DE60045489D1 - DMOS-Transistor mit einer Graben-Gateelektrode und Verfahren zu dessen Herstellung - Google Patents
DMOS-Transistor mit einer Graben-Gateelektrode und Verfahren zu dessen HerstellungInfo
- Publication number
- DE60045489D1 DE60045489D1 DE60045489T DE60045489T DE60045489D1 DE 60045489 D1 DE60045489 D1 DE 60045489D1 DE 60045489 T DE60045489 T DE 60045489T DE 60045489 T DE60045489 T DE 60045489T DE 60045489 D1 DE60045489 D1 DE 60045489D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- gate electrode
- trench gate
- dmos transistor
- dmos
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/395,790 US6518621B1 (en) | 1999-09-14 | 1999-09-14 | Trench DMOS transistor having reduced punch-through |
PCT/US2000/024737 WO2001020656A2 (en) | 1999-09-14 | 2000-09-11 | Dmos transistor having a trench gate electrode and method of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60045489D1 true DE60045489D1 (de) | 2011-02-17 |
Family
ID=23564519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60045489T Expired - Lifetime DE60045489D1 (de) | 1999-09-14 | 2000-09-11 | DMOS-Transistor mit einer Graben-Gateelektrode und Verfahren zu dessen Herstellung |
Country Status (9)
Country | Link |
---|---|
US (2) | US6518621B1 (de) |
EP (1) | EP1230675B1 (de) |
JP (1) | JP5122711B2 (de) |
KR (1) | KR100687302B1 (de) |
CN (1) | CN1183583C (de) |
AU (1) | AU7128300A (de) |
DE (1) | DE60045489D1 (de) |
TW (1) | TW466646B (de) |
WO (1) | WO2001020656A2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6518621B1 (en) * | 1999-09-14 | 2003-02-11 | General Semiconductor, Inc. | Trench DMOS transistor having reduced punch-through |
US6376315B1 (en) * | 2000-03-31 | 2002-04-23 | General Semiconductor, Inc. | Method of forming a trench DMOS having reduced threshold voltage |
JP4932088B2 (ja) * | 2001-02-19 | 2012-05-16 | ルネサスエレクトロニクス株式会社 | 絶縁ゲート型半導体装置の製造方法 |
US6657256B2 (en) * | 2001-05-22 | 2003-12-02 | General Semiconductor, Inc. | Trench DMOS transistor having a zener diode for protection from electro-static discharge |
US6781196B2 (en) * | 2002-03-11 | 2004-08-24 | General Semiconductor, Inc. | Trench DMOS transistor having improved trench structure |
US6838722B2 (en) | 2002-03-22 | 2005-01-04 | Siliconix Incorporated | Structures of and methods of fabricating trench-gated MIS devices |
DE10239312B4 (de) * | 2002-08-27 | 2006-08-17 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauelements mit einer Driftzone und einer Feldstoppzone und Halbleiterbauelement mit einer Driftzone und einer Feldstoppzone |
KR20050085461A (ko) * | 2002-12-10 | 2005-08-29 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 다운 컨버터 및 전기 부하 스위칭 방법 |
JP3703816B2 (ja) * | 2003-06-18 | 2005-10-05 | 株式会社東芝 | 半導体装置 |
CN100334740C (zh) * | 2003-08-26 | 2007-08-29 | 茂德科技股份有限公司 | 功率金属氧化物半导体场效应晶体管的制造方法 |
JP4913336B2 (ja) * | 2004-09-28 | 2012-04-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US20060071270A1 (en) | 2004-09-29 | 2006-04-06 | Shibib Muhammed A | Metal-oxide-semiconductor device having trenched diffusion region and method of forming same |
KR101142104B1 (ko) | 2006-02-23 | 2012-05-03 | 비쉐이-실리코닉스 | 단채널 트렌치 mosfet 및 디바이스를 형성하는 공정 |
US8105903B2 (en) * | 2009-09-21 | 2012-01-31 | Force Mos Technology Co., Ltd. | Method for making a trench MOSFET with shallow trench structures |
US9425305B2 (en) | 2009-10-20 | 2016-08-23 | Vishay-Siliconix | Structures of and methods of fabricating split gate MIS devices |
US9419129B2 (en) | 2009-10-21 | 2016-08-16 | Vishay-Siliconix | Split gate semiconductor device with curved gate oxide profile |
KR101728363B1 (ko) | 2010-03-02 | 2017-05-02 | 비쉐이-실리코닉스 | 듀얼 게이트 디바이스의 구조 및 제조 방법 |
KR20130044118A (ko) * | 2010-08-06 | 2013-05-02 | 파나소닉 주식회사 | 유기 el 표시 패널, 표시 장치, 및 유기 el 표시 패널의 제조 방법 |
CN102742357A (zh) | 2010-08-06 | 2012-10-17 | 松下电器产业株式会社 | 有机el显示面板、显示装置以及有机el显示面板的制造方法 |
US20120080748A1 (en) * | 2010-09-30 | 2012-04-05 | Force Mos Technology Co., Ltd. | Trench mosfet with super pinch-off regions |
JP5738653B2 (ja) * | 2011-03-31 | 2015-06-24 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 絶縁ゲート型半導体装置 |
CN107482054B (zh) | 2011-05-18 | 2021-07-20 | 威世硅尼克斯公司 | 半导体器件 |
US9293376B2 (en) * | 2012-07-11 | 2016-03-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for power MOS transistor |
CN104733524A (zh) * | 2013-12-19 | 2015-06-24 | 比亚迪股份有限公司 | Mosfet功率器件及其形成方法 |
US10234486B2 (en) | 2014-08-19 | 2019-03-19 | Vishay/Siliconix | Vertical sense devices in vertical trench MOSFET |
CN105702736B (zh) * | 2016-01-29 | 2019-10-11 | 上海华虹宏力半导体制造有限公司 | 屏蔽栅-深沟槽mosfet的屏蔽栅氧化层及其形成方法 |
US10573722B2 (en) * | 2016-02-17 | 2020-02-25 | General Electric Company | Systems and methods for in-situ doped semiconductor gate electrodes for wide bandgap semiconductor power devices |
DE102018107568B4 (de) * | 2018-03-29 | 2021-01-07 | Infineon Technologies Ag | Leistungshalbleitertransistor, sowie Verfahren zur Verarbeitung eines Leistungshalbleitertransistors |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4583105A (en) * | 1982-12-30 | 1986-04-15 | International Business Machines Corporation | Double heterojunction FET with ohmic semiconductor gate and controllable low threshold voltage |
JPS61190981A (ja) | 1985-02-20 | 1986-08-25 | Casio Comput Co Ltd | 半導体装置 |
US5072266A (en) | 1988-12-27 | 1991-12-10 | Siliconix Incorporated | Trench DMOS power transistor with field-shaping body profile and three-dimensional geometry |
JPH05335585A (ja) * | 1992-06-03 | 1993-12-17 | Fuji Electric Co Ltd | 絶縁ゲート型電力用半導体素子の製造方法 |
US5410170A (en) | 1993-04-14 | 1995-04-25 | Siliconix Incorporated | DMOS power transistors with reduced number of contacts using integrated body-source connections |
JP3400846B2 (ja) | 1994-01-20 | 2003-04-28 | 三菱電機株式会社 | トレンチ構造を有する半導体装置およびその製造方法 |
US5468982A (en) | 1994-06-03 | 1995-11-21 | Siliconix Incorporated | Trenched DMOS transistor with channel block at cell trench corners |
JP3531291B2 (ja) * | 1994-06-23 | 2004-05-24 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
US5810417A (en) * | 1995-09-28 | 1998-09-22 | Mongkol Jesadanont | Automatic safety car seats and sheet-type safety-belt |
US5854501A (en) * | 1995-11-20 | 1998-12-29 | Micron Technology, Inc. | Floating gate semiconductor device having a portion formed with a recess |
JPH09260650A (ja) * | 1996-03-22 | 1997-10-03 | Fuji Electric Co Ltd | 炭化ケイ素トレンチfetおよびその製造方法 |
JP3150064B2 (ja) * | 1996-06-27 | 2001-03-26 | 日本電気株式会社 | 縦型電界効果トランジスタの製法 |
KR100218260B1 (ko) * | 1997-01-14 | 1999-09-01 | 김덕중 | 트랜치 게이트형 모스트랜지스터의 제조방법 |
US6057558A (en) * | 1997-03-05 | 2000-05-02 | Denson Corporation | Silicon carbide semiconductor device and manufacturing method thereof |
US5885877A (en) * | 1997-04-21 | 1999-03-23 | Advanced Micro Devices, Inc. | Composite gate electrode incorporating dopant diffusion-retarding barrier layer adjacent to underlying gate dielectric |
JP3976374B2 (ja) * | 1997-07-11 | 2007-09-19 | 三菱電機株式会社 | トレンチmosゲート構造を有する半導体装置及びその製造方法 |
US6518621B1 (en) * | 1999-09-14 | 2003-02-11 | General Semiconductor, Inc. | Trench DMOS transistor having reduced punch-through |
US6312993B1 (en) * | 2000-02-29 | 2001-11-06 | General Semiconductor, Inc. | High speed trench DMOS |
-
1999
- 1999-09-14 US US09/395,790 patent/US6518621B1/en not_active Expired - Lifetime
-
2000
- 2000-09-05 TW TW089118154A patent/TW466646B/zh not_active IP Right Cessation
- 2000-09-11 KR KR1020027003312A patent/KR100687302B1/ko not_active IP Right Cessation
- 2000-09-11 WO PCT/US2000/024737 patent/WO2001020656A2/en active Application Filing
- 2000-09-11 CN CNB008128111A patent/CN1183583C/zh not_active Expired - Fee Related
- 2000-09-11 EP EP00960063A patent/EP1230675B1/de not_active Expired - Lifetime
- 2000-09-11 JP JP2001524139A patent/JP5122711B2/ja not_active Expired - Fee Related
- 2000-09-11 DE DE60045489T patent/DE60045489D1/de not_active Expired - Lifetime
- 2000-09-11 AU AU71283/00A patent/AU7128300A/en not_active Abandoned
-
2001
- 2001-03-02 US US09/798,451 patent/US6545315B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW466646B (en) | 2001-12-01 |
JP2004514265A (ja) | 2004-05-13 |
WO2001020656A3 (en) | 2002-01-31 |
CN1384973A (zh) | 2002-12-11 |
EP1230675A1 (de) | 2002-08-14 |
US6518621B1 (en) | 2003-02-11 |
CN1183583C (zh) | 2005-01-05 |
US20010008788A1 (en) | 2001-07-19 |
JP5122711B2 (ja) | 2013-01-16 |
KR20020035139A (ko) | 2002-05-09 |
EP1230675B1 (de) | 2011-01-05 |
WO2001020656A9 (en) | 2002-09-26 |
KR100687302B1 (ko) | 2007-02-27 |
AU7128300A (en) | 2001-04-17 |
WO2001020656A2 (en) | 2001-03-22 |
US6545315B2 (en) | 2003-04-08 |
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