company | Lead-free solder compositions |
-
2000
- 2000-02-24 JP JP2000047437A patent/JP3221670B2/ja not_active Ceased
-
2001
- 2001-02-21 TW TW090104096A patent/TW533115B/zh not_active IP Right Cessation
- 2001-02-21 MY MYPI20010754A patent/MY122835A/en unknown
- 2001-02-23 CA CA2368384A patent/CA2368384C/en not_active Expired - Lifetime
- 2001-02-23 US US10/030,882 patent/US6699306B2/en not_active Expired - Lifetime
- 2001-02-23 DE DE60127911T patent/DE60127911T2/de not_active Expired - Lifetime
- 2001-02-23 EP EP01906258A patent/EP1189725B1/en not_active Revoked
- 2001-02-23 BR BRPI0104486-9A patent/BR0104486B1/pt not_active IP Right Cessation
- 2001-02-23 CZ CZ20013830A patent/CZ301025B6/cs not_active IP Right Cessation
- 2001-02-23 ES ES01906258T patent/ES2286099T3/es not_active Expired - Lifetime
- 2001-02-23 KR KR1020017013516A patent/KR100852403B1/ko active IP Right Grant
- 2001-02-23 MX MXPA01009644A patent/MXPA01009644A/es active IP Right Grant
- 2001-02-23 WO PCT/JP2001/001359 patent/WO2001062433A1/en active IP Right Grant
- 2001-02-23 SK SK1515-2001A patent/SK286033B6/sk not_active IP Right Cessation
- 2001-02-23 AT AT01906258T patent/ATE359894T1/de not_active IP Right Cessation
- 2001-02-23 AU AU34155/01A patent/AU782095B2/en not_active Expired
- 2001-02-23 CN CNB018002722A patent/CN1187161C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6699306B2 (en) | 2004-03-02 |
EP1189725A1 (en) | 2002-03-27 |
EP1189725B1 (en) | 2007-04-18 |
CA2368384A1 (en) | 2001-08-30 |
KR20020007384A (ko) | 2002-01-26 |
CN1362904A (zh) | 2002-08-07 |
MY122835A (en) | 2006-05-31 |
AU3415501A (en) | 2001-09-03 |
DE60127911D1 (de) | 2007-05-31 |
ATE359894T1 (de) | 2007-05-15 |
SK15152001A3 (sk) | 2002-02-05 |
JP2001237536A (ja) | 2001-08-31 |
ES2286099T3 (es) | 2007-12-01 |
TW533115B (en) | 2003-05-21 |
BR0104486B1 (pt) | 2012-10-16 |
CA2368384C (en) | 2011-04-05 |
MXPA01009644A (es) | 2002-08-12 |
CZ20013830A3 (cs) | 2002-05-15 |
US20020134200A1 (en) | 2002-09-26 |
DE60127911T2 (de) | 2007-08-30 |
JP3221670B2 (ja) | 2001-10-22 |
WO2001062433A1 (en) | 2001-08-30 |
AU782095B2 (en) | 2005-06-30 |
KR100852403B1 (ko) | 2008-08-14 |
CN1187161C (zh) | 2005-02-02 |
CZ301025B6 (cs) | 2009-10-14 |
SK286033B6 (sk) | 2008-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B25D | Requested change of name of applicant approved |
Owner name: NIHON SUPERIOR SHA CO., LTD. (JP) , PANASONIC CORP Free format text: ALTERADO DE: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
|
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 16/10/2012, OBSERVADAS AS CONDICOES LEGAIS. |
|
B21A | Patent or certificate of addition expired [chapter 21.1 patent gazette] |
Free format text: PATENTE EXTINTA EM 16/10/2022 |