JPS57206570A - Dip type soldering device - Google Patents

Dip type soldering device

Info

Publication number
JPS57206570A
JPS57206570A JP8914181A JP8914181A JPS57206570A JP S57206570 A JPS57206570 A JP S57206570A JP 8914181 A JP8914181 A JP 8914181A JP 8914181 A JP8914181 A JP 8914181A JP S57206570 A JPS57206570 A JP S57206570A
Authority
JP
Japan
Prior art keywords
liquid
solder
pump
casing
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8914181A
Other languages
Japanese (ja)
Inventor
Hideaki Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP8914181A priority Critical patent/JPS57206570A/en
Publication of JPS57206570A publication Critical patent/JPS57206570A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To agitate solder liquid to the extent of not waving its surface parts and to prevent the deterioration of said liquid by providing a pump in a solder tank, sucking the solder liquid near the bottom part and discharing the same from the surface parts. CONSTITUTION:When a motor 19 is run, the vane wheel 17 of a pump 15 rotates, and the solder liquid 13 near the bottom part in a solder tank 11 is sucked through the bottom opening of a casing 16. This liquid is discharged through a discharged port formed horizontally in the upper part of the casing 16. Gentle flow is generated from the side provided with the pump 15 toward the other side in the surface parts of the solder liquid 13. At this time, if the discharged pressure of the pump 15 is set at about the extent that the surface of the liquid 13 is not waved, this flow abuts on the inside wall on the other side of the tank 11 and descends. Again it returns to the bottom opening part of the casing 16 and is sucked therethrough. Therefore, the entire part of the liquid 13 is agitated gently, and the concentration of impurities such as copper contents on the surface of the solder liquid 13 is prevented.
JP8914181A 1981-06-10 1981-06-10 Dip type soldering device Pending JPS57206570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8914181A JPS57206570A (en) 1981-06-10 1981-06-10 Dip type soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8914181A JPS57206570A (en) 1981-06-10 1981-06-10 Dip type soldering device

Publications (1)

Publication Number Publication Date
JPS57206570A true JPS57206570A (en) 1982-12-17

Family

ID=13962588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8914181A Pending JPS57206570A (en) 1981-06-10 1981-06-10 Dip type soldering device

Country Status (1)

Country Link
JP (1) JPS57206570A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59178172A (en) * 1983-03-28 1984-10-09 Seihachi Takahashi Solder melting tank
CZ301025B6 (en) * 2000-02-24 2009-10-14 Nihon Superior Sha Co., Ltd. Method of controlling copper concentration in a soldering dipping bath and its use
CN103008813A (en) * 2012-12-04 2013-04-03 郑州机械研究所 Dip brazing method with a preset temperature gradient and special brazing furnace
JP2020072226A (en) * 2018-11-02 2020-05-07 富士ゼロックス株式会社 Soldering apparatus and method of manufacturing substrate device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59178172A (en) * 1983-03-28 1984-10-09 Seihachi Takahashi Solder melting tank
CZ301025B6 (en) * 2000-02-24 2009-10-14 Nihon Superior Sha Co., Ltd. Method of controlling copper concentration in a soldering dipping bath and its use
CN103008813A (en) * 2012-12-04 2013-04-03 郑州机械研究所 Dip brazing method with a preset temperature gradient and special brazing furnace
JP2020072226A (en) * 2018-11-02 2020-05-07 富士ゼロックス株式会社 Soldering apparatus and method of manufacturing substrate device

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