JP2020072226A - Soldering apparatus and method of manufacturing substrate device - Google Patents

Abstract

To provide a soldering apparatus and a method of manufacturing a substrate device, capable of suppressing soldering defects from occurring as compared with the case where the rotational speed of a rotating body that rotates to jet solder is always constant.SOLUTION: A controller allows, before a component having been mounted on a substrate is soldered, a detector to detect each of solder heights when the rotational speed of a rotating body is set to a plurality of numbers, derives a relationship between the rotational speed and the heights, and controls the rotating body based on the relationship.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a soldering device and a method for manufacturing a board device.

  The attachment mounted on the tip of the nozzle body for ejecting solder described in Patent Document 1 constitutes an outer edge surface of a discharge port, and an upper inclined surface that inclines radially outward toward the base end side. The lower sloped surface constitutes a peripheral surface connecting from the outer edge of the upper sloped surface to the base end side, and slopes radially inward toward the base end side.

JP, 2005-164568, A

  2. Description of the Related Art Conventionally, there is a soldering device that jets solder upward and solders the components mounted on the substrate to the substrate by the jetted solder. In this soldering device, the rotation speed of the rotating body for jetting the solder upward is set to a predetermined value before the soldering device is operated so that the height of the jet flow of the solder is maintained at a target value. Is set to.

  However, the height of the jet of solder changes depending on the amount of solder stored in the solder storage tank, the amount of oxidized solder contained in the solder stored in the storage tank, and the like. For this reason, if the number of rotations of the rotating body that rotates to jet the solder is always set to a constant value, when soldering the components mounted on the board to the board, the solder jet height may change. , Soldering failure occurs. Specifically, when the amount of soldering is small, the bonding strength is insufficient, and when the amount of soldering is large, a bridge is formed in which adjacent leads are electrically connected via the solder.

  An object of the present invention is to suppress the occurrence of defective soldering, as compared with the case where the number of rotations of a rotating body that rotates for jetting solder is always constant.

  The soldering apparatus according to the first aspect of the present invention includes a rotating body that jets solder from a nozzle, a detection unit that detects the height of the solder jetted from the nozzle, and before soldering components mounted on a board. The detection unit detects each of the heights when the number of rotations of the rotating body is set to a plurality of values, derives the relationship between the number of rotations and the height, and based on the relationship, the rotation And a control unit for controlling the body.

  A soldering apparatus according to a second aspect of the present invention is the soldering apparatus according to the first aspect, wherein the control unit sets the rotation speed of the rotating body to one value and another value, respectively. Is detected by the detection unit, and a relational expression between the rotation speed and the height is derived.

  A soldering apparatus according to a third aspect of the present invention is the soldering apparatus according to the second aspect, which includes a drive unit that rotates a rotating body, and the one value is such that the control unit controls the drive unit. Is the rotational speed at which the rotating body rotates with the minimum driving force output by the drive unit, and the other value is the maximum value output by the drive unit when the control unit controls the drive unit. It is characterized in that it is a rotational speed at which the rotating body is rotated by a driving force.

  A soldering apparatus according to a fourth aspect of the present invention is the soldering apparatus according to any one of the first to third aspects, wherein the substrate has a plurality of types of the components mounted thereon, The control unit controls the rotating body for each of the parts to change the height.

  A soldering apparatus according to a fifth aspect of the present invention is the soldering apparatus according to any one of the first to fourth aspects, in which the control unit controls the rotating body for each predetermined operating time. It is characterized in that the respective heights when the rotation speed is set to a plurality of values are detected by the detection unit, and the relationship between the rotation speed and the height is derived.

  A soldering apparatus according to a sixth aspect of the present invention is the soldering apparatus according to any one of the first to fourth aspects, wherein the controller is manufactured by soldering a component to a board. Each time the type of substrate device changes, the detection unit detects the respective heights when the rotation speed of the rotating body is set to a plurality of values, and the relationship between the rotation speed and the height is derived. Is characterized by.

  A soldering apparatus according to a seventh aspect of the present invention is the soldering apparatus according to the fifth or sixth aspect, which includes a storage tank in which solder is stored, and the control unit controls the rotation speed and the height. Before deriving the relationship again, the control unit is characterized in that the solder stored in the storage tank is agitated by the rotating body.

  A method for manufacturing a board device according to an eighth aspect of the present invention is characterized in that the board device in which components are soldered to a board is manufactured by the soldering device according to any one of claims 1 to 7. To do.

  According to the soldering apparatus of the first aspect of the present invention, it is possible to suppress the occurrence of defective soldering, as compared with the case where the rotation speed of the rotating body that rotates to jet the solder is always constant.

  According to the soldering apparatus of the second aspect of the present invention, as compared with the case where the relational expression is derived from the height of each solder when the number of rotations of the rotating body is set to 3 or more, The relationship between the rotation speed and the height of the jetted solder can be easily derived.

  According to the soldering apparatus of the third aspect of the present invention, as compared with the case where the relational expression is derived from the respective rotation speeds of the rotating body rotated by the binary driving forces having different medium levels in the drive unit, Occurrence of defective attachment can be suppressed.

  According to the soldering apparatus of the fourth aspect of the present invention, when mounting a plurality of types of components on a substrate, the occurrence of soldering failure is suppressed as compared with the case where the height of the jetted solder is constant. be able to.

  According to the soldering apparatus of the fifth aspect of the present invention, during the operation of the soldering apparatus, the occurrence of soldering failure is more likely to occur as compared with the case where the rotating body is controlled based on the relationship initially derived. Can be suppressed.

  According to the soldering apparatus of the sixth aspect of the present invention, even if the type of the board apparatus is changed, the occurrence of soldering failure is suppressed as compared with the case where the rotating body is controlled based on the relationship first derived. can do.

  According to the soldering apparatus of the seventh aspect of the present invention, the occurrence of defective soldering is suppressed as compared with the case where the relationship between the rotational speed of the rotating body and the height of the solder is derived again without stirring the solder. can do.

  According to the manufacturing method of the board | substrate apparatus of the 8th aspect of this invention, compared with the case where the rotation speed of the rotating body for jetting solder is always constant, generation | occurrence | production of a soldering defect can be suppressed.

It is the whole block diagram showing the soldering device concerning a 1st embodiment of the present invention. It is the whole block diagram showing the soldering device concerning a 1st embodiment of the present invention. It is the perspective view which showed the conveyance part with which the soldering apparatus which concerns on 1st Embodiment of this invention was equipped. (A) (B) It is the side view which showed the height sensor and nozzle with which the soldering apparatus which concerns on 1st Embodiment of this invention was equipped. (A) (B) It is the side view which showed the height sensor and nozzle with which the soldering apparatus which concerns on 1st Embodiment of this invention was equipped. It is the perspective view which showed the nozzle with which the soldering apparatus which concerns on 1st Embodiment of this invention was equipped. It is the block diagram which showed the control system of the control part with which the soldering apparatus which concerns on 1st Embodiment of this invention was equipped. (A) (B) It is the front view which showed the conveyance part and nozzle with which the soldering apparatus which concerns on 1st Embodiment of this invention was equipped. 3 is a diagram illustrating a graph derived by a control unit included in the soldering device according to the first exemplary embodiment of the present invention. FIG. 3 is a flow chart showing a control flow of each unit by a control unit provided in the soldering device according to the first exemplary embodiment of the present invention. FIG. 3 is a flow chart showing a control flow of each unit by a control unit provided in the soldering device according to the first exemplary embodiment of the present invention. (A) and (B) are an exploded perspective view and a perspective view showing an electronic component and a board to be soldered by the soldering apparatus according to the first embodiment of the present invention. (A) (B) It is a perspective view showing an electronic component and a board soldered by a soldering device concerning a 1st embodiment and a comparative form of the present invention. (A) (B) It is a perspective view showing an electronic component and a board soldered by a soldering device concerning a 1st embodiment and a comparative form of the present invention. It is the block diagram which showed the control system of the control part with which the soldering apparatus which concerns on 2nd Embodiment of this invention was equipped. It is a flow figure showing a control flow of each part by a control part with which a soldering device concerning a 2nd embodiment of the present invention was equipped. It is a flow figure showing a control flow of each part by a control part with which a soldering device concerning a 2nd embodiment of the present invention was equipped. It is a flow figure showing a control flow of each part by a control part with which a soldering device concerning a 2nd embodiment of the present invention was equipped. 9A and 9B are an exploded perspective view and a perspective view showing an electronic component and a board to be soldered by a soldering device according to a second embodiment of the present invention. 9A and 9B are an exploded perspective view and a perspective view showing an electronic component and a board to be soldered by a soldering device according to a second embodiment of the present invention. 6 is a diagram showing a graph derived by a control unit provided in a soldering device according to a modification of the present invention.

<First Embodiment>
An example of a method for manufacturing a soldering device and a board device according to the first embodiment of the present invention will be described with reference to FIGS. An arrow H shown in the drawing indicates the vertical direction of the apparatus (vertical direction), an arrow W indicates the width direction of the apparatus (horizontal direction), and an arrow D indicates the depth direction of the apparatus (horizontal direction).

(overall structure)
The soldering device 10 is a point flow soldering type soldering device. As shown in FIGS. 1 and 2, the soldering device 10 melts toward the substrate 210 in order to solder the electronic components 220 and 230 to the substrate 210. The apparatus main body 12 for jetting the solder J is provided. Furthermore, the soldering apparatus 10 includes a height sensor 14 (see FIG. 4) that detects (detects) the height of the jetted solder, a transfer unit 16 that transfers the substrate 210, and a control unit 18 that controls each unit. I have it.

[Device body 12]
As shown in FIGS. 1 and 2, the apparatus body 12 includes a storage tank 22 in which the molten solder J is stored, a moving section 24 for moving the storage tank 22 in the device width direction and the device depth direction, and a storage tank. 22 and a protruding portion 26 protruding upward. Further, the apparatus body 12 includes a nozzle 30 provided at the tip of the protrusion 26, an impeller 32 that rotates to jet the molten solder J from the nozzle 30, and a motor 34 that generates a driving force to rotate the impeller 32. A rotation speed sensor 40 for detecting the rotation speed of the impeller 32 is provided. The apparatus body 12 also includes a transmission portion 36 that transmits the driving force of the motor 34 to the impeller 32, and a jet solder bath 38 that is connected to the base end of the protruding portion 26 and in which the impeller 32 is arranged. There is. The impeller 32 is an example of a rotating body, and the motor 34 is an example of a drive unit.

-Reservoir 22, moving part 24-
As shown in FIG. 1, the storage tank 22 has a rectangular parallelepiped shape with a hollow inside, and the molten solder J is stored inside the storage tank 22. Further, a through hole 52 through which the protruding portion 26 passes is formed in a portion on one side (right side in the drawing) in the width direction of the top plate 50 forming the storage tank 22, and an edge portion 52 a of the through hole 52 is formed. A gap 54 is provided between the outer peripheral surface of the protrusion 26 and the outer peripheral surface of the protrusion 26.

  Further, a through hole 58 through which an impeller shaft 32a of the impeller 32, which will be described later, passes is formed in a portion on the other side (left side in the drawing) in the width direction of the top plate 50, and an edge portion 58a of the through hole 58 is formed. A gap is formed between the outer peripheral surface of the impeller shaft 32a.

  The moving unit 24 is arranged below the storage tank 22. The moving unit 24 includes known mechanical elements such as a ball screw and a belt, and moves the storage tank 22 in the device vertical direction, the device width direction, and the device depth direction.

-Projection portion 26, nozzle 30-
As shown in FIG. 1, the projecting portion 26 passes through a through hole 52 formed in the top plate 50 of the storage tank 22. The protruding portion 26 has a tubular shape extending in the vertical direction. The inner diameter of the protrusion 26 is the same in the vertical direction. Further, the outer diameter of the upper portion of the protruding portion 26 is smaller than the outer diameter of the lower portion.

  As shown in FIGS. 1 and 6, the nozzle 30 is formed of an upper inclined portion 62 and a lower inclined portion 64 connected to the lower end of the upper inclined portion 62, and protrudes with respect to the upper end of the protruding portion 26. The portion 26 projects outward in the radial direction.

  The upper sloping portion 62 has an annular cross section and is inclined outward in the radial direction as it goes downward. A circular discharge port 62a is formed at the upper end of the upper inclined portion 62 when viewed from above.

The lower inclined portion 64 has an annular cross section, and is inclined inward in the radial direction as it goes downward. Further, the lower end of the lower inclined portion 64 is connected to the upper end of the protruding portion 26.
The inner diameter of the nozzle 30 may be the same as the inner diameter of the protrusion 26 in the vertical direction.

-Jet solder bath 38, impeller 32, rotation speed sensor 40-
As shown in FIG. 1, the jet solder bath 38 is arranged inside the storage bath 22 (fixed using a fixture (not shown)), and from the portion on the one side in the width direction inside the storage bath 22. It extends to the part on the other side. Further, the interior of the jet solder bath 38 is hollow, and an inflating portion 66 that bulges downward is formed at a portion on the other side in the width direction of the jet solder bath 38. In addition, a through hole 68a penetrating the front and back is formed in the bottom plate 68 that constitutes the inflatable portion 66.

  Further, the lower end of the projecting portion 26 is connected to a portion on one side in the width direction of the top plate 70 that constitutes the jet solder bath 38, and a penetration that connects the inside of the jet solder bath 38 and the inside of the projecting portion 26. The hole 70a is formed. Further, a through hole 70b through which the impeller shaft 32a of the impeller 32 passes is formed in a portion on the other side in the width direction of the top plate 70, and the peripheral edge of the through hole 70b and the outer peripheral surface of the impeller shaft 32a are It is sealed with a sealing material (not shown).

  As shown in FIG. 1, the impeller 32 has an impeller shaft 32 a and an impeller blade 32 b connected to the lower end of the impeller shaft 32 a and arranged inside the storage tank 22.

  The impeller blade 32b is arranged in the expansion portion 66 of the jet solder bath 38, and faces the through hole 68a in the vertical direction. Furthermore, the impeller shaft 32 a passes through the through hole 70 b of the jet solder bath 38 and the through hole 58 of the storage bath 22, and the upper end of the impeller shaft 32 a projects upward from the top plate 50 of the storage bath 22. ..

  As shown in FIG. 1, the rotation speed sensor 40 is arranged so as to face the outer peripheral surface of the impeller shaft 32a in the radial direction of the impeller shaft 32a, and is a non-contact rotation of the impeller 32 per unit time. It is designed to detect the number.

  In this configuration, the molten solder J is stored inside the storage tank 22 as described above. The inside of the jet solder bath 38 arranged inside the storage bath 22 is connected to the inside of the storage bath 22 through a through hole 68 a formed in the jet solder bath 38. Therefore, the molten solder J is also stored inside the jet solder bath 38.

  Then, by rotating the impeller 32, the rotating impeller 32 sucks the molten solder J into the jet solder bath 38 through the through hole 68a. The molten solder J sucked into the jet solder bath 38 flows inside the protruding portion 26 and jets from the discharge port 62a of the nozzle 30 (see FIG. 2). Further, the molten solder J jetted from the nozzle 30 flows along the outer peripheral surfaces of the nozzle 30 and the protrusion 26, and returns to the storage tank 22 through the gap 54 (see the arrow in FIG. 2). As described above, the molten solder J flows and circulates in the storage tank 22, the jet solder tank 38, the inside of the protruding portion 26, the nozzle 30, the outside of the protruding portion 26, and the gap 54.

  Further, when the moving unit 24 moves the storage tank 22, the protrusions 26, the nozzles 30 and the like move (together) similarly to the storage tank 22.

-Motor 34, Transmission Unit 36-
As shown in FIG. 1, the motor 34 is a stepping motor, has a rotating shaft 34 a, and is arranged outside the storage tank 22 so as to be aligned with the upper end side portion of the impeller shaft 32 a in the width direction. There is.

  The transmission unit 36 includes a pulley 74 attached to the rotating shaft 34a of the motor 34, a pulley 76 attached to the upper end of the impeller shaft 32a, and an endless endless member wound around the pulley 74 and the pulley 76. And a belt 78.

  In this configuration, the motor 34 rotates the impeller 32 via the transmission section 36.

[Height sensor 14]
The height sensor 14 is an optical sensor, and as shown in FIGS. 4A and 4B, the height sensor 14 sandwiches the ejection port 62a of the nozzle 30 in the depth direction and is arranged on the front side in the depth direction. It has a light emitting portion 14a and a light receiving portion 14b arranged on the back side in the depth direction. The light emitting unit 14a emits thick light in the vertical direction in the depth direction, and the light receiving unit 14b receives the light. The height sensor 14 is an example of a detection unit.

  In this configuration, the height sensor 14 detects the height (hereinafter, “jet height”) of the molten solder J ejected upward from the ejection port 62a of the nozzle 30 from the ejection port 62a. Specifically, when the jet height is low (see FIG. 4A), the amount of light emitted by the light emitting unit 14a is reduced and the amount of light received by the light receiving unit 14b is increased. When the jet height is high (see FIG. 4B), the amount of light emitted by the light emitting unit 14a is blocked and the amount of light received by the light receiving unit 14b is reduced. In this way, the height sensor 14 detects the jet height by the amount of light blocked.

[Conveyor 16]
As shown in FIGS. 1 and 3, the transport unit 16 is arranged above the apparatus main body 12. The transport unit 16 includes a driven roll 82 whose axial direction faces the depth direction, a drive roll 84 whose axial direction faces the depth direction, and a pair of endless transport belts wound around the driven roll 82 and the drive roll 84. And 86. The driven roll 82 and the drive roll 84 are respectively arranged on two frame members (not shown) extending in the width direction so as to be rotatable about their axes.

  As described above, the pair of conveyor belts 86 are wound around the driven roll 82 and the drive roll 84. The pair of conveyor belts 86 are separated from each other in the depth direction, and are arranged so as to sandwich the nozzle 30 in the depth direction when viewed from above. A portion of the conveyor belt 86 that extends in the width direction and is closer to the apparatus main body 12 (hereinafter, “transfer portion 86a”) is located above the nozzle 30 when viewed from the depth direction.

  In this configuration, the drive roll 84 rotates to rotate the pair of conveyor belts 86. The transfer portion 86a of the pair of conveyor belts 86 is configured to move from one side in the width direction to the other side.

[Control unit 18]
As shown in FIG. 7, the control unit 18 receives the detection signals from the height sensor 14 and the rotation speed sensor 40. Further, the control unit 18 controls the operation of the motor 34, the drive roll 84, and the moving unit 24. The control unit 18 also includes a central processing unit (CPU) (not shown), a ROM (Read Only Memory), and a RAM (Random Access Memory). Further, the control unit 18 has a counter (not shown) that counts the number of board devices manufactured by the soldering apparatus 10, and a timer (not shown) that measures the operating time after the power of the soldering apparatus 10 is turned on. I have it.

  The control of each unit by the control unit 18 will be described together with the operation described later.

[Other]
Next, the electronic component 220 (hereinafter “component 220”), the electronic component 230 (hereinafter “component 230”), and the substrate 210 that are soldered by the soldering device 10 will be described with reference to FIGS. ..

  As shown in FIGS. 12 (A) and 12 (B), the substrate 210 has a rectangular plate shape with its plate surface facing in the vertical direction and extending in the depth direction when viewed from above. The portions of the substrate 210 on both ends in the longitudinal direction are mounted on the pair of conveyor belts 86 (see FIG. 3), respectively.

  Further, four through holes 210a are formed in a portion of the substrate 210 on the front side in the depth direction. The four through holes 210a are respectively arranged at the positions of the vertices of a square shape when viewed from above. The through hole 210a has a hole diameter of d1, and the through hole 210a has a width-direction pitch and a depth-direction pitch of P1.

  Further, six through holes 210b are formed in a portion on the back side of the substrate 210 in the depth direction. When viewed from above, three through holes 210b are arranged in a row in the depth direction, and two rows of the through holes 210b are provided spaced apart in the width direction. The hole diameter of the through hole 210b is d2, which is smaller than the hole diameter d1 of the through hole 210a. The pitch in the width direction and the pitch in the depth direction of the through holes 210b are P2, which are shorter than the pitch P1 of the through holes 210a.

  The component 220 has four leads 220a that are inserted into the through holes 210a. The outer diameter of the lead 220a is d3, and the pitch of each lead 220a is P1. With the component 220 mounted on the substrate 210, the tips of the leads 220a project from the back surface of the substrate 210 by about 2 mm. It should be noted that in the present embodiment, “mounting” refers to a state in which the component is located on the board but the component is not soldered to the board.

  The component 230 has six leads 230a that are inserted into the through holes 210b. The outer diameter of the lead 230a is d4, which is smaller than the outer diameter d3 of the lead 220a. Further, the pitch of each lead 230a is P2. Further, in the state where the component 230 is mounted on the substrate 210, the tips of the leads 230a are projected from the back surface of the substrate 210 by about 2 mm.

  In this configuration, the substrate 210 placed on the transfer portion 86a of the pair of conveyor belts 86 shown in FIG. 3 so as to straddle the pair of conveyor belts 86 is rotated from one side in the width direction by the conveyor belts 86 being rotated. It is designed to move to the other side.

(Action)
Next, a method of manufacturing a board device in which the components 220 and 230 are soldered to the board 210 using the soldering apparatus 10 will be described with reference to the flowcharts shown in FIGS. 10 and 11. .. In the soldering apparatus 10, a detailed description will be given later, but a relational expression between the rotation speed of the impeller 32 and the jet height is derived before soldering and at each predetermined operating time. ..

  When the soldering device 10 is not in operation, a prescribed amount of molten solder J is stored inside the storage tank 22, as shown in FIG. 1. Further, oxidized solder (hereinafter referred to as “oxidized solder”) is removed from the molten solder J stored inside the storage tank 22.

  Further, in the apparatus main body 12 of the soldering device 10, when the substrate 210 is disposed above the nozzle 30, the nozzle 30 is disposed so as to face the front side portion of the substrate 210 in the depth direction ( The initial position of the device body 12).

  Further, in the ROM of the control unit 18 of the soldering apparatus 10, the target value of the jet height when the component 220 is soldered to the substrate 210 and the target jet height when the component 230 is soldered to the substrate 210. The value is stored in advance. Further, in the ROM of the control unit 18, a relational expression between the rotational speed of the impeller 32 and the driving force of the motor 34 in a state where a predetermined amount of the melted solder J is stored and the oxidized solder is removed is stored in advance. There is.

  As described above, the outer diameter d3 of the lead 220a of the component 220 is larger than the outer diameter d4 of the lead 230a of the component 230. Further, the pitch P1 of the leads 220a is wider than the pitch P2 of the leads 230a. Therefore, from the viewpoint of ensuring the joint strength of soldering and suppressing the occurrence of a bridge in which adjacent leads are connected via the solder J, the jet height when soldering the component 220 to the substrate 210 Is higher than the target value of the jet height when the component 230 is soldered to the substrate 210.

  Specifically, when the jet height of the molten solder J is the target value of the component 220, the solder J is sufficiently attached to the leads 220a and the through holes 210a, as shown in FIG. 13 (A). On the other hand, when the jet height of the molten solder J is lower than the target value, the solder J adheres only to a part of the lead 220a and the through hole 210a, as shown in FIG. 13B. Thus, when the solder J adheres only to a part of the lead 220a and the through hole 210a, the joint strength of soldering is insufficient, and not only the component 220 is easily removed from the substrate 210 (the mechanical strength is insufficient). ), Contact failure (electrical conduction failure) will occur.

  Further, when the jet height of the molten solder J is the target value of the component 230, the solder J is sufficiently attached to the leads 230a and the through holes 210b as shown in FIG. 14 (A). On the other hand, when the jet height of the molten solder J is higher than the target value, as shown in FIG. 14B, the adjacent lead 230a and the through hole 210b are electrically connected via the solder J. Connected (bridging occurs). Although FIG. 14B shows the case where the bridge occurs in the device width direction, the bridge often occurs in the device depth direction when the nozzle 30 moves in the device depth direction. In other words, when the nozzle 30 moves in the depth direction of the apparatus and the jet height of the molten solder J is higher than the target value, the leads 230a arranged in the depth direction of the apparatus are electrically connected via the solder J. As a result, a bridge may occur.

  Further, in the transfer portion 86a of the pair of conveyor belts 86, a plurality of substrates 210 on which the components 220 and 230 are mounted are placed at predetermined positions on one side in the width direction with respect to the nozzle 30. ing. Specifically, the substrate 210 is placed on the pair of conveyor belts 86 so as to extend in the depth direction, and the component 220 is arranged on the front side in the depth direction with respect to the component 230.

  First, when the soldering apparatus 10 is operated, the control unit 18 controls the motor 34 to operate the impeller 32 with the minimum driving force (rotation speed) output by the motor 34 in step S100 shown in FIG. By rotating the nozzle 30, the molten solder J is jetted from the nozzle 30 (see FIG. 4A).

  Then, the rotation speed sensor 40 detects the rotation speed of the impeller 32 that is rotating by the minimum driving force of the motor 34 (hereinafter referred to as “minimum rotation speed”). Further, the height sensor 14 detects the jet height of the molten solder J jetted from the nozzle 30 by the impeller 32 rotating by the minimum driving force of the motor 34. When the height sensor 14 detects the jet height, the process proceeds to step S200. Here, the minimum driving force of the motor 34 (minimum driving force output by the motor 34) is the driving force when the solder J jets from the nozzle 30 at the minimum height that can be detected by the height sensor 14. is there.

  In step S200, the control unit 18 controls the motor 34 to rotate the impeller 32 by the maximum driving force output by the motor 34 to jet the molten solder J from the nozzle 30 (FIG. 4 (B)). reference). Here, the maximum driving force of the motor 34 (the maximum driving force output by the motor 34) is the driving force when the solder J jets from the nozzle 30 at the maximum height that can be detected by the height sensor 14. is there.

  Then, the rotation speed sensor 40 detects the rotation speed of the impeller 32 that is rotating by the maximum driving force of the motor 34 (hereinafter referred to as “maximum rotation speed”). Further, the height sensor 14 detects the jet height of the molten solder J jetted from the nozzle 30 by the impeller 32 rotating by the maximum driving force of the motor 34. When the height sensor 14 detects the jet height, the process proceeds to step S300.

  In step S300, the control unit 18 determines the rotation speed and the jet height of the impeller 32 from the minimum rotation speed of the impeller 32, the jet height at this time, the maximum rotation speed of the impeller 32, and the jet height at this time. Derive the relational expression. In other words, the control unit 18 derives the relational expression between the driving force of the motor 34 and the jet height.

  Specifically, as shown in the graph of FIG. 9, the control unit 18 derives the relational expression with the relation between the rotation speed of the impeller 32 and the jet height being proportional. When the control unit 18 derives the relational expression, the process proceeds to step S400.

  In step S400 of FIG. 11, the control unit 18 solders the component 220 to the substrate 210 based on the relational expression derived in step S300 and the target value of the jet height read from the ROM of the control unit 18 into the RAM. In this case, the rotation speed of the impeller 32 and the rotation speed of the impeller 32 when the component 230 is soldered to the substrate 210 are derived.

  Further, the control unit 18 derives the driving force of the motor 34 for rotating the impeller 32 at this rotation speed from the rotation speed of the impeller 32 when soldering the component 220 to the substrate 210. Further, the control unit 18 derives the driving force of the motor 34 for rotating the impeller 32 at this rotation speed from the rotation speed of the impeller 32 when soldering the component 230 to the substrate 210. When the control unit 18 derives the driving force of the motor 34, the process proceeds to step S500.

  In step S500, the control unit 18 operates the drive roll 84 of the transport unit 16 to rotate the pair of transport belts 86. Then, the one substrate 210 placed on the transfer portion 86a of the conveyor belt 86 is opposed to the nozzle 30 in the vertical direction (see FIG. 8A). In this state, the nozzle 30 of the apparatus main body 12 arranged at the initial position faces the front side portion of the substrate 210 in the depth direction (see FIG. 5A). When the first substrate 210 faces the nozzle 30, the process proceeds to step S600.

  In step S600, the controller 18 operates (drives) the motor 34 to jet the molten solder J from the nozzle 30. Further, the control unit 18 operates (drives) the moving unit 24 to move the nozzle 30 from the front side to the back side in the depth direction.

  Specifically, the control unit 18 rotates the impeller 32 at the rotation speed when the component 220 is soldered to the substrate 210, and jets the molten solder J from the nozzle 30 as shown in FIG. 5 (A). .. Further, the control unit 18 moves the nozzle 30 from the front side (initial position) in the depth direction to the back side (see arrow in the figure). Then, the control unit 18 moves the nozzle 30 so that the nozzle 30 passes below the component 220. In other words, the control unit 18 rotates the impeller 32 at the number of rotations when the component 220 is soldered to the substrate 210, and controls the nozzle 30 so as to move the nozzle 30 to one end side of the lead 220a of the component 220 (the left side of the paper surface of FIG. 5A). (The position of the chain double-dashed line in FIG. 5)) to the other end of the lead 220a (the position of the chain double-dashed line on the right side of the paper surface of FIG. 5A).

When the nozzle 30 passes below the component 220, the control unit 18 rotates the impeller 32 at the number of rotations when soldering the component 230 to the substrate 210, and as shown in FIG. The molten solder J is jetted from 30. Further, the control unit 18 moves the nozzle 30 from the front side to the back side in the depth direction (see arrow in the figure). Then, the control unit 18 moves the nozzle 30 so that the nozzle 30 passes below the component 230. In other words, the control unit 18 rotates the impeller 32 at the number of rotations when the component 230 is soldered to the board 210, and controls the nozzle 30 so as to move the nozzle 30 to one end side of the lead 230a of the component 230 (the left side of the paper in FIG. (The position of the chain double-dashed line) of the lead 230a to the other end side (the position of the chain double-dashed line on the right side of the paper surface of FIG. 5B).
In addition, in FIG. 5, the component 220 and the component 230 are illustrated at positions close to each other, but both components have the molten solder J depending on the rotation speed of the impeller 32 changed for the control unit 18 to solder one component. It is desirable that the jets of (1) are sufficiently separated so as not to hit the other part.

  When the nozzle 30 passes below the component 230, the control unit 18 controls the motor 34 to delay the rotation of the impeller 32. Further, the control unit 18 operates the moving unit 24 to move the apparatus body 12 from the upper side to the lower side in the vertical direction (separate the nozzle 30 and the substrate 210), and move from the rear side to the front side in the depth direction. Then, the apparatus main body 12 is returned to the initial position by moving it from the lower side to the upper side in the vertical direction. Then, a counter (not shown) of the control unit 18 counts the board device 240 manufactured by soldering the components 220 and 230 to the board 210 as “+1”. When the number of manufactured substrate devices 240 is counted, the process proceeds to step S700.

  In step S700, the control unit 18 determines whether or not the number of manufactured substrate devices 240 (the number counted by the counter) has reached a predetermined number. If the number of substrate devices 240 has reached a predetermined number, a series of operations ends. On the other hand, when the number of substrate devices 240 has not reached the predetermined number, the process proceeds to step S800.

  In step S800, the control unit 18 determines whether or not the time the soldering apparatus 10 has been operated has reached a predetermined operation time in step S300.

  If the operating time of the soldering device 10 has not reached the predetermined operating time, the process proceeds to step S500 and the above-described process is executed again. On the other hand, when the operating time of the soldering device 10 has reached the predetermined operating time, the process proceeds to step S900.

  In step S900, the control unit 18 operates the drive roll 84 of the transport unit 16 to rotate the pair of transport belts 86. Then, the substrate 210 placed on the transfer portion 86a of the conveyor belt 86 is moved to a position that does not face the nozzle 30 in the vertical direction (see FIG. 8B). When the substrate 210 moves, the process proceeds to step S950.

  In step S950, the control unit 18 operates the motor 34 to rotate the impeller 32 for a predetermined time and stir the molten solder J. Specifically, the impeller 32 is rotated at a rotation speed such that the molten solder J is not jetted from the nozzle 30 to stir the molten solder J. When the molten solder J is stirred, the process proceeds to step S100 and the above-described process is performed again.

(Summary)
As described above, in the soldering apparatus 10, in order to derive the relationship between the rotation speed of the impeller 32 and the jet height of the molten solder J and set the jet height to a predetermined target value, the relationship is based on this relationship. And controls the impeller 32. Therefore, the occurrence of defective soldering is suppressed as compared with the case where the number of rotations of the impeller 32 for jetting the molten solder J is always constant.

  Further, in the soldering device 10, the control unit 18 is rotated by the rotation speed of the impeller 32 rotated by one driving force of the motor 34, the jet height at this time, and the other driving force of the motor 34. From the rotational speed of the impeller 32 and the jet height at this time, a proportional relational expression between the rotational speed of the impeller 32 and the jet height is derived. That is, a proportional relational expression between the rotational speed of the impeller 32 and the jet height is derived from the jet heights when the rotational speed of the impeller 32 is set to one value and another value. Therefore, the above-described relational expression is easily derived from the jet heights when the number of rotations of the impeller 32 is set to 3 or more, as compared with the case where the relational expression is derived.

  Further, in the soldering device 10, the control unit 18 is rotated by the rotation speed of the impeller 32 rotating by the minimum driving force of the motor 34, the jet height at this time, and the maximum driving force of the motor 34. From the rotational speed of the impeller 32 and the jet height at this time, a proportional relational expression between the rotational speed of the impeller 32 and the jet height is derived. Therefore, the accuracy of the above-described relational expression is improved as compared with the case where the relational expression is derived by rotating the impeller in the motor 34 with two different driving forces having different intermediate levels. This suppresses the occurrence of defective soldering.

  Further, in the soldering device 10, the control unit 18 controls the impeller 32 to solder the component 220 to the substrate 210 and to solder the component 230 to the substrate 210, and to control the jet flow of the molten solder J. Change the height. Therefore, the occurrence of soldering failure is suppressed as compared with the case where the jet height is not changed even if the components are changed in one board.

  Further, in the soldering device 10, the control unit 18 derives a relational expression between the rotation speed of the impeller 32 and the jet height of the molten solder J for each predetermined operating time. Here, in the soldering apparatus 10, when the amount of the molten solder J inside the storage tank 22 decreases, the jet height of the molten solder J jetted from the nozzle 30 becomes low. Further, as the amount of oxidized solder (dross) increases with the passage of time, the jet height of the molten solder J jetted from the nozzle 30 becomes low. Therefore, in the soldering device 10, the occurrence of soldering failure is suppressed as compared with the case where the impeller is controlled based on only the relational expression derived first.

  Further, in the soldering apparatus 10, the control unit 18 uses the impeller 32 to remove the molten solder J inside the storage tank 22 before re-deriving the relational expression between the rotation speed of the impeller 32 and the jet height of the molten solder J. Allow to stir. By stirring the molten solder J, the concentration distribution of the substance (dross etc.) contained in the molten solder J becomes uniform. Therefore, the accuracy of the above-described relational expression is improved as compared with the case where the relational expression between the rotation speed of the impeller 32 and the jet height is derived again without stirring the molten solder J inside the storage tank 22. .. This suppresses the occurrence of defective soldering.

  In addition, in the method of manufacturing the substrate device, the occurrence of defective soldering is suppressed as compared with the case where the rotation speed of the impeller 32 for jetting the molten solder J is always constant.

<Second Embodiment>
An example of the method for manufacturing the soldering device and the board device according to the second embodiment of the present invention will be described with reference to FIGS. Note that, in the second embodiment, parts different from the first embodiment will be mainly described.

  In the method of manufacturing a board device using the soldering device 110 according to the second embodiment, two types of board devices 280 and 290 are manufactured.

  The board device 280 is manufactured by soldering the component 220 to the board 260, as shown in FIGS. Specifically, the substrate 260 is formed with four through holes 260a having a hole diameter d1 into which the leads 220a of the component 220 are inserted. The component 220 is mounted on the substrate 260 by inserting the lead 220a into the through hole 260a. The outer shape of the substrate 260 is similar to that of the substrate 210 (see FIG. 12).

  The board device 290 is manufactured by soldering the component 230 to the board 270, as shown in FIGS. Specifically, the substrate 270 is formed with six through holes 270a having a hole diameter d2 into which the leads 230a of the component 230 are inserted. The component 230 is mounted on the board 270 by inserting the lead 230a into the through hole 270a. The outer shape of the substrate 270 is the same as the outer shape of the substrate 210.

  Further, as shown in FIG. 15, the control unit 218 is adapted to receive detection signals from the height sensor 14 and the rotation speed sensor 40. Further, the control unit 218 controls the operation of the motor 34, the drive roll 84, and the moving unit 24.

  The control of each unit by the control unit 218 will be described together with the operation described later.

(Action)
Next, a board device manufacturing method for manufacturing the board devices 280 and 290 in order using the soldering apparatus 110 will be described with reference to the flowcharts shown in FIGS. 16, 17, and 18. In the soldering apparatus 110 of the present embodiment, although details will be described later, the number of rotations of the impeller 32 and the jet height of the molten solder J are changed before soldering and every time the type of the manufactured substrate device changes. The relational expressions are to be derived again.

  Further, in the ROM of the control unit 218 of the soldering apparatus 110, the target value of the jet height when the component 220 is soldered to the substrate 260 and the target jet height when the component 230 is soldered to the substrate 270. The value is stored in advance. Further, the ROM of the control unit 218 stores in advance the number of substrate devices 280 to be manufactured first and the number of substrate devices 290 to be manufactured next.

  First, when the soldering device 110 is operated, in step S1100, the control unit 218 rotates the impeller 32 by the minimum driving force output by the motor 34, as in step S100 of the first embodiment, and the high temperature. The height sensor 14 detects the jet height of the molten solder J at this time.

  In step S1200, the control unit 218 rotates the impeller 32 by the maximum driving force output by the motor 34, and the height sensor 14 operates as in step S200 of the first embodiment. At this time, the jet height of the molten solder J is detected.

  In step S1300, the control unit 218 derives the relational expression between the rotation speed of the impeller 32 and the jet height, as in step S300 of the first embodiment.

  In step S1400, as in step S400 of the first embodiment, the control unit 218 determines the component from the relational expression derived in step S1300 and the target value of the jet height read from the ROM of the control unit 218 to the RAM. The rotational speed of the impeller 32 when soldering 220 to the substrate 260 is derived. Further, the control unit 218 derives the driving force of the motor 34 for rotating the impeller 32 at this rotation speed from the rotation speed of the impeller 32 when the component 220 is soldered to the board 260.

  In step S1500, as in step S500 of the first embodiment, the control unit 218 operates the drive roll 84 of the transport unit 16 to cause the substrate 260 to face the nozzle 30 in the vertical direction.

  In step S1600, the control unit 218 moves the nozzle 30 jetting the molten solder J to solder the component 220 to the substrate 260, as in step S600 of the first embodiment. Then, the counter counts the number of manufactured substrate devices 280.

  In step S1700, the controller 218 determines whether the number of manufactured substrate devices 280 has reached a predetermined number, as in step S700 of the first embodiment. If the number of substrate devices 280 has not reached the predetermined number, the process proceeds to step S1500 and the above-described process is executed again. On the other hand, if the number of substrate devices 280 has reached a predetermined number, the process proceeds to step 1800.

  In step 1800, the control unit 218 moves the substrate 260 placed on the transfer unit 86a of the conveyor belt 86 so as not to face the nozzles 30 in the vertical direction, as in step S900 of the first embodiment.

  In step 1900, the control unit 218 rotates the impeller 32 at a rotation speed that does not cause the molten solder J to jet from the nozzle 30 and stirs the molten solder J, as in step S950 of the first embodiment.

  In step 2000, the control unit 218 rotates the impeller 32 by the minimum driving force output by the motor 34, and the height sensor 14 causes the molten solder J at this time to be similar to step S100 of the first embodiment. To detect the jet height.

  In step 2100, the control unit 218 rotates the impeller 32 by the maximum driving force output by the motor 34, and the height sensor 14 operates as in step S200 of the first embodiment. At this time, the jet height of the molten solder J is detected.

  In step S2200, the control unit 218 derives the relational expression between the rotational speed of the impeller 32 and the jet height, as in step S300 of the first embodiment.

  In step S2300, the control unit 218, similar to step S400 of the first embodiment, determines the component from the relational expression derived in step S2200 and the target value of the jet height read from the ROM of the control unit 218 to the RAM. The rotational speed of the impeller 32 when soldering 230 to the substrate 270 is derived. Further, the control unit 218 derives the driving force of the motor 34 for rotating the impeller 32 at this rotation speed from the rotation speed of the impeller 32 when soldering the component 230 to the board 270.

  In step S2400, the control unit 218 operates the drive roll 84 of the transport unit 16 to cause the substrate 270 to face the nozzle 30 in the vertical direction, as in step S500 of the first embodiment.

  In step S2500, the controller 218 moves the nozzle 30 jetting the molten solder J to solder the component 230 to the substrate 270, as in step S600 of the first embodiment. Then, the counter counts the number of manufactured substrate devices 290.

  In step S2600, the controller 218 determines whether the number of manufactured substrate devices 290 has reached a predetermined number, as in step S700 of the first embodiment. If the number of substrate devices 290 has not reached the predetermined number, the process proceeds to step S2400 and the above-described process is executed again. On the other hand, when the number of substrate devices 290 has reached the predetermined number, a series of operations ends.

(Summary)
As described above, in the soldering apparatus 110, the control unit 218 derives the relational expression between the rotation speed of the impeller 32 and the jet height of the molten solder J every time the type of the board device to be manufactured changes. Therefore, compared to the case where the impeller 32 is controlled using the same relational expression even when the type of the board device to be manufactured is changed, a new relational expression is used for each kind of the board device, so that the soldering failure can be prevented. Occurrence is suppressed. The other operations of the second embodiment are similar to the operations of the first embodiment except that they are generated by deriving a relational expression for each predetermined operating time.

  Although the present invention has been described in detail with respect to a specific embodiment, the present invention is not limited to the embodiment, and various other embodiments can be taken within the scope of the present invention. It will be apparent to those skilled in the art. For example, in the above-described embodiment, each of the embodiments has been described using the point flow soldering device, but the present invention is not limited to the point flow soldering device as long as it is a flow soldering device.

  Further, in the above-described embodiment, the relationship between the rotation speed of the impeller 32 and the jet height of the molten solder J is derived, but by deriving the relationship between the rotation speed of the motor 34 and the jet height of the molten solder J, it is indirect. Alternatively, the relationship between the rotation speed of the impeller 32 and the jet height of the molten solder J may be derived.

  Further, although not particularly described in the above embodiment, when the impeller 32 is rotated at the rotation speed derived based on the relational expression, the jet height of the molten solder J becomes an actual target value. You may perform the process of confirming whether or not there is and feeding back.

  In the above embodiment, the relational expression between the rotation speed of the impeller 32 and the jet height of the molten solder J is calculated from the jet heights when the rotation speed of the impeller 32 is set to one value and another value. Although derived, the relational expression may be derived from each jet height when the rotation speed of the impeller 32 is set to 3 or more. In this case, as shown in the graph of FIG. 21, the relationship between the rotational speed of the impeller and the jet height of the molten solder J may be, for example, a quadratic curve.

  Further, in the above-described embodiment, the control unit 18 controls the rotation speed of the impeller 32 rotating by the minimum driving force of the motor 34 and the jet height at this time, and the impeller rotating by the maximum driving force of the motor 34. A proportional relational expression between the rotational speed of the impeller 32 and the jet height is derived from the rotational speed of 32 and the jet height at this time. May be derived. However, in this case, the action achieved by rotating the impeller 32 with the minimum driving force and the maximum driving force of the motor 34 does not occur.

  Although not particularly described in the above embodiment, the relationship between the rotational speed of the impeller and the jet height of the molten solder J may be derived each time the oxidized solder is removed. This is because the amount of the oxidized solder contained in the molten solder J inside the storage tank 22 affects the height of the molten solder J jetted from the nozzle 30.

  Further, in the above-described first embodiment, the relationship between the rotation speed of the impeller and the jet height of the molten solder J is derived for each predetermined operating time. However, the amount of the molten solder J stored in the storage tank 22 is calculated. The relationship between the number of revolutions of the impeller and the jet height of the molten solder J may be derived every time the value decreases by a predetermined amount.

  Further, although not particularly described in the second embodiment, even when the type of the manufactured substrate device is changed during the operation, the number of revolutions of the impeller and the melting are changed at each predetermined operation time. The relationship with the jet height of the solder J may be derived.

  Further, although not particularly described in the second embodiment, even when there are three or more types of substrate devices to be manufactured, the number of revolutions of the impeller and the molten solder are changed every time the type of substrate device is changed. The relationship between J and the jet height may be derived.

10 Soldering device 14 Height sensor (an example of detector)
18 Control unit 30 Nozzle 32 Impeller (an example of a rotating body)
34 Motor (an example of a drive unit)
110 soldering device 210 substrate 218 control unit 220 component 230 component 240 substrate device 260 substrate 270 substrate 280 substrate device 290 substrate device

Claims (8)

A rotating body that jets solder from the nozzle,
A detector for detecting the height of the solder jetted from the nozzle,
Before soldering the components mounted on the board, the height of each of the rotating bodies when the rotating speed is set to a plurality of values is detected by the detecting unit, and the relationship between the rotating speed and the height is detected. And a control unit that controls the rotating body based on the relationship,
Soldering device equipped with.   The control unit causes the detection unit to detect the respective heights when the rotation speed of the rotating body is set to one value and another value, and derives a relational expression between the rotation speed and the height. The soldering device according to claim 1. It is equipped with a drive unit that rotates the rotating body,
The one value is a rotation speed at which the rotating body rotates with the minimum driving force output by the drive unit by the control unit controlling the drive unit,
The soldering device according to claim 2, wherein the other value is a rotation speed at which the control unit controls the drive unit to rotate the rotating body with a maximum drive force output by the drive unit. A plurality of types of the components are mounted on the board,
The said control part is a soldering apparatus as described in any one of Claims 1-3 which controls the said rotary body for every said component, and changes the said height.   The control unit causes the detection unit to detect each of the heights when the rotation speed of the rotating body is set to a plurality of values for each predetermined operation time, and the rotation speed and the height The soldering device according to claim 1, wherein the relationship is derived.   The controller detects the respective heights when the number of rotations of the rotating body is set to a plurality of values each time the type of the board device manufactured by soldering the components to the board changes. The soldering device according to any one of claims 1 to 4, wherein the soldering device is detected by a section to derive the relationship between the rotation speed and the height. Equipped with a storage tank where solder is stored,
The soldering according to claim 5 or 6, wherein the controller causes the rotating body to agitate the solder stored in the storage tank before the controller again derives the relationship between the rotation speed and the height. apparatus.   A board device manufacturing method for manufacturing a board device in which components are soldered to a board by the soldering device according to any one of claims 1 to 7.