KR20070010565A - Soldering device for automatic soldering machine - Google Patents

Abstract

A soldering device for an automatic soldering machine, which prevents oxidation and erosion of a soldering tank contacted with a solder and a nozzle part for jetting the solder due to the solder, and which is not deformed or damaged in an application atmosphere of a lead-free solder having a high melting point, is provided. A soldering device for an automatic soldering machine comprises: a soldering tank made of titanium to melt and store a solder for soldering a printed circuit board; a first soldering part(120) which has a nozzle plate(124) formed on an upper portion thereof, and is installed within the soldering tank, wherein a plurality of jet holes(122) are formed on the nozzle plate; a second soldering part(130) which has a rectifying plate(134) formed therein, and is installed in rear of the first soldering part, wherein a plurality of through holes(132) are formed in the rectifying plate; an impeller(140) which comprises a plurality of transfer vanes(144) formed between a pair of disks(142), and which is installed at one side of the first and second soldering parts, and is rotated by a drive motor to transfer a solder within the soldering tank toward the first and second soldering parts; and a guide(150) for covering an outer side of the impeller to guide a solder transferred by the impeller to the first and second soldering parts respectively.

Description

Soldering device for automatic soldering machine {Soldering device for automatic soldering machine}

1 is a schematic cross-sectional view showing the configuration of an automatic soldering machine;

2 is a perspective view of a soldering apparatus for an automatic soldering machine of the present invention;

3 is an exploded perspective view of a soldering apparatus for an automatic soldering machine of the present invention;

Figure 4 is a cross-sectional view of the coupling device of the present invention soldering machine;

5 is a cross-sectional view taken along the line A-A of FIG.

FIG. 6 is a cross-sectional view taken along the line B-B in FIG. 3.

※ Explanation of code for main part of drawing

110: soldering tank 120: first soldering portion 122: ejection hole

124: nozzle plate 130: second soldering portion 132: through hole

134: rectifier plate 140: impeller 144: feed wing

150: Guide

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for an automatic soldering machine, and more particularly, to a soldering apparatus for an automatic soldering machine which prevents the solder tank contacting the solder and the nozzle portion ejecting the solder from being eroded by the solder.

In general, printed circuit boards used in various electronic devices are mounted in accordance with the characteristics of the electronic device and soldered by an automatic soldering device.

As shown in Fig. 1, the automatic soldering apparatus includes a flux treatment device 1 comprising a fluxer 1, a heater 2, and a solder bath 3, and a conveyor 4, which is a conveying device, on the upper part of the solder processing device. Is installed.

The soldering of the printed circuit board by the automatic soldering apparatus will be described briefly. First, when the printed circuit board is fixed to a conveyor and travels on the soldering apparatus, the printed circuit board is first fluxed to the soldered surface by a fluxer. ) Is applied.

Next, the flux-coated printed circuit board is preheated by a heater. If the flux remains on the printed circuit board, there is a risk that the molten solder will be scattered in the next contact process with the molten solder. If the printed circuit board is in contact with the high temperature fusion solder, the printed circuit board or the chip components mounted on the printed circuit board may cause thermal shock, and may be damaged. If the printed circuit board at room temperature is in contact with the molten solder, the temperature of the molten solder is lowered and soldered. Since the property may be degraded, the heater is preheated.

The printed circuit board preheated by the heater is transferred to a solder bath and subjected to soldering by contact of molten solder.

The solder tank of the automatic soldering apparatus is provided with a primary nozzle and a secondary nozzle, and the printed circuit board is continuously contacted with the primary nozzle and the secondary nozzle to perform soldering. The primary nozzle has a small diameter spherical hole formed therein, and the ejection of molten solder is ejected in the form of an inclined wave, where the molten solder is hard to penetrate, and the edges of the chip component and the printed circuit board or the leads and through holes of the electronic component. It penetrates into the gap between the through hole and performs soldering.

In addition, the secondary nozzle is formed with a wide nozzle, the ejection of the molten solder is not roughly ejected in the form of a gentle wave so that the bridge or icicle generated in the primary nozzle is removed by contacting the gentle wave of the secondary nozzle The printed circuit board is in a clean soldered state.

However, the parts of the solder tank for melting / storing the solder for the automatic soldering and the parts such as the impeller and the nozzle, which are installed in the solder tank and are in contact with the molten solder, are oxidized and eroded by the chemical reaction with the solder, thereby shortening the lifespan. Problems arise.

On the other hand, until now, to lower the melting point of the soldering solder (Solder) by containing lead (Pb) by melting the solder in the solder tank at a temperature of about 200 ℃ ~ 300 ℃, but recently used environmentally-friendly policy (Pb Free), Sn 100%, Sn-Cu, Sn-Bi, Sn-Ag, Sn-Ag-Cu, and various Pb-free solders are coming out.

However, these lead-free solders are melted at a temperature of about 250 ° C to 500 ° C without the use of lead, and are melted at temperatures of about 250 ° C to 500 ° C. This results in the problem that each part in contact with the solder is deformed or broken by continuous thermal stress.

SUMMARY OF THE INVENTION An object of the present invention is to provide a soldering apparatus for an automatic soldering machine which is designed to solve the above problems and prevents the solder bath contacting the solder and the nozzle portion ejecting the solder from being oxidized and eroded by the solder.

It is also an object of the present invention to provide a soldering apparatus for an automatic soldering machine that does not deform or break in the use environment of a lead-free solder having a high melting point.

A soldering apparatus for an automatic soldering machine of the present invention for achieving the above object is a soldering apparatus for a soldering apparatus, comprising: a solder tank made of titanium for melting / storing solder for soldering a printed circuit board; and forming a plurality of ejection holes. A first soldering portion formed at an upper end of the nozzle plate and installed in the solder tank; and a second soldering portion formed behind the first soldering portion by forming a rectifying plate having a plurality of through holes therein; An impeller installed on one side of each of the first and second solder parts in a state in which a plurality of transfer blades are formed therebetween to move the solder in the solder tank toward the first and second solder parts while being rotated by a driving motor; And a guide for guiding the solder transferred by the impeller to the first and second solder portions, respectively, with the outer side of the impeller wrapped.

Preferably, the first and second solder parts, impellers and guides which come into contact with solder in the solder bath of the soldering apparatus for automatic soldering machines of the present invention are made of titanium.

Best Mode for Carrying Out the Invention Preferred embodiments of the soldering apparatus for automatic soldering of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view of a soldering apparatus for an automatic soldering machine of the present invention, and FIG. 3 is an exploded perspective view of the soldering apparatus for an automatic soldering machine of the present invention.

The soldering apparatus for automatic soldering of the present invention as shown in the figure is largely composed of a lead bath 110, first and second soldering portions 120 and 130, an impeller 140, and a guide 150.

The lead bath 110 has a rectangular cylindrical shape having an upper side open to accommodate solder for soldering a printed circuit board, and has corrosion resistance and durability to prevent oxidation and erosion by chemical reaction with solder contained therein. Made of excellent titanium.

The first soldering part 120 is installed in the lead bath 110 by forming a nozzle plate 124 having a plurality of blow holes 122 formed thereon.

The second soldering portion 130 forms a rectifying plate 134 having a plurality of through holes 132 therein, and is installed at the rear of the first soldering portion in the transfer direction of the printed circuit board B.

The impeller 140 forms a plurality of transfer blades 144 between the pair of disks 142 to transfer the solder in the solder tank 110 toward the first and second solder portions 120 and 130 while being rotated by the drive motor. And one side of the first and second solder parts 120 and 130, respectively.

The guide 150 is fixed to the side surfaces of the first and second solder parts 120 and 130 by forming an inlet 152 and a transfer passage 154 through which solder is introduced to surround the outside of the impeller 140.

Here, the first and second lead solder parts 120 and 130, and the impeller 140 and the guide 150, which are installed in the solder tank 110 and come into contact with the solder, are chemically reacted with the solder like the solder tank 110. It is made of titanium to prevent oxidation and erosion.

Hereinafter, the operation of the soldering apparatus for automatic soldering machine of the present invention having the above configuration will be described.

4 is a cross-sectional view of a coupling device of the soldering apparatus for an automatic soldering machine of the present invention. FIG. 5 is a cross-sectional view taken along the line A-A of FIG. 4, and FIG. 5 is a cross-sectional view taken along the line B-B of FIG.

As shown in the drawing, in the soldering apparatus for automatic soldering machine of the present invention, the bottom surface of the printed circuit board B is brought into contact with the solder S in the rough state sorted by the first soldering portion 120. The first soldering part 120 and the second soldering part are soldered by contacting with a gentle solder S classified in the second soldering part 130. The soldering unit 130 is installed.

In addition, an impeller 140 rotating by the driving motor M is installed at one side of the first soldering part 120 and the second soldering part 130, respectively, and the impeller 140 and the first and second soldering parts are installed. Between the parts 120 and 130, guides 150 are installed to allow the solder S transferred by the impeller 140 to be transferred into the first and second solder parts 120 and 1300, respectively.

First, referring to the first soldering part 120, when the impeller 140 is rotated by the driving motor M, the inlet hole of the guide 150 is formed by a plurality of transfer blades 144 disposed between the pair of discs 142. The solder S introduced through the 152 is transferred along the transfer path 154. And the printed circuit is conveyed by the conveyor (C) from the upper side of the solder tank 110 while being ejected by a predetermined height to the ejection hole 122 of the nozzle plate 124 fixed to the upper end of the first soldering portion 120 by the transfer pressure The solder S comes into contact with the bottom surface of the substrate B to perform primary soldering.

In addition, in the second soldering portion 130 provided at the rear of the first soldering portion 120, the impeller 140 installed at one side of the second soldering portion 130 and rotated by the driving motor M is rotated. Solder (S) introduced into the inlet 152 is transferred along the transfer passage 154 of the guide 150 into the second soldering portion 130, at this time, fixed to the inner center of the second soldering portion 130 Various foreign substances are filtered while passing through the through hole 132 of the rectifying plate 134. In addition, the solder S filtered by the rectifying plate 134 is ejected by a predetermined height to the upper side of the second soldering part 130 by a transfer pressure, and thus the primary solder in the rough state made in the first soldering part 120 is formed. By contacting the parts, bad solder such as bridges or icicles formed during the primary soldering process is removed, and a clean soldering state is obtained.

Thus, the solder tank 110 for melting / storing solder for soldering, the impeller 140 installed in the solder tank 110 to transfer the solder S, and the transferred solder S are ejected upward by the transfer pressure. Transfer the solder S by connecting the first and second solder parts 120 and 130 and the impeller 140 and the first and second solder parts 120 and 130, respectively, to be brought into contact with the bottom surface of the printed circuit board B. By configuring the guide 150 to guide the titanium material to improve the strength of the product, titanium does not cause a chemical reaction with the solder to prevent oxidation and erosion by the solder (S) not only improves durability and corrosion resistance Because titanium resists high temperature thermal stress caused by the use of lead-free solders, titanium can effectively cope with the use environment of lead-free solders.

In addition, since the parts in contact with the solder (S) is made of titanium material, the solder is not applied to the surface, which is used because the contact force between titanium and lead is very weak and is not used as a lead solder base material. Since the lead is not applied around the nozzle and the ejection hole by the material, the resistance during the ejection of the solder is greatly reduced.

Soldering apparatus for the automatic soldering machine of the present invention as described above is composed of titanium in the solder tank in which the solder is stored and each part in contact with the solder in the solder tank extends the durability and life of the soldering device, so it can withstand high temperature environment There is an effect that it can appropriately cope with the use of the solder solder.

Claims (2)

In the soldering apparatus for a soldering apparatus, A lead bath 110 made of titanium for melting / storing solder for soldering a printed circuit board; A first soldering part 120 formed at an upper end of the nozzle plate 124 having a plurality of ejection holes 122 formed therein; A second soldering part 130 formed at a rear of the first soldering part 120 by forming a rectifying plate 134 having a plurality of through holes 132 therein; A plurality of transfer blades 144 are formed between the pair of disks 142, respectively, on one side of the first and second solder portions 130 and rotated by a driving motor to rotate the solder in the solder tank 110. An impeller 140 which is transferred toward the first and second solder parts 120 and 130; And, Soldering apparatus for an automatic soldering machine including a guide (150) for guiding the solder conveyed by the impeller 140 to the first and second solder parts (120,130), respectively, with the outer side of the impeller (140) wrapped. The method of claim 1, The soldering apparatus for the automatic soldering machine, characterized in that the first and second soldering parts (120,130), the impeller (140) and the guide (150) which are in contact with the solder in the solder tank (110) are made of titanium.

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